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Class 361/709 - Heat sink


Subclass of Class 361 - Electricity: electrical systems and devices
Definition: Subject matter wherein the support means is connected to
No. of patents: 855
Last issue date: 05/08/2012


                    22  
NumberTitleIssue Date
4167031Heat dissipating assembly for semiconductor devices
A heat conducting and radiating arrangement for an electronic assembly, which includes heat generating semiconductor devices, comprises a thermally conductive holder member 20 for the semiconductor device 13 which is conveniently clamped to a large area, ...
09/04/1979
4117257Temperature sensor holding device
A temperature sensor holding device for electronic apparatus includes a plate member having an aperture for receiving a heat generating semi-conductor and formed for attachment to a heat sink, a spacer member fastened to the plate member and formed to tel...
09/26/1978
4115838Packaging of a semiconductor
A solid state electrical component is packaged within a housing and after connection to a terminal board is potted by an encapsulating medium. The solid state electrical component includes a chip area and a plurality of terminals connected to the chip. Th...
09/19/1978
4109294Mounting enclosure for key telephone unit circuit sections
A front extrusion having a generally U-shape provides top and bottom walls for the enclosure with a front wall extending therebetween. Integral extruded flanges are formed on the outer surfaces of the top and bottom walls and fastener channels are extrude...
08/22/1978
4104700Heat pipe cooling for semiconductor device packaging system
A system for cooling high density integrated circuits for computer systems comprising a cooling frame having a plurality of the heat pipes spanning the space within the frame to which sub-islands are attached to form an island. Each sub-island comprises a...
08/01/1978
4082407Terminal block with encapsulated heat sink
A printed circuit panel connector comprises an encased heat sink for maintaining all electrical connections to the connector at substantially the same temperature. The heat sink is disposed between a plurality of tubular electrical connector elements adap...
04/04/1978
4047242Compact electronic control and power unit structure
To reduce the overall size of the housing of an electronic control unit having power stages of substantial power, and hence high heat dissipation, in combination with its associated control stage having but little power and hence low heat dissipation, a p...
09/06/1977
4047198Transistor cooling by heat pipes having a wick of dielectric powder
A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure....
09/06/1977
4039900Plug in regulating power supply
A plug in power supply incorporating a ferro resonant transformer mounted on a pair of opposite "E" laminations to provide a low profile magnetic circuit and windings thereon combined with an electronic voltage regulator in which the regulation required t...
08/02/1977
4016463High density multilayer printed circuit card assembly and method
A high density multilayer printed circuit card assembly having plated through holes in electrical contact with the layers of conducting metal. The card is provided with bonding pads in contact with the plated through holes whereby wiring may be selectivel...
04/05/1977
4015173Support for mounting the electronic components of a single phase unit for an inverter
A support for mounting the electronic components of a single phase unit for an inverter, of the type having an H-shaped cross-section in at least one plane disposed perpendicular to the longitudinal axis thereof. The support includes a planar center plate...
03/29/1977
4007402Three phase full wave rectifier assembly
A three phase full wave rectifier assembly includes first and second sub-assemblies each of which includes three semi-conductor diodes. In addition, each sub-assembly includes an electrically conductive heat sink the three diodes of the first sub-assembly...
02/08/1977
3991346Reinforced backplane for high density electrical contacts
In accordance with the present disclosure, the conventional metal backplane utilized for mounting and interconnecting electronic components is reinforced to increase its rigidity and permit its acceptance of a large number of closely spaced electrical con...
11/09/1976
3987344Plug-in module for electronic device having self-contained heat sink
A small plug-in module includes a combined housing and heat sink, and plug-in terminals cooperating with mating terminals on a chassis. The module includes guiding structure to facilitate insertion of the module on the chassis, which may also form termina...
10/19/1976
3934177Heat sink casing for circuit board components
A case containing and supported on a channel like bracket that divides the case into two chambers. A first chamber contains the signal processing circuitry. The second chamber contains the power circuitry. The power transistors are mounted on the main wal...
01/20/1976
                    22  
 
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