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| Number | Title | Issue Date |
| 7430122 | Electronic device assembly with clips for mounting a heat sink thereon An electronic device assembly includes a PCB (10), a heat sink (30) mounted on the PCB, a back plate (20) attached below the PCB, a fan holder (40) mounted on a top of the heat sink and a fan mounted on the fan holder. The fan holder has ... | 09/30/2008 |
| 7423341 | Plastic overmolded packages with mechanically decoupled lid attach attachment The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug. ... | 09/09/2008 |
| 7423880 | Secure device capable of engaging with a heat sink firmly A secure device for a heat sink includes a frame and a plurality of cylindrical posts. The frame provides a plurality of elongated projections at the inner side thereof. Each of the cylindrical posts is attached to the outer side of the frame. A plurality of split p... | 09/09/2008 |
| 7423882 | Rotating clip Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs during installation of the cooling device and slides slots in the clip int... | 09/09/2008 |
| 7423873 | Heat dissipation device having fan holder for attachment of a fan A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16... | 09/09/2008 |
| 7420811 | Heat sink structure for light-emitting diode based streetlamp A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower ... | 09/02/2008 |
| 7417860 | Heat dissipation device A heat sink assembly (10) includes a heat sink (12) and a wire clip (14). The heat sink includes a base (120) and a plurality of fins (124) mounted on the base. A channel (126) is defined between two neighboring ones of the ... | 08/26/2008 |
| 7416789 | Refractory metal substrate with improved thermal conductivity A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second ... | 08/26/2008 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7414841 | Electronic cooling system having a ventilating duct A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) moun... | 08/19/2008 |
| 7414848 | Heat dissipation device A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat... | 08/19/2008 |
| 7411792 | Thermal switch, methods of use and manufacturing methods for same The present disclosure concerns embodiments of a thermal switch used to control the transfer of heat from a heat source to a heat sink. According to one aspect, the thermal switch can be activated, or turned “on”, so as to establish a path of low thermal resista... | 08/12/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7408781 | Cooling device for memory chips A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of fins. A heat conduction member is connected with the cooling unit an... | 08/05/2008 |
| 7408779 | Heat-dissipating element with connecting structures A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening ... | 08/05/2008 |
| 7408777 | Plasma display device A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a circuit unit for supplying a driving signal to the panel, includes a cavity... | 08/05/2008 |
| 7405448 | Semiconductor device having a resistance for equalizing the current distribution A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the semiconductor element. A second insulating substrate is mounted inside th... | 07/29/2008 |
| 7405934 | Fan and cooling apparatus Holding arms of a frame member of a fan axially extend and project outward from both sides of a housing in a direction perpendicular to a rotational axis of the fan. Catch projections are provided on inner surface of the axial ends of the holding arms in a front-rea... | 07/29/2008 |
| 7403389 | Heat dissipation device A heat dissipation device includes a heat sink (10) and a fan (30). The heat sink includes a plurality of fins (15), and a guiding portion (184) is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by th... | 07/22/2008 |
| 7400239 | Universal control apparatus and methods Apparatus and methods for control of one or more functions within a premises. In one embodiment, the control apparatus comprises a “universal” electronic switch which can be configured according to any number of different desired functional and/or aesthetic sche... | 07/15/2008 |
| 7400050 | Quantum well thermoelectric power source A quantum well thermoelectric module providing very high conversion of heat energy in to electrical energy. In prefered embodiments the module provides electric power for monitoring, measuring or detecting any of a variety of things (such as temperature, smoke, othe... | 07/15/2008 |
| 7397666 | Wedge lock Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis. ... | 07/08/2008 |
| 7394658 | Heat sink with twist lock mounting mechanism A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securin... | 07/01/2008 |
| 7391617 | Cooling arrangement for a computer system A cooling arrangement for a computer system includes a base plate, a system board which coupled to the base plate, a processor arranged on the system board, and a cooling apparatus arranged on the processor. A holding plate is provided between the base plate and the... | 06/24/2008 |
| 7388751 | Method and apparatus for attaching a processor and corresponding heat sink to a circuit board An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the frame member, and a resilient load member. The resilient load member h... | 06/17/2008 |
| 7385823 | Retention module for a heat dissipation assembly A retention module for a heat dissipation assembly is disclosed. In a first embodiment, the retention module may include a frame having an external member and an internal member enclosed within the external member. Furthermore, the internal member is adaptable to se... | 06/10/2008 |
| 7385822 | Clip assembly A clip assembly (30) for mounting a heat sink (20) on a printed circuit board (10) includes a closed annular positioning portion (32) interferingly engaging with the heat sink, a securing portion (34) secured to the positioning por... | 06/10/2008 |
| 7385826 | Method to secure a heat sink A method is disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that substantially encompasses a heat sink in a vertical direction, a horizontal retention a... | 06/10/2008 |
| 7385824 | Processor module with rigidly coupled processor and voltage-regulator heat sinks A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the process... | 06/10/2008 |
| 7381346 | Thermal interface material A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface mat... | 06/03/2008 |
| 7375966 | Automatic transmission electronic control device An ECU has an enclosure which is contained in the casing of an automatic transmission, which is formed of a material having low heat conductivity, and which provides liquid-tight containment of a substrate. A heat sink is attached to the substrate so as to dissipate... | 05/20/2008 |
| 7375968 | Desk lamp An improved desk lamp is disclosed. The improved desk lamp of the present invention comprises a heat dissipating housing, a heat dissipating module, a light unit and a control unit. The heat dissipating module, light unit and control unit are disposed inside the hou... | 05/20/2008 |
| 7370692 | Heat dissipating structure having different compactness A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each o... | 05/13/2008 |
| 7371965 | Modular cage with heat sink for use with pluggable module A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives t... | 05/13/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7369408 | Screwless mini fan holder A screwless mini fan holder is disclosed. The mount bracket of the fan holder is composed of two clips and four resilient pins projecting from opposite sides of a backplane. The clips are used to couple the fan holder onto the heat sink of a computer. The resilient ... | 05/06/2008 |
| 7365990 | Circuit board arrangement including heat dissipater A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices o... | 04/29/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7365984 | Display module A display module having an improved heatsink effect may include a display panel reproducing an image, a chassis supporting the display panel, a driving circuit board disposed on a surface of the chassis opposite to the display panel to generate an electrical signal ... | 04/29/2008 |
