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| Number | Title | Issue Date |
| 6713151 | Compliant fibrous thermal interface Described is a fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the por... | 03/30/2004 |
| 6713851 | Lead over chip semiconductor device including a heat sink for heat dissipation The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 that is in thermal contact with the surface opposite the princi... | 03/30/2004 |
| 6706972 | Electronic assembly comprising a sole plate forming a heat sink The invention concerns an assembly supported on a base plate forming a radiator or capable of being directly mounted on the base plate, comprising a printed circuit card (1) having its thickness a plurality of holes (5) ensuring heat transfer between o... | 03/16/2004 |
| 6700782 | Apparatus and method to retain an electronic component in a precise position during assembly manufacturing A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed ends; a pair of legs, each depending from one of the opposed ... | 03/02/2004 |
| 6697263 | Socket having frame for supporting thermal module A socket (10) for connecting a CPU (30) to a PCB (50) includes a base (12) and a frame (20) surrounding the base. The base has a plurality of terminals (14) received therein. A receiving space is defined between the base and the frame, for receiving the C... | 02/24/2004 |
| 6696755 | Semiconductor device A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer... | 02/24/2004 |
| 6696197 | Battery pack and portable electronic appliance Disclosed is a battery pack, comprising a secondary battery unit including at least one secondary battery, the at least one secondary battery comprising an electrode group and an insulating case having the electrode group housed therein, and the battery p... | 02/24/2004 |
| 6687126 | Cooling plate arrangement for electronic components An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains ... | 02/03/2004 |
| 6683796 | Apparatus for containing electromagnetic interference An apparatus for containing electromagnetic interference (EMI). The apparatus includes an enclosure for an EMI producing component. The enclosure has a set of springable tabs extending from a top edge of the enclosure and a set of pins extending from a bo... | 01/27/2004 |
| 6677185 | Method of affixing a heat sink to a substrate and package thereof A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position and electrically connecting the substrate, an appropriate... | 01/13/2004 |
| 6672380 | Heat sink base pad A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate thereof to increase the self-heat convection of the bottom po... | 01/06/2004 |
| 6666261 | Liquid circulation cooler A liquid cooler (1) includes a body (10) and a cover (20) attached on the body. The body includes a base (12) with a first cavity (126) accommodating liquid, a central hollow cylinder (16) having a passage (164) in communication with the first cavity, and... | 12/23/2003 |
| 6665195 | Converter appliance capacitor assembly The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical holding devices. In addition, the capacitor comprises at leas... | 12/16/2003 |
| 6663964 | Heat dissipating structure A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a grap... | 12/16/2003 |
| 6661662 | Vehicular modular design multiple application rectifier assembly A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has identically positioned diode mounting holes. A plurality of rectifier diodes are mou... | 12/09/2003 |
| 6657865 | Heat dissipating structure A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one ri... | 12/02/2003 |
| 6648664 | Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector A retention device (6) for securely retaining a heat sink module (5) and a package (4) upon a socket (3) includes a main frame (60), a spring clip (63) and an actuating lever (64). The main frame is mounted on a printed circuit board (2) surrounding the s... | 11/18/2003 |
| 6643137 | Heat-dissipating device with grounding capability A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connectin... | 11/04/2003 |
| 6639802 | Heat sink with interlocked fins A heat sink includes a base plate (30), and a plurality of fins (10) mounted on the base plate. Each fin includes a main body (12), and two upper locking members (14). Two retaining holes (22) are defined in the main body. Each locking member includes a h... | 10/28/2003 |
| 6639803 | Compliant heat sink device/mounting system interconnect and a method of implementing same A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between t... | 10/28/2003 |
| 6639804 | Adjustable device for heat sink retention module An adjustable device includes a supporting plate (20) and a securing plate (10). The supporting plate includes a locking block (204) and three latches (208). The locking block defines three locking holes (205). The latches include a left latch, a right la... | 10/28/2003 |
| 6627981 | Resin-packaged semiconductor device A plurality of leads are arrayed around an island (1) to which a semiconductor chip (3) is bonded. A plurality of first wires (4) interconnects each electrode terminal of the semiconductor chip (3) and each of the plurality of leads (2), while a second wi... | 09/30/2003 |
| 6624714 | Radiator capable of considerably suppressing a high-frequency current flowing in an electric component In a radiator (1) for use in radiating heat generated by an electronic component (5), a high-frequency current suppressor (2) is attached to that principal surface of the radiator which faces the electronic component. The high-frequency current suppressor... | 09/23/2003 |
| 6621713 | Cartridge type server unit and a cabinet to accommodate multiple said server units An object of the invention is to provide a server unit, which is so structured as to enable efficient cooling and which can be installed in great numbers in a server unit cabinet, and which comprises a cartridge type server unit 3 comprising (a) a printed... | 09/16/2003 |
| 6614100 | Lead frame for the installation of an integrated circuit in an injection-molded package The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mo... | 09/02/2003 |
| 6611425 | Electronic apparatus An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a heat-generating element, a heat-dissipating pipe is thermally connect... | 08/26/2003 |
| 6607028 | Positioning structure for heat dissipating fins A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion connected to one or two sides of the main body. The positioning... | 08/19/2003 |
| 6606246 | Method and apparatus for retaining cooling apparatus and bus bar A method and apparatus for retaining a cooling apparatus in engagement with an integrated circuit including a frame with a bus bar carrying an electrical signal from one part of a circuitboard to which the frame and the integrated circuit are attached to ... | 08/12/2003 |
| 6600651 | Package with high heat dissipation A package with high heat dissipation, comprising a carrier and a chip located thereon, with electric connection between the chip to the carrier. A molding compound is used to encapsulate the chip, part of the carrier, and the connection between the chip a... | 07/29/2003 |
| 6600650 | Fastening device of CPU heat sink A fastening device of the CPU heat sink comprising a heat sink with a base contacting the top of a CPU, a plurality numbers of heat dissipating plates on top of the base, a hollow space formed on top of heat dissipating plates, a fan located in and fixed ... | 07/29/2003 |
| 6597574 | Radiator plate and process for manufacturing the same A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller ... | 07/22/2003 |
| 6590773 | Heat dissipation device for enhanced power light emitting diodes A heat dissipation device is mounted to a light emitting diode device for removing heat from the light emitting diode which includes a substrate having a top side on which a light-emitting unit is formed and an opposite bottom side from which terminals ex... | 07/08/2003 |
| 6587344 | Mounting system for high-voltage semiconductor device A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and... | 07/01/2003 |
| 6580611 | Dual-sided heat removal system The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.... | 06/17/2003 |
| 6577504 | Integrated heat sink for different size components with EMI suppression features An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality ... | 06/10/2003 |
| 6574107 | Stacked intelligent power module package A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently s... | 06/03/2003 |
| 6570763 | Heat sink securing means A securing means is adapted to attach a heat sink (70) to a CPU on a circuit board (80). The securing means comprises a retention module (10) and a cover clip (30). The retention module has two front and two rear columns (14', 14) cooperatively defining a... | 05/27/2003 |
| 6563213 | Integrated circuit heat sink support and retention mechanism The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports t... | 05/13/2003 |
| 6563712 | Heak sink chip package The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechan... | 05/13/2003 |
| 6554060 | Heat sink with fins A heat sink with fins comprising a group of heat dissipating fins which comprise combination of heat dissipating fins made of at least two kinds of metals having different heat conductivity, and a metal base plate on which surface portion the group of hea... | 04/29/2003 |
