Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 7342305 | Thermally enhanced cavity-down integrated circuit package A cavity-down ball grid includes a flexible circuit tape including a flexible tape laminated to a conductor layer. The flexible circuit tape has an aperture therein. A thermally conductive heat spreader is fixed to a first surface of the flexible circuit tape and th... | 03/11/2008 |
| 7342797 | Interposable heat sink for adjacent memory modules A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first ... | 03/11/2008 |
| 7339795 | Structure for fastening a circuit board on a case A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupl... | 03/04/2008 |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads... | 03/04/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7336495 | Power component cooling device with a heat sink and one or more cooling fins Where power components are fixed on a heat sink 1 inclusive of a heat sink base 1b and cooling fins 1a provided on the heat sink base 1b, one 1c of the cooling fins, which is made thicker, is arranged up... | 02/26/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7335035 | Electric junction box An electric junction box includes a circuit construct as an internal circuit component. The circuit construct includes relays mounted on one side of a printed circuit board and bus bars fixed on the other side of the printed circuit board. The circuit construct is d... | 02/26/2008 |
| 7337260 | Bus system and information processing system including bus system In a bus connection circuit for connecting buses having different bit widths, number of clock cycles can be reduced, and hardware amount can be reduced. The bus connection circuit connects buses of mutually different bit widths having control lines and data lines co... | 02/26/2008 |
| 7332818 | Multi-chip electronic package with reduced line skew and circuitized substrate for use therein An electronic package which includes a circuitized substrate having at least two electrical components positioned thereon. The package includes patterns of contact sites, each for having one of the components coupled thereto. The patterns of contact sites in turn ar... | 02/19/2008 |
| 7330354 | Mobile terminal device and method for radiating heat therefrom In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the elec... | 02/12/2008 |
| 7330355 | Fixed pillar with heat loss A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body. The plurality of grooves is respectively set on two sides of the metal... | 02/12/2008 |
| 7330353 | Modular heat sink fin modules for CPU A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individua... | 02/12/2008 |
| 7327574 | Heatsink module for electronic device A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The re... | 02/05/2008 |
| 7323641 | Wired circuit board holding sheet and production method thereof A wired circuit board holding sheet that can permit easy judgment on whether a cutting notch formed has a predetermined depth, and a production method of the wired circuit board holding sheet that can produce the wired circuit board holding sheet simply and easily. ... | 01/29/2008 |
| 7324336 | Flow through cooling assemblies for conduction-cooled circuit modules A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable ... | 01/29/2008 |
| 7321492 | Heat sink module for an electronic device Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate an... | 01/22/2008 |
| 7319593 | Industrial light fixture with spring-bracket over capacitor An industrial light fixture of the type including a housing with a base member and a top member and containing power-related components includes a spring-bracket secured to bracket-securement point(s), extending along the capacitor to hold the capacitor in place and... | 01/15/2008 |
| 7316063 | Methods of fabricating substrates including at least one conductive via A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by mask... | 01/08/2008 |
| 7317243 | Encapsulated lead having step configuration Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the insulator having a recess. The conductive elements embedded in t... | 01/08/2008 |
| 7317619 | Apparatus for inserting and ejecting an electronic enclosure within a cabinet A cabinet includes spaces for a number of electronic enclosures, each of which has a free end from which a pair of levers extend upward and downward to teeth engaging slots within the cabinet, aiding in the insertion and removal of the enclosures from the cabinet. A... | 01/08/2008 |
| 7315450 | Heat-generating component cooling structure A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of ... | 01/01/2008 |
| 7315452 | Optical disk device An optical disk device of the present invention has a main PC board carrying a semiconductor element and attached at the rear of a drawer to efficiently dissipate a heat generated from the semiconductor element. The drawer is formed of a material having good thermal... | 01/01/2008 |
| 7314040 | Fuel supply apparatus In a fuel supply apparatus, a circuit module has a housing, a driving circuit contained in the housing, an electric connector. The circuit module is mounted to a cover member that is disposed to close an opening of a fuel tank. A fuel pump is supported by the cover ... | 01/01/2008 |
| 7312525 | Thermally enhanced package for an integrated circuit A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channe... | 12/25/2007 |
| 7312996 | Heat sink for memory strips A heat sink for memory strips comprises two heat transfer plates respectively attached on two sides of a memory strip. The upper edges of the heat transfer plates are further provided with retaining tongues and retaining rings. The extended portion of the combined h... | 12/25/2007 |
| 7313001 | Electrical switch having a mount for an electrical circuit The invention relates to an electrical circuit arrangement (3) having electrical and/or electronic components (4). The components (4) are arranged on a mount substrate (5). The conductor tracks (6) for electrical connection of the ... | 12/25/2007 |
| 7310233 | Apparatus and method for transferring heat from an electrical module An apparatus for transferring heat from an electrical module includes: (a) a thermally conductive base member having a plurality of edges establishing a polygonal perimeter and having a first side for presentation toward the electrical module; and (b) a heat transfe... | 12/18/2007 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7310236 | Electronic device A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing preven... | 12/18/2007 |
| 7303406 | Device for controlling a vehicle A device for controlling a vehicle 8 has a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and ... | 12/04/2007 |
| 7304852 | Inverter apparatus An inverter assembly including a storage compartment for multiple cables adapted to be releasably connected to the inverter. A body of the inverter assembly includes interior and exterior fins for the dissipation of heat energy. ... | 12/04/2007 |
| 7304849 | Compliant thermal cap for an electronic device A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion a... | 12/04/2007 |
| 7300182 | LED light sources for image projection systems In accordance with the invention a light source for an image projection system comprises one or more LEDs packaged for high temperature operation. Advantageously, the LED die are disposed on a package comprising a ceramic coated metal base including one or more unde... | 11/27/2007 |
| 7294530 | Method for encapsulating multiple integrated circuits A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first e... | 11/13/2007 |
| 7295439 | Heat sink fastening assembly A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pres... | 11/13/2007 |
| 7291023 | Electric vehicle motion sensor A motor vehicle motion sensor assembly includes a daughter board assembly having an alignment feature, a circuit board having electronic components, and a housing element having a receiving feature for receiving the daughter board assembly. The circuit board is elec... | 11/06/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7292440 | Heat dissipating sheet and plasma display device including the same A plasma display device entirely distributes the temperature of a heat generator, and improves the detachability of a heat dissipating sheet and coherence with the heat generator. The plasma display device includes a plasma display panel for displaying an image, a c... | 11/06/2007 |
| 7289330 | Heat sink assembly having a fan mounting device A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaini... | 10/30/2007 |
