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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 4868712 | Three dimensional integrated circuit package This invention discloses a three-dimensional, high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together. Techniques for interconnecting the layers to one another and for connectin... | 09/19/1989 |
| 4862323 | Chip carrier A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have... | 08/29/1989 |
| 4858073 | Metal substrated printed circuit A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated to a metal surface, such as aluminum, with a high temperat... | 08/15/1989 |
| 4858072 | Interconnection system for integrated circuit chips A novel packaging system for VLSI circuits allows low-cost construction and maintenance of complex high density high-performance devices with low power requirements. The devices can be individually created by software means from a small selection of stand... | 08/15/1989 |
| 4855867 | Full panel electronic packaging structure An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed c... | 08/08/1989 |
| 4849858 | Composite heat transfer means A thermal heat transfer member is disclosed for use with electronic or microwave systems. The thermal heat transfer member comprises a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix mater... | 07/18/1989 |
| 4849857 | Heat dissipating interconnect tape for use in tape automated bonding The present invention is directed to an interconnect tape for TAB and electronic packages made from the tape. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic pack... | 07/18/1989 |
| 4827376 | Heat dissipating interconnect tape for use in tape automated bonding The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electr... | 05/02/1989 |
| 4795997 | Thermostat for board mounting Snap action thermostat has a housing molded onto two flat terminals to form a cavity wherein inner portions of the terminals are exposed. A contact arm is welded to the inner portion of one terminal, a dished bistable bimetal element is placed loosely in ... | 01/03/1989 |
| 4796157 | Substrate mounting assembly In a substrate mounting assembly (10) critical bonding pads (20) adjacent one lateral edge (21) of a ceramic substrate (11) are connected to semiconductor die (13) via wires (26). The substrate and die are mounted on a aluminum base carrier plate (12) whi... | 01/03/1989 |
| 4792878 | Heat dissipating housing for a circuit component A heat dissipating housing (W/Gl/G) for a circuit component (IC) consists of at least one bottom tub (G) and a cover (W) having a planar cover face. A frame-shaped portion of this cover face serves as a bearing surface (TF) for meeting a planar bearing su... | 12/20/1988 |
| 4775917 | Thermal compensated circuit board interconnect apparatus and method of forming the same A circuit board unit includes a substrate with imprinted circuit traces and components. A plurality of traces include connecting areas for connection to another trace area or to an external lead. An interconnect element is soldered to each area. Each elem... | 10/04/1988 |
| 4764846 | High density electronic package comprising stacked sub-modules A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has ... | 08/16/1988 |
| 4764845 | Cooled component assembly A component assembly is provided comprising a housing having connector means extending externally thereof, locating means mounted in the housing, a plurality of components located by said locating means, the components being connected to one another and t... | 08/16/1988 |
| 4730235 | Cascadable carrier for high power semiconductors or other electronic components A carrier for electronic components which generate heat during their operation, such as high power semiconductors, is disclosed. The carrier includes complementary ends which are designed to permit the second end of a first carrier to abut and overlap the... | 03/08/1988 |
| 4727455 | Semiconductor power module with an integrated heat pipe A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconduc... | 02/23/1988 |
| 4700273 | Circuit assembly with semiconductor expansion matched thermal path A copper lead frame (16) has an aperture (18) through which a molybdenum layer (20) extends to directly contact a ceramic substrate (8) therebelow. A semiconductor chip (2) is mounted on the molybdenum layer (20). Thermal conductivity is improved because ... | 10/13/1987 |
| 4689110 | Method of fabricating multilayer printed circuit board structure A composite printed circuit board structure including multiple layers of graphite interleaved with layers of a dielectric material, such as a polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layers are copper clad, and at le... | 08/25/1987 |
| 4682269 | Heat dissipation for electronic components on a ceramic substrate A heat dissipator for electronic components comprising a ceramic plate having a first surface for receiving heat from the electronic components and a second surface, and a plurality of separate, spaced metallic, heat-conducting elements mounted on and ext... | 07/21/1987 |
| 4674005 | Multiple fastening clip and device for the collective mounting of electronic power components The invention relates to a multiple fastening clip (21) and its application to a device for the collective mounting of electronic power components (3) on a heat sink (15). This mounting device comprises a heat sink (15) in the form of an angle section per... | 06/16/1987 |
