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| Number | Title | Issue Date |
| 7017433 | Non-contacting sensor multichip module with integral heat-sinks A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and ... | 03/28/2006 |
| 7019244 | Electrostatic precipitator An electrostatic precipitator that removes zinc whiskers from cooling air provided to cool components in an electronics enclosure. The electrostatic precipitator comprises an ionizer configured to apply a charge to zinc whiskers suspended in the cooling air. The ele... | 03/28/2006 |
| 7019972 | Apparatus for conditioning power and managing thermal energy in an electronic device In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device.... | 03/28/2006 |
| 7019977 | Method of attaching non-adhesive thermal interface materials Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated ci... | 03/28/2006 |
| 7019975 | Power module and power module with heat sink The present invention relates to a power module in which an insulated circuit board is fixed to one main surface of a heat discharge plate. It is an object thereof to provide a power module in which the heat discharge characteristics are improved without any marked ... | 03/28/2006 |
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, ... | 03/21/2006 |
| 7015132 | Forming an electrical contact on an electronic component A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, ... | 03/21/2006 |
| 7016192 | Electrical power converter method and system employing multiple-output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 03/21/2006 |
| 7012354 | Method and structure for a pusher-mode piezoelectrically actuated liquid metal switch A method and structure for an electrical switch. According to the structure of the present invention, a liquid-filled chamber is housed within a solid material. A plurality of switch contacts within the liquid-filled chamber are coupled to the solid material, while ... | 03/14/2006 |
| 7009301 | Semiconductor package with a heat spreader A semiconductor package capable of spreading heat includes an upper PCB and a lower PCB connected to a first chip and a second chip by using gold bumps, respectively. Also the semiconductor package includes a heat spreader and thermally conductive members. The heat ... | 03/07/2006 |
| 7003970 | Power module and air conditioner An efficient heat diffusing structure comprising a power module having a mounting substrate that has a high thermal conduction efficiency. The mounting substrate is comprised of a mounting surface on which an electric power circuit for controlling electric power is ... | 02/28/2006 |
| 7006355 | Combination structure of electronic equipment An electronic control unit 31 for mounting on a vehicle include a control portion 32 and a power portion 33 which are separate from each other, and are combined together. A control board 40 is mounted on a control connector-incorporating ... | 02/28/2006 |
| 7002803 | Electronic product with heat radiating plate An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame member securely associated with the heat radiating plate to encompass t... | 02/21/2006 |
| 7002807 | Electronic component An electronic component has a casing having a resin injecting section having at least one wall. At least one circuit board is housed in the casing, next to the resin injecting section via the wall. At least one lead terminal is provided in the casing. The lead termi... | 02/21/2006 |
| 7002805 | Thermal enhance MCM package and manufacturing method thereof A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the sec... | 02/21/2006 |
| 6998707 | Semiconductor device having radiation structure A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protrud... | 02/14/2006 |
| 6998721 | Stacking and encapsulation of multiple interconnected integrated circuits In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circui... | 02/14/2006 |
| 6998944 | Method and apparatus for microwave interconnection Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave module using a feedthrough pin mounted in the module. The feedthroug... | 02/14/2006 |
| 6992887 | Liquid cooled semiconductor device A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side o... | 01/31/2006 |
| 6987672 | Blindmate heat sink assembly An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount the electronic device within the perimeter of the socket. The heat sink... | 01/17/2006 |
| 6987317 | Power delivery using an integrated heat spreader An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by... | 01/17/2006 |
| 6987671 | Composite thermal interface devices and methods for integrated circuit heat transfer A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Thermal interface devices are shown that include... | 01/17/2006 |
| 6984894 | Semiconductor package having a partial slot cover for encapsulation process A system and method for encapsulating an integrated circuit package. More specifically, a system and method for encapsulating a board-on-chip package is described. A strip of material is disposed on one end of the slot in the substrate to control the flow of the mol... | 01/10/2006 |
| 6982866 | Lightweight robust enclosure design for a mobile computing system In one embodiment, the invention provides an enclosure for a mobile computing system. The enclosure comprises a hollow body shaped and dimensioned to house a processing module, and a display module for a tablet personal computer, wherein the hollow body is defined b... | 01/03/2006 |
| 6982873 | Compact vehicle drive module having improved thermal control An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing... | 01/03/2006 |
| 6980438 | Semiconductor package with heat dissipating structure A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one... | 12/27/2005 |
| 6979594 | Process for manufacturing ball grid array package A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate array. Wires are bonded between the semiconductor die and ones of conductive traces of the substrate array. The heat spreader is disposed in a mold and the su... | 12/27/2005 |
| 6979909 | Semiconductor device and method of manufacturing same A lead frame (2a) has a die bonding pad portion (3) and an inner lead portion (4). A power element (1) is mounted on the die bonding pad portion (3) of the lead frame (2a) and is bonded to the die bonding pad p... | 12/27/2005 |
| 6977814 | Dual material heat sink core assembly A heat sink core assembly includes a base plate fabricated from a first material. The base plate comprises an opening therein, and the opening defines an insert engagement surface. An insert is fabricated from a second material different from the first material. The... | 12/20/2005 |
| 6976525 | Fastening device for a radiator A radiator with a securing device for cooling the heat generating unit, which is attached to a base plate. The securing device basically is a locating part with a locating opening and disposed beneath the radiator to support and locate the radiator. There are secure... | 12/20/2005 |
| 6977673 | Portable moving picture recording device including switching control for multiple data flow configurations A portable moving picture recording device includes switching control to enable multiple data flow configurations. Two output encoders receive either composite or component digital video signals. The component video signals can come from one of three sources: decode... | 12/20/2005 |
| 6977818 | Heat dissipating device for an integrated circuit chip An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by t... | 12/20/2005 |
| 6977816 | Heat sink mounting assembly A heat sink mounting assembly includes a socket (90) having first and second side, a retaining clip (10) cooperating with the socket to sandwich a heat sink (70) therebetween. A pair of ears (92) is formed at the first and second sides of... | 12/20/2005 |
| 6977815 | Power adapter with heat sink device A power adapter includes an insulating casing including an enclosing wall and defining a sealing chamber therein, a power transforming unit disposed in the sealing chamber, and a heat sink device including a heat dispersing member supported within the sealing chambe... | 12/20/2005 |
| 6975513 | Construction for high density power module package A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save... | 12/13/2005 |
| 6974517 | Lid with window hermetically sealed to frame, and a method of making it An apparatus (10) includes a digital micromirror device (16) disposed within a housing (11) that has an opening (13) hermetically sealed by a lid (17). The lid includes a radiation transmissive window (22) with peripheral ed... | 12/13/2005 |
| 6972957 | Modular power converter having fluid cooled support A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 12/06/2005 |
| 6964501 | Peltier-cooled LED lighting assembly A high-powered lighting assembly includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed-loop refrigeration system to maximize operational efficiencies and increase unit life. The thermal barrier prevents thermal back-flow f... | 11/15/2005 |
| 6965514 | Fluid cooled vehicle drive module An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a... | 11/15/2005 |
| 6963490 | Methods and apparatus for conductive cooling of electronic units A method for configuring an electronic unit having a plurality of sides for conductive cooling is described. The electronic unit is configured to be mounted in a mounting rack and the method comprises attaching a heat conduction mechanism including an expandable hea... | 11/08/2005 |
