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"Rail travel at high speeds is not possible because passengers, unable to breathe, would die of asphyxia."
Dionysius Lardner, Professor of Natural Philosophy and Astronomy at University College, London ; 1830
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| Number | Title | Issue Date |
| 6903490 | Longitudinal mode optical latching relay A piezoelectric optical relay array having one or more array elements. Each array element contains a transparent mirror housing, located at the intersection of two optical paths. A liquid metal slug is moved within a channel passing through the transparent mirror ho... | 06/07/2005 |
| 6903493 | Inserting-finger liquid metal relay An electrical relay comprising having two wettable electrical contacts supporting a conducting liquid. A non-wettable switch finger is moved between first and second positions between the electrical contacts by action of an actuator. In the first position the switch... | 06/07/2005 |
| 6903931 | Cold plate assembly An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body... | 06/07/2005 |
| 6900986 | Power module A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconduc... | 05/31/2005 |
| 6894901 | Light source comprising a large number of light-emitting diodes A light source is described, which is composed of a large number of light-emitting diodes (7) in an array arrangement. The light source comprises a mounting board (2) on which a flexible printed circuit (4) is adhesively bonded, on whose free su... | 05/17/2005 |
| 6894906 | Housing for in-line video, keyboard and mouse remote management unit Methods and devices provide for remote management of a local computer utilizing a compact, portable interaction device for external connection to a local computer and a network. The interaction device includes a thermally conductive housing with circuit boards dispo... | 05/17/2005 |
| 6891724 | Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond d... | 05/10/2005 |
| 6881265 | Grease rework applicator A grease applicator is assembled from three parts, a base unit, a cap unit and a slider unit. The base unit has tenons that couple with corresponding slots in the cap unit to form a cavity with a window opening on a first surface and a slider opening on a second sur... | 04/19/2005 |
| 6882534 | Fastening device for heat slug A fastening device for heat slug includes a frame, two projections and a heat slug. The frame defines an accommodating space therein. The projections are formed on the frame. The heat slug has a plurality of shoulders and is located in the accommodating space. The f... | 04/19/2005 |
| 6882538 | Intelligent power module The power part and the logic part of the module are arranged on different substrates. The circuit board (5) of the logic part has a recess (6) in which the power substrate (2) is located and electrically connected to the logic part by wire bondi... | 04/19/2005 |
| 6873043 | Electronic assembly having electrically-isolated heat-conductive structure An electronic assembly equipped with a heat-conductive structure, and to a method of conducting heat from a circuit device within such an assembly. The heat-conductive structure comprises an interconnect layer, a contact layer, and an electrically insulating layer b... | 03/29/2005 |
| 6873529 | High frequency module There is presented a high frequency module, in which a recess 2a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2, and a recess 2b for mounting surface acoustic wave filter is formed on a... | 03/29/2005 |
| 6870738 | Power semiconductor module The invention provides a power semiconductor module including a power converter module with an improved configuration technology that minimizes or eliminates the need for a positive bonding (soldering/adhesive) connection between a power semiconductor element and a ... | 03/22/2005 |
| 6868602 | Method of manufacturing a structural frame A structural frame (12) for dissipating heat from an electronic device (10) is provided. The structural frame (12), to which an electronic circuit board (14) containing a heat generating electronic component (16) is mounted, is inj... | 03/22/2005 |
| 6867976 | Pin retention for thermal transfer interfaces, and associated methods Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact with, and substantially conform to, a macroscopic surface of the object.... | 03/15/2005 |
| 6867365 | Sensor A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the c... | 03/15/2005 |
| 6867968 | Electronic control unit An electronic control unit installed on a high temperature heat source or in its vicinity exhibits an improved heat dissipation ability within its installation environment. The electronic control unit has a chassis incorporating a printed circuit board where electro... | 03/15/2005 |
| 6865084 | Thermally enhanced semiconductor package with EMI shielding A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate, and a thermally conductive member is stacked on the chip and electric... | 03/08/2005 |
| 6864567 | Base of LED A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an integral negative pole body at an inner side thereof, multiple upright negat... | 03/08/2005 |
| 6859367 | Heat sink attachment device Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagemen... | 02/22/2005 |
| 6846987 | Power electronics component The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the con... | 01/25/2005 |
| 6845012 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules 1 are arranged in such a manner that main surface directions of these... | 01/18/2005 |
| 6845013 | Right-angle power interconnect electronic packaging assembly The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the proc... | 01/18/2005 |
| 6842341 | Electrical circuit apparatus and method for assembling same An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320... | 01/11/2005 |
| 6835004 | Opto-electronic component packaging An opto-electronic package is provided for mounting on a module base. The package comprises a generally rectangular package. An optical connector extends from a first side of the package body along an optical axis, generally parallel to the module base. A radio freq... | 12/28/2004 |
| 6833991 | Passive cooling apparatus for an outdoor cabinet A cooling apparatus attaches to a cabinet housing electronics for protecting the electronics from external elements. The cooling apparatus includes an exterior surface for exposure to the external elements and a coupling that attaches the exterior surface to the cab... | 12/21/2004 |
| 6831834 | Assembly process and heat sink design for high powerd processor The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface o... | 12/14/2004 |
| 6831833 | Heat dissipator for optical writing and/or reproducing apparatus Disclosed is a heat dissipator for an optical writing and/or reproducing apparatus. The heat dissipator comprises a main base having mounted thereto a plurality of parts including at least one motor for optical writing and/or reproduction; a circuit board positioned... | 12/14/2004 |
| 6829145 | Separable hybrid cold plate and heat sink device and method An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials... | 12/07/2004 |
| 6829149 | Placement of sacrificial solder balls underneath the PBGA substrate The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the pac... | 12/07/2004 |
| 6829146 | Blindmate heat sink assembly An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A hea... | 12/07/2004 |
| 6822860 | WDM add/drop multiplexer module A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing memb... | 11/23/2004 |
| 6821625 | Thermal spreader using thermal conduits A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity val... | 11/23/2004 |
| 6817405 | Apparatus having forced fluid cooling and pin-fin heat sink A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing ... | 11/16/2004 |
| 6819565 | Cavity-down ball grid array semiconductor package with heat spreader A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer, and at least an opening for receiving at least a chip. The substrate... | 11/16/2004 |
| 6819566 | Grounding and thermal dissipation for integrated circuit packages In a microelectronic chip package for which grounding and thermal dissipation is desired, a cover is provided having an opening which is aligned with a contact on the substrate connected to ground potential. The cover is connected to the electronic device and the gr... | 11/16/2004 |
| 6816376 | Pluggable electronic module and receptacle with heat sink A receptacle assembly includes a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. One of the top, bottom and side walls has an opening therethrough, and a heat sink is mounted over the openin... | 11/09/2004 |
| 6813154 | Reversible heat sink packaging assembly for an integrated circuit A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302... | 11/02/2004 |
| 6809932 | Cover apparatus for dissipating heat and shielding electromagnetic interference A cover apparatus for a plug-in interface card is provided. The cover apparatus comprises a plate, which secures on a circuit board of a wireless local area network (WLAN) card. The plate has at least one concave corresponding to a chip on the WLAN card. The concave... | 10/26/2004 |
| 6809931 | Heat sink apparatus that provides electrical isolation for integrally shielded circuit In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive la... | 10/26/2004 |
