Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 5526525 | Radio transceiver in which the length is dimensioned based on power output requirement A radio transceiver having an integrated transmitter and receiver for transmitting and receiving microwaves or higher frequency electromagnetic waves is one of a series of device products corresponding to different transmission output power capacities. In... | 06/11/1996 |
| 5497289 | Inverter apparatus and method therefor An inverter apparatus having a compact design and a changeable heat sink. The apparatus includes a power module formed in a case having pairs of parallel sides and containing the respective main circuit semiconductor devices for converting an alternating ... | 03/05/1996 |
| 5488254 | Plastic-molded-type semiconductor device A plastic-molded-type semiconductor device is designed to prevent interfaces of a heat conductive member for heat radiation and plastic encapsulant from being separated from each other. The device is of a structure in which the heat conductive member for ... | 01/30/1996 |
| 5485825 | Internal combustion engine ignition device An internal combustion engine ignition device comprises an ignition coil, a preliminary assembly, and a casing for accommodating and covering the ignition coil and the preliminary assembly with resin. The preliminary assembly comprises a heat sink, a cont... | 01/23/1996 |
| 5481136 | Semiconductor element-mounting composite heat-sink base A semiconductor-mounting heat-sink base for use with a plastic package or flexible printed wiring board which eliminates the possibility of semiconductor or package reliability being adversely affected due to a difference in thermal expansion coefficient ... | 01/02/1996 |
| 5472353 | Isobaric expandable thermal clamp for printed circuit board A mounting and fastening device for electronic printed circuit boards (PCBs) in a rack of an electronic enclosure. In particular, the assembly uses an elongated clamping assembly with or without a torque limiting clutching device that may form part of the... | 12/05/1995 |
| 5461201 | Insulating part with integral cooling element An insulating part for an electronic device includes a body having a metallized outer surface and a heat sink arranged within the body. The heat sink is thermally coupled to an electronic component and to the metallized outer surface, and may also be eith... | 10/24/1995 |
| 5455457 | Package for semiconductor elements having thermal dissipation means A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface which faces away from the package substrate, a thin pliable e... | 10/03/1995 |
| 5455382 | IC package heat sink fin A fin assembly for use as a heat sink and production thereof are disclosed. The fin assembly comprises a plurality of heat dissipating plates formed by means of a multi-wire saw, and the heat dissipating plates each has a thickness t of no more than 1 mm ... | 10/03/1995 |
| 5444300 | Semiconductor apparatus with heat sink A semiconductor apparatus is provided which includes a semiconductor chip on its one plane with a plurality of terminal electrodes, which are divided into a plurality of bundles, a bump provided on one of the bundles of terminal electrodes, a connect memb... | 08/22/1995 |
| 5442234 | Apparatus for thermally coupling a heat sink to a leadframe A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of th... | 08/15/1995 |
| 5438478 | Electronic component carriers and method of producing the same as well as electronic devices An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead fra... | 08/01/1995 |
| 5424580 | Electro-mechanical assembly of high power and low power IC packages with a shared heat sink An electro-mechanical assembly includes a high power IC package and a low power IC package which are mounted with a space between them on a single substrate. Both of these IC packages have flat top surfaces which dissipate heat; and due to various manufac... | 06/13/1995 |
| 5420752 | GPT system for encapsulating an integrated circuit package The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing betwee... | 05/30/1995 |
| 5418687 | Wafer scale multi-chip module A wafer scale multi-chip semiconductor module used to interconnect and house a plurality of integrated circuit chips. The wafer scale multi-chip semiconductor module has an interconnect network extending between the integrated circuit chips along the subs... | 05/23/1995 |
| 5404273 | Semiconductor-device package and semiconductor device A semiconductor-device package includes: a printed circuit board which has a chip-accommodating hole in its center portion and which has external connection terminals formed on its one side and a flexible substrate which has a supporting film having a cen... | 04/04/1995 |
| 5400218 | Device for the 3D encapsulation of semiconductor chips Disclosed is a 3D encapsulation of semiconductor chips, each chip containing for example an integrated circuit, this encapsulation being aimed at optimising heat dissipation by conduction. Connection means are associated with each chip, making it possible... | 03/21/1995 |
| 5399906 | High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator A high-frequency semiconductor hybrid integrated circuit device with desirable high-frequency properties and reduced floating capacitance that is easily manufactured at lower cost with reduced labor. A coupling dielectric substrate bearing conducting film... | 03/21/1995 |
| 5394298 | Semiconductor devices A semiconductor device comprises a semiconductor chip carrier and a semiconductor chip packaged therein with a resin. The semiconductor chip carrier comprises a printed wiring substrate with conductor patterns, a first adhesive layer formed on at least an... | 02/28/1995 |
| 5382175 | Thermal core wedge clamp A clamp for seating a circuit card assembly (CCA) in a chassis, and for thereafter establishing thermal contact between the CCA and the chassis, includes a shaft and two wedges that extend substantially the length of the CCA. One wedge is affixed to the C... | 01/17/1995 |