| 4670771 | Rectifier module Rectifier module, including a frame forming a housing wall and having an open top and bottom, a ceramic plate cemented to the frame forming a housing bottom and having a side facing the interior of the housing and a side facing away from the interior of t... | 06/02/1987 |
| 4670817 | Heat sink and interconnection arrangement for series connected power diodes A metal base plate has two spaced thermally conductive ceramic bars fixed to one surface. The outwardly facing surface of the bars has spaced conductive pads. A plurality of diodes which are of alternating opposite polarity have axially extending leads ex... | 06/02/1987 |
| 4654754 | Thermal link A thermal link provides a thermal path between a heat source and a heat sink which compensates for irregularities on the surface of the heat source and/or heat sink and/or nonuniformity in the spacing therebetween. One embodiment utilizes a spring metal d... | 03/31/1987 |
| 4648008 | Mounting device for a thick layer electronic module A device is provided for mounting a thick layer component, more especially for an electronic module. Said component comprises a thick layer deposited on a face of an electrically insulating support. This face is, in the mounted position, on the same side ... | 03/03/1987 |
| 4646203 | Mounting structure for semiconductor devices A mounting structure is disclosed for mounting a semiconductor device on a conductive heat sink while electrically insulating the two. A thin, flat thermally conductive electrically insulative sheet is disposed between a flat electrically conductive surfa... | 02/24/1987 |
| 4644444 | Clamping means, and modules and units including clamping means Heat dissipation from electronic modules is improved by clamping their edges against heat-conducting fins in a housing by means of two expanding jackscrews. Each jackscrew has a shaft mounted in bearings in the module and carries a row of alternate closed... | 02/17/1987 |
| 4626960 | Semiconductor device having soldered bond between base and cap thereof A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering not only a region where it contacts the base but also the ... | 12/02/1986 |
| 4603374 | Packaging module for a semiconductor wafer A package for housing a semiconductor wafer includes a case having a plurality of thermal conductive pads disposed on an inner surface thereof for supporting the wafer. A printed circuit board is equipped with a plurality of contact pins and further inclu... | 07/29/1986 |
| 4571611 | Semiconductor chip with a metal heat radiator A semiconductor chip, including a semiconductor substrate and a radiator plate. An active region is formed on one main surface of the semiconductor substrate. The radiator plate is bonded to the other main surface side of the semiconductor substrate. A re... | 02/18/1986 |
| 4563725 | Electrical assembly An electrical assembly incorporates a multilayer printed circuit board comprising a flexible electrically insulating circuit board laminate with electrical conductors for connecting to terminals on rigid slab-like heat-dissipating components such as circu... | 01/07/1986 |
| 4495515 | Electrically isolating two piece mounting washer arrangement A mounting washer arrangement for a new type power transistor package comprises two interlocking washers. A first mounting washer part of heat sinking material fits under the transistor body; a second mounting washer part of electrically insulating materi... | 01/22/1985 |
| 4472762 | Electronic circuit interconnection system An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded ... | 09/18/1984 |
| 4396971 | LSI Chip package and method Package for an LSI chip having a plurality of contact pads comprising a carrier and a cover. The carrier is formed of a base of an insulating material and has a generally planar area for receiving the chip. A cooling stud is mounted on the base and can be... | 08/02/1983 |
| 4385202 | Electronic circuit interconnection system An electronic circuit interconnection system permitting high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonde... | 05/24/1983 |
| 4306275 | Hybrid integrated circuit unit A hybrid integrated circuit unit comprising an integrated circuit assembly having at least one semiconductor device and a plurality of conductors extending to the first connecting terminals, a printed circuit board having at least one discrete element and... | 12/15/1981 |
| 4115837 | LSI Chip package and method Package for an LSI chip having a plurality of contact pads comprising a carrier and a cover. The carrier is formed of a base of an insulating material and has a generally planar area for receiving the chip. A cooling stud is mounted on the base and can be... | 09/19/1978 |
| 4096547 | Heat transfer mounting device for metallic printed circuit boards A printed circuit board guide and holding device which is particularly adapted for use with metallic printed circuit boards, and which has improved heat transfer capabilities comprises an elongated heat transfer support member which is adapted to receive ... | 06/20/1978 |
| 4057101 | Heat sink A heat sink is disclosed which consists of a permanently sealed container which contains LiClO4.3R.sub.2 O, NH4 Al(SO4)2.12R.sub.2 O or (COOH)2.2R.sub.2 O, where R is hydrogen or deuterium. The heat s... | 11/08/1977 |
| 3987344 | Plug-in module for electronic device having self-contained heat sink A small plug-in module includes a combined housing and heat sink, and plug-in terminals cooperating with mating terminals on a chassis. The module includes guiding structure to facilitate insertion of the module on the chassis, which may also form termina... | 10/19/1976 |
