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| Number | Title | Issue Date |
| 7362581 | Heat sink fixing device A heat sink fixing device has an enclosing frame socket having a central part for disposing a heat generating unit of an electronic device thereon, with a heat sink mounted on the enclosing frame socket and covering the heat generating unit. A first fixing part is p... | 04/22/2008 |
| 7362113 | Universal wafer carrier for wafer level die burn-in A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wa... | 04/22/2008 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is form... | 04/22/2008 |
| 7360586 | Wrap around heat sink apparatus and method A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In t... | 04/22/2008 |
| 7362573 | Heat dissipation device A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for contacting a heat generating device. A locking device includes a locki... | 04/22/2008 |
| 7358605 | Heat dissipation structure for electronic device A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside... | 04/15/2008 |
| 7359195 | Heatsink Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end contacting a heat source to absorb heat from the heat source and a heat-... | 04/15/2008 |
| 7357173 | Cooling device for a chip and method for its production The invention relates to a cooling device for a chip, in particular a processor, embodied with a number of projections or fins standing essentially normal on a base surface facing away from the chip and which may be fixed to the chip by the base surface on the side ... | 04/15/2008 |
| 7355856 | Method and apparatus for increasing natural convection efficiency in long heat sinks An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a diverter extending from the heat dissipation surface. The diverter disru... | 04/08/2008 |
| 7352585 | Flip chip heat sink package and method An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first... | 04/01/2008 |
| 7352147 | Power supply to provide operation power for cooling fans A power supply to provide operation power for cooling fans includes a non-stop power system to provide DC power in normal conditions to a remote switch control circuit to set a computer in an ON or OFF condition. The non-stop power system also outputs the DC power t... | 04/01/2008 |
| 7349212 | Heat dissipation device A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink f... | 03/25/2008 |
| 7349217 | IC socket assembly The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit b... | 03/25/2008 |
| 7349214 | Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of... | 03/25/2008 |
| 7349220 | Memory module assembly A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping th... | 03/25/2008 |
| 7345879 | Heat dissipation device A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a bas... | 03/18/2008 |
| 7345882 | Semiconductor module with heat sink and method thereof A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a... | 03/18/2008 |
| 7342796 | Captive shoulder nut assembly A captive shoulder nut assembly, to hold a heat sink onto a PC board, has a nut member with a threaded portion and a tubular portion extending therefrom. The nut member mates with an upstanding threaded stud. A biasing compression spring rides over the nut with an e... | 03/11/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads... | 03/04/2008 |
| 7339790 | Halogen lamps with mains-to-low voltage drivers A halogen lamp includes a mains base and a converter operably connected to the mains base. The converter has a lamp socket, a toroid transformer, and a heat sink disposed within a center opening of the toroid transformer. A lamp is removably disposed in the lamp soc... | 03/04/2008 |
| 7336492 | Heat dissipating apparatus A heat dissipating apparatus (10) for dissipating heat from a heat-generating electronic component includes a heat sink (14), a resilient clipping member (162), and an operating member (164). The heat sink contacts with the heat-generatin... | 02/26/2008 |
| 7336477 | Electrical switching apparatus and heat sink therefor A heat sink is for an integrally fused low-voltage power air circuit breaker including a line terminal and electrical bus work coupled to a current limiter. The line terminal, electrical bus work, and current limiter contribute to the formation of a thermal dam. The... | 02/26/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7336495 | Power component cooling device with a heat sink and one or more cooling fins Where power components are fixed on a heat sink 1 inclusive of a heat sink base 1b and cooling fins 1a provided on the heat sink base 1b, one 1c of the cooling fins, which is made thicker, is arranged up... | 02/26/2008 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of t... | 02/19/2008 |
| 7331720 | Transceiver module for optical communications and method for transmitting and receiving data A transceiver module for optical communications is provided in which the leadframe assembly includes at least first and second die attach regions to which the laser diode driver IC and the laser diode IC are secured, respectively. A slot formed in the leadframe betw... | 02/19/2008 |
| 7333339 | Heat dissipation system for a miniaturized form factor communications card A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile informat... | 02/19/2008 |
| 7333336 | Heat radiating apparatus A heat radiating apparatus is provided which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat pipe having a portion connected to the heat sink and configured to trans... | 02/19/2008 |
| 7327577 | Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes the... | 02/05/2008 |
| 7327574 | Heatsink module for electronic device A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The re... | 02/05/2008 |
| 7327571 | Thermal load balancing systems and methods Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat si... | 02/05/2008 |
| 7327575 | Locking device for heat sink A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) definin... | 02/05/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7324342 | Electronics assembly and electronics package carrier therefor An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly al... | 01/29/2008 |
| 7321491 | Heat sink for a portable computer A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portab... | 01/22/2008 |
| 7321492 | Heat sink module for an electronic device Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate an... | 01/22/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7317618 | Combined board level shielding and thermal management An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical compon... | 01/08/2008 |
| 7315450 | Heat-generating component cooling structure A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of ... | 01/01/2008 |
