Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8164903 | Clamping part for pressing power components against a cooling surface The present invention relates to a clamping member for pressing power components (9) against cooling surfaces of the cooling flanges (7) of a housing, particularly for receiving an electronic circuit. The clamping member comprises a housing frame (1... | 04/24/2012 |
| 8159822 | Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive verti... | 04/17/2012 |
| 8102654 | Fixation structure for connector of in-vehicle controller A connector fixation structure includes: a connector having a rectangular connector body, protrusions protruding from facing sides in a wing like manner, and a terminal embedded in and protruding from the connector body; a heat sink having a plate shape body, a thro... | 01/24/2012 |
| 8072760 | Power inverter Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of th... | 12/06/2011 |
| 8040675 | Optical module According to an aspect of the embodiment, an optical module includes a case, an optical transceiver part in the case, a radiating part on the case; a thermal conductive sheet having a property of transferring and having a first end and second end; a first fixing par... | 10/18/2011 |
| 8023267 | Avionics chassis An avionics chassis comprises a housing having opposing walls, a pair of spaced card rails with one rail mounted to each of the opposing walls where each rail has a channel to define an effective slot between the rails, a circuit card assembly comprising a PCB and a... | 09/20/2011 |
| 8014151 | Electrical device, particularly for driving a motively and/or regeneratively operable electric machine An electrical device, particularly for driving a motively and/or regeneratively operable electric machine, having at least one switching-element module, which may be for inverting and/or rectifying electric currents, the switching-element module being able to be coo... | 09/06/2011 |
| 7983045 | Method and apparatus for inverted vortex generator for enhanced cooling Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the ... | 07/19/2011 |
| 7965514 | Assemblies and methods for dissipating heat from handheld electronic devices According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic inte... | 06/21/2011 |
| 7929307 | Memory module assembly and heat sink thereof A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the hea... | 04/19/2011 |
| 7911796 | Avionics chassis An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall compr... | 03/22/2011 |
| 7898808 | Mechanisms for heat transfer in an optical transceiver module and card cage system Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to ... | 03/01/2011 |
| 7889501 | Coil assembly, switching power supply, and projector A switching power supply includes: a coil; and a pedestal fixed to the coil, the pedestal includes a supporting member configured to support the coil in such a manner as to form a space through which air flows on a surface of the coil attached to the pedestal. ... | 02/15/2011 |
| 7885076 | Apparatus for and method of cooling molded electronic circuits An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally condu... | 02/08/2011 |
| 7864531 | Electronic device An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is la... | 01/04/2011 |
| 7796391 | Junction box to protect individual solar panels from overheating The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are press... | 09/14/2010 |
| 7791887 | Contour surface cooling of electronics devices The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of... | 09/07/2010 |
| 7773380 | Electrical configuration as heat dissipation design An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanicall... | 08/10/2010 |
| 7760505 | Power semiconductor module A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the s... | 07/20/2010 |
| 7755897 | Memory module assembly with heat dissipation device A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached... | 07/13/2010 |
| 7684196 | Enhancing the cooling of dual in-line memory modules An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connect... | 03/23/2010 |
| 7619892 | Positioning device for heatsink A positioning device for connecting a heatsink to a chip set includes a rectangular frame having a through hole in a center thereof, two side plates extending from two opposite sides thereof and each side plate has one hook extending from an inside thereof. Two posi... | 11/17/2009 |
| 7619891 | Plasma display apparatus A plasma display apparatus including a plasma display panel displaying images, a chassis base arranged behind the plasma display panel, and a heat conductive member and a porous adiabatic member arranged between the plasma display panel and the chassis base. ... | 11/17/2009 |
| 7589970 | Assembled structure of power semiconductor device and heat sink An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first insulating member includes a first opening and a second opening correspond... | 09/15/2009 |
| 7535715 | Conformable interface materials for improving thermal contacts A conformable paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle is disclosed. The paste is useful as an interface material for improving the thermal contact between two proximate solid surfaces, such as the surfaces of a heat ... | 05/19/2009 |
| 7522421 | Split core circuit module Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings di... | 04/21/2009 |
| 7495918 | Plasma display device A plasma display having improved heat sink efficiency and reduced manufacturing cost includes a heat sink member made of an inexpensive graphite material having excellent thermal conductivity instead of a more expensive aluminum protective plate or a heat sink plate... | 02/24/2009 |
| 7466552 | Heat-radiating structure and plasma display device including the same In a heat-radiating structure and a plasma display device including the same, an uneven shape is formed in a bed of a chassis base, and a heat sink is installed on a cover plate such that heat is radiated toward both sides of the cover plate. The heat-radiating stru... | 12/16/2008 |
| 7443681 | Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal t... | 10/28/2008 |
| 7440280 | Heat exchange enhancement A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes... | 10/21/2008 |
| 7440282 | Heat sink electronic package having compliant pedestal An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The hea... | 10/21/2008 |
| 7423878 | Plasma display panel assembly A plasma display panel (PDP) assembly with an air gap for improving heat dissipation is disclosed. In one embodiment, the PDP assembly includes: a panel assembly having a front panel and a rear panel coupled to the front panel, a chassis base supporting the panel as... | 09/09/2008 |
| 7420809 | Heat spreader in integrated circuit package An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises ... | 09/02/2008 |
| 7420811 | Heat sink structure for light-emitting diode based streetlamp A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower ... | 09/02/2008 |
| 7420810 | Base heat spreader with fins A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components. ... | 09/02/2008 |
| 7411792 | Thermal switch, methods of use and manufacturing methods for same The present disclosure concerns embodiments of a thermal switch used to control the transfer of heat from a heat source to a heat sink. According to one aspect, the thermal switch can be activated, or turned “on”, so as to establish a path of low thermal resista... | 08/12/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7408779 | Heat-dissipating element with connecting structures A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening ... | 08/05/2008 |
| 7405938 | Heat sink clip A heat sink assembly (100) and a heat sink clip (20) are provided. The heat sink clip (20) includes a pin (22) and a spring (24) disposed around the pin (22). The pin (22) includes an upper section (22a)... | 07/29/2008 |
| 7403395 | Power module structure and solid state relay using same A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the termi... | 07/22/2008 |
