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| Number | Title | Issue Date |
| 6809261 | Physically compact device package A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing acces... | 10/26/2004 |
| 6809929 | Heat sink assembly with retaining device A heat sink assembly having a retaining device includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores ( | 10/26/2004 |
| 6807059 | Stud welded pin fin heat sink A pin fin heat sink for use in transferring heat away from a heat generating source is described which is manufactured by fusion or stud welding of fins to a base forming a continuous thermally conductive path for heat rejection. The method permits use of a broader ... | 10/19/2004 |
| 6807058 | Heat sink and combinations The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectil... | 10/19/2004 |
| 6804118 | Thermal dissipation assembly for electronic components An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least one pre-cured thermal adhesive member ... | 10/12/2004 |
| 6798663 | Heat sink hold-down with fan-module attach location A system for heat sink hold-down is provided. The system comprises a heat source; and a heat sink hold-down assembly. The assembly comprises a bolster plate to rigidly support the heat source and a heat sink. The heat sink comprises a heat sink base operable to tran... | 09/28/2004 |
| 6794026 | Radiating sheet and PDP panel To realize uniform heat distribution by adhering a radiating sheet tightly to a radiating element such as a PDP glass panel, and a heat sink such as an aluminum chassis, transfer heat smoothly to the heat sink such as the aluminum, and release foams entrapped betwee... | 09/21/2004 |
| 6791839 | Thermal interface materials and methods for their preparation and use A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which co... | 09/14/2004 |
| 6788538 | Retention of heat sinks on electronic packages A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal. The heat sink dissipates h... | 09/07/2004 |
| 6785140 | Multiple heat pipe heat sink A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second po... | 08/31/2004 |
| 6784538 | Heat transfer structure for a semiconductor device utilizing a bismuth glass layer The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer. ... | 08/31/2004 |
| 6783692 | Heat softening thermally conductive compositions and methods for their preparation A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired... | 08/31/2004 |
| 6776221 | Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from ... | 08/17/2004 |
| 6771508 | Method and apparatus for cooling an electronic component In one embodiment, the invention provides a system. The system comprises using a plurality of heat absorbing fins to absorb heat from an electronic component of a substrate-mounted electronic assembly; and transporting the absorbed heat to a material of an enclosure... | 08/03/2004 |
| 6771506 | Heat sink fastener A heat sink fastener (10) includes a pressing beam (20), a clamping beam (30), and an operating lever (40). The pressing beam includes a first pivot portion (26) at one end thereof, and a hook (242) at an opposite end thereo... | 08/03/2004 |
| 6771502 | Heat sink made from longer and shorter graphite sheets A heat sink apparatus is constructed from alternating longer and shorter sheets of graphite material sandwiched together such that the longer sheets extend beyond the shorter sheets to define fins. The directions of higher thermal conductivity of the anisotropic gra... | 08/03/2004 |
| 6768193 | Heat transfer structure for a semiconductor device utilizing a bismuth glass layer The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer. ... | 07/27/2004 |
| 6765799 | Heat dissipating fins interlocking mechanism The present invention of a heat dissipating fin pieces interlocking mechanism includes a plurality of aluminum or copper fin pieces wherein the lower center protruding section is bent and folded into a base plate. Also located on center portion fin pieces is a plura... | 07/20/2004 |
| 6765797 | Heat transfer apparatus The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. On... | 07/20/2004 |
| 6765794 | Heat sink, manufacturing method thereof, and electronic apparatus having the heat sink It is an exemplified object of the present invention to provide a heat sink, method of manufacturing the same, and electronic apparatus having the heat sink in which a fine and inexpensive adjustment upon placement and replacement may be made to exoergic components ... | 07/20/2004 |
| 6765291 | IC package with dual heat spreaders A method of making an integrated circuit device using an encapsulated semiconductor die having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant surfaces thereof. One or both of the heat spreaders has a pair of end posts ... | 07/20/2004 |
