Quotables
"Transmission of documents via telephone wires is possible in principle, but the apparatus required is so expensive that it will never become a practical proposition."
Dennis Gabor, British physicist
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7315449 | Apparatus for supporting a heatsink Described is an apparatus for use supporting a heatsink thermally coupled to an integrated circuit component disposed on a first side of a circuit board. The heatsink has an opening that is aligned with an opening of the circuit board. The apparatus includes a suppo... | 01/01/2008 |
| 7312525 | Thermally enhanced package for an integrated circuit A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channe... | 12/25/2007 |
| 7313001 | Electrical switch having a mount for an electrical circuit The invention relates to an electrical circuit arrangement (3) having electrical and/or electronic components (4). The components (4) are arranged on a mount substrate (5). The conductor tracks (6) for electrical connection of the ... | 12/25/2007 |
| 7312988 | Electronic device An electronic device includes: a body 12 having an electronic component 20, and a cover 14 pivotally attached to the body and having a liquid crystal panel 36. The electronic component of the body is cooled by a fan 22. The liquid ... | 12/25/2007 |
| 7312994 | Heat dissipation device with a heat pipe A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat si... | 12/25/2007 |
| 7312998 | Heat radiating apparatus in electronic device and heat radiating method According to one embodiment, a heat radiating apparatus comprises a shielding case having holding panels thereof arranged at locations substantially opposite to a circuit component to extend from a flat panel of the shielding case, which extends substantially parall... | 12/25/2007 |
| 7309918 | Chip package structure This invention relates to a chip package structure comprising of a chip, multiple leads with inner and outer ends, an exposed chip upper surface, an encapsulated body encloses the peripherals of the chip, and multiple conducting wires used to connect electrically th... | 12/18/2007 |
| 7310229 | Heat dissipating device A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a sprin... | 12/18/2007 |
| 7307845 | Multiple integrated circuit package module A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A c... | 12/11/2007 |
| 7307842 | Heat sink assembly having retaining device with relatively better heat dissipation effectiveness The proposed heat sink assembly mounted on a heat source includes a heat sink including a base with a top surface and a plurality of fins, and a retaining device including a frame with a top, a hole with a size larger than that of the base, an elastic rod connected ... | 12/11/2007 |
| 7304847 | Heat sink A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved s... | 12/04/2007 |
| 7304850 | Mounting apparatus for securing heat dissipation module to circuit board A mounting apparatus is provided for securing a heat dissipation module to a circuit board. A chip socket is placed on a top surface of the circuit board. The mounting apparatus comprises a plurality of posts detachably attached to the circuit board adjacent the chi... | 12/04/2007 |
| 7304851 | Heat sink and its fabrication method A heat sink is disclosed to include a plurality of metal plate members arranged in a stack, each metal plate member having a rectangular body, a first sidewall and a second sidewall at two sides of the rectangular body, a T-shaped mounting hole in the rectangular bo... | 12/04/2007 |
| 7304845 | Heat sink assembly A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardl... | 12/04/2007 |
| 7300203 | Non-contacting sensor multichip module with integral heat-sinks A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and ... | 11/27/2007 |
| 7301770 | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally ... | 11/27/2007 |
| 7301769 | Fan holder A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending... | 11/27/2007 |
| 7298615 | Computing device A media centre computing device includes a housing, and a mains-powered personal computer motherboard including a main processor with a heatsink disposed at or near to one edge of the motherboard and connectors disposed at an adjacent edge of the motherboard, the mo... | 11/20/2007 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7295437 | Heat dissipation device for multiple heat-generating components A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (... | 11/13/2007 |
| 7295439 | Heat sink fastening assembly A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pres... | 11/13/2007 |
| 7292444 | Heat sink fastener A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are ... | 11/06/2007 |
| 7292445 | Active integrated rectifier regulator An active integrated rectifier and regulator module for providing charging current to a battery of an automobile including a stacked structure comprising two lead frames disposed above on another, the module including a voltage regulator and elements for active rect... | 11/06/2007 |
| 7289322 | Heat sink A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin pla... | 10/30/2007 |
| 7289330 | Heat sink assembly having a fan mounting device A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaini... | 10/30/2007 |
| 7287879 | Thermal module and backlight system using the same A thermal module includes a plurality of heat dissipation units. Each of the heat dissipation units includes a main portion, a head portion, and a neck portion interconnecting the main portion and the head portion. Each main portion includes a base, a plurality of f... | 10/30/2007 |
| 7288733 | Keyboard apparatus A keyboard apparatus has a base component arranged under key switches. The base component has an embossed portion. A cooling material is filled into the embossed portion. The embossed portion may be formed continuously between the key switches along the length of ke... | 10/30/2007 |
| 7286358 | Surface mounted resistor with improved thermal resistance characteristics A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodime... | 10/23/2007 |
| 7286371 | Attaching heat sinks to printed circuit boards using preloaded spring assemblies An integrated circuit assembly including a heat sink, a socket, a printed circuit board and a chassis to be held together under spring bias. The assembly may be secured together with less than 2 mm spanning between a printed circuit board and a chassis. ... | 10/23/2007 |
| 7286362 | Heat dissipating apparatus A heat dissipating apparatus includes a retention module (20) forming clipping portions (26) thereon, a heat sink (10) mounted to the retention module, and a clip (30) engaged with the retention module and the heat sink. The clip includes... | 10/23/2007 |
| 7286363 | Heat dissipation device A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first si... | 10/23/2007 |
| 7280362 | Method and apparatus for attaching a processor and corresponding heat sink to a circuit board An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the frame member, and a resilient load member. The resilient load member h... | 10/09/2007 |
| 7280360 | Socket adapted for compressive loading A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isol... | 10/09/2007 |
| 7277292 | Expandable bracing apparatus and method A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing... | 10/02/2007 |
| 7277291 | Thermal transfer device A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an... | 10/02/2007 |
| 7277290 | Secure device for a heat dissipating component A secure device for a heat dissipating component provides a base body with a plurality of engaging members attached to two lateral sides thereof. Each of the engaging members further has a secure part and a follower part for clamping the heat dissipating component. | 10/02/2007 |
| 7277282 | Integrated circuit cooling system including heat pipes and external heat sink An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the h... | 10/02/2007 |
| 7277288 | Heat sink assembly with retention module and clip A heat sink assembly of the present invention includes a printed circuit board (10), a retention module (20), four pins (30), a heat sink (40) and a clip (50). The printed circuit board (10) has an electronic package (100... | 10/02/2007 |
| 7268292 | Multi-dimensional compliant thermal cap for an electronic device A cooling structure for an electronic device comprises a plate including a thermally conducting material disposed over the electronic device. The cooling structure includes a first support and a second support. One of the first support and the second support provide... | 09/11/2007 |
| 7269010 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on tw... | 09/11/2007 |