| 5379188 | Arrangement for mounting an integrated circuit chip carrier on a printed circuit board There is provided a mounting arrangement for an integrated circuit chip carrier 7. The carrier 7 is retained in a holder 5 using the lateral forces created by the interference between leads 12 of the carrier and the walls 17 of the holder 5. A lid 6 is ap... | 01/03/1995 |
| 5379185 | Leadless surface mountable assembly A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is mounted on the interior surface (115) of the cover (110). The ... | 01/03/1995 |
| 5377745 | Cooling device for central processing unit A cooling device includes a fin unit with an upper side to which a fan unit is mounted and an underside to which a central processing unit is mounted. The fin unit includes a base plate and a plurality of fins projecting upwardly from an upper side of the... | 01/03/1995 |
| 5373099 | Fixing device for fixing electronic component against a wall of a heatsink A fixing device for fixing an electronic component (10) against a first wall (11) of a heatsink (12) includes at least one end branch engaged in a recess (81) provided in a second wall (82) of the heatsink (12) at right angles to the first wall (11). An a... | 12/13/1994 |
| 5367193 | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die A substrate, a heat slug with an access cavity, a lid, and a heat sink having a stem are used to package a high applied power VLSI die. The substrate comprises a stepped housing cavity at its center, and a number of electrical contacts disposed at its und... | 11/22/1994 |
| 5359493 | Three dimensional multi-chip module with integral heat sink The invention is to a three dimensional circuit module constructed around a heat sink 10. A large integrated circuit component 21 such as a Micro Processing Unit for a computer is mounted over contact pads 27 on a printed wiring board 20. Also mounted to ... | 10/25/1994 |
| 5337214 | Bypass contactor for solid state motor starters A bypass contactor usable in a solid state motor starter for shunting current around a fully-conducting solid state switching device comprising an electromagnetic contactor housed in a molded insulating enclosure having a plurality of bridging contacts mo... | 08/09/1994 |
| 5329420 | Slotted tuning fork thermal interface A chassis is provided having a heat conductive side wall together with a flat heat conductive tab member extending therefrom, together with a planar heat sink for supporting a heat generating electrical device, the heat sink having a pair of flat, paralle... | 07/12/1994 |
| 5323532 | Method for providing novel hybrid circuit assembly carrier bracket An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a first power transistor (124, 126) and to provide a highly effi... | 06/28/1994 |
| 5323295 | Assembly for integrating heat generating electronic device with nonheat generating devices An electronic power device for a juke box or the like comprises a highly thermally conductive heat sink defining a first cavity on one side thereof and a second cavity on the other side thereof, with the first and second cavities having a common, thermall... | 06/21/1994 |
| 5313701 | Assembly and testing of electronic power components insulation In accordance with a method for assembly and testing the insulation of power components for electronic switching and control devices, particularly for motor vehicles, the power components are fastened to a heat sink so as to be thermally conducting and el... | 05/24/1994 |
| 5313362 | Packaging structure of small-sized computer In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the process... | 05/17/1994 |
| 5311395 | Surface mount heat sink A heat sink for electronic devices which are surface mounted on a printed circuit board includes two side members, a connecting bridge, a foot on each side member which is soldered to a mounting pad on the printed circuit board, a locating element on each... | 05/10/1994 |
| 5309979 | Self clamping heat sink assembly A heat sink assembly for clamping stand-up power components to a heat sink wherein the components are mounted on a circuit board and enclosed within a housing. A spring clamp lightly clamps an electrical component to a heat sink during a soldering process... | 05/10/1994 |
| 5295044 | Semiconductor device A plurality of circuit boards are used and frames are attached to the circuit boards to surround the peripheral portions thereof. Since connection terminals electrically connected to the respective circuit boards are attached to the respective frames, a s... | 03/15/1994 |
| 5280410 | Electrical switching and control device, in particular for motor vehicles An electrical switching and control device, particularly for motor vehicles has a housing a printed circuit board, a plurality of electronic power components arranged in the housing and having leads soldered with the printed circuit board, another compone... | 01/18/1994 |
| 5276584 | Electronic unit Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. Th... | 01/04/1994 |
| 5276585 | Heat sink mounting apparatus A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of the device package in the pockets to secure the heat sink be... | 01/04/1994 |
| 5237494 | Frequency inverting apparatus An apparatus for driving a plurality of motors at different variable speeds. The apparatus includes a rectifier for supplying direct current power to a dc bus circuit. A plurality of inverters are connected to the dc bus circuit and each inverter drives a... | 08/17/1993 |
| 5227646 | Optical semiconductor device with laminated ceramic substrate In an optical semiconductor device having a light emitting element mounted on a heat sink, a first casing for supporting and covering the light emitting element and the heat sink, and a second casing for supporting and covering the first casing and furthe... | 07/13/1993 |