| 6764773 | Heat-dissipating substrate, method for making the same, and semiconductor device including the same A heat-dissipating substrate is made of a composite material comprising a first composition primarily composed of aluminum and a second composition primarily composed of silicon carbide and/or silicon The heat-dissipating substrate has a recess in one of its main fa... | 07/20/2004 |
| 6763881 | Thermally matched gradient heat sink An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a coefficient of thermal expansion substantially matching the coefficient o... | 07/20/2004 |
| 6761211 | High-performance heat sink for electronics cooling Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on another surface, at least two fins and porous reticulated foam blocks... | 07/13/2004 |
| 6757965 | Method of installing a land grid array multi-chip modules A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is r... | 07/06/2004 |
| 6757179 | Circuit board support assembly A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electr... | 06/29/2004 |
| 6754080 | Clip for heat sink A clip (10) for securing a heat sink (20) to an electronic chip (40) mounted on a socket (30) includes a substantially V-shaped body (11), first and a second legs (14,15) depending from respective opposite ends of the body, ... | 06/22/2004 |
| 6754079 | KD heat sink fins A knock down heat sink, and more particularly, to one that comprised of multiple fins overlapped among one another into a stack and a specific spacing is defined between any two abutted fins to provide good heat dispersion and form a reliable heat sink allowing exte... | 06/22/2004 |
| 6754078 | Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate A heat dissipating device comprises a bottom plate and plurality of heat dissipating sheets. A surface of the bottom plate is formed with a plurality of inclined recesses which are spaced with an equal space. Each inclined recess is inclined to a surface of the bott... | 06/22/2004 |
| 6748350 | Method to compensate for stress between heat spreader and thermal interface material A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader b... | 06/08/2004 |
| 6746768 | Thermal interface material A thermal interface and a thermal interface as part of a thermal management system that comprises a heat source, and a cooling module. The heat source has an external surface; the thermal interface is a flexible graphite sheet article having two parallel planar surf... | 06/08/2004 |
| 6734552 | Enhanced thermal dissipation integrated circuit package In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the heat sink further including an extending finger when viewed from a top ... | 05/11/2004 |
| 6735082 | Heatsink with improved heat dissipation capability A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more components through the use of pins oriented at more than one angle with r... | 05/11/2004 |
| 6735084 | Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly each equipped with the heat sink includes a base portion fixedly attac... | 05/11/2004 |
| 6731504 | Heat sink fastener A heat sink fastener for securing a heat sink to a CPU is described as having a holding down spring plate. The holding down spring plate has a flat bearing portion at one end, a first hook plate extended from one end of the holding down spring plate remote from the ... | 05/04/2004 |
| 6731501 | Heat dissipating device for dissipating heat generated by a disk drive module inside a computer housing In a heat dissipating device, a base plate, mounted in a drawer body of a disk drive module inside a computer housing, contacts and is in thermal communication with a disk drive. A fin strip unit is mounted fixedly on and is in thermal communication with the base pl... | 05/04/2004 |
| 6724629 | Leaf spring load plate with retained linear cam slide An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf springs in contact with the top plate, a leaf spring cradle that carrie... | 04/20/2004 |
| 6724628 | Blindmate heat sink assembly A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having... | 04/20/2004 |
| 6720581 | Mounting plate for a laser chip in a semiconductor laser device A method of manufacturing a semiconductor laser device includes the steps of: providing a laser chip, in which a semiconductor layer is formed on a substrate, a supporting plate which supports the laser chip, a mounting plate, a first solder film positioned between ... | 04/13/2004 |
| 6717806 | Component alignment and retention mechanism An alignment and retention mechanism comprises a hinged upper subassembly rotatably mated with a fixed lower subassembly defining a receptacle into which a component (e.g., a processor and heat sink assembly) is aligned and retained in place. The alignment and reten... | 04/06/2004 |
