Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 6347038 | Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp The assembly has a metal sole plate forming a heat sink carrying a printed circuit card. The sole plate includes bearing surfaces which project slightly beyond the rest of the sole plate. The printed circuit is supported on these bearing surfaces and they... | 02/12/2002 |
| 6324055 | Mobile information processing apparatus and covers for the mobile information processing apparatus and the desktop information processing apparatus A mobile information processing apparatus of the present invention having a main body and a display unit that opens and closes, attempts to improve heat releasing efficiency by allowing a transfer of heat which is released from a heat generating unit of t... | 11/27/2001 |
| 6324060 | Heat transfer interface A heat transfer interface is disclosed. The surface of the heat dissipating panel of a radiator formed by a heat dissipating substrate is machined, and then a second heat transfer layer is added thereon. The heat transfer layer is connected to the heat di... | 11/27/2001 |
| 6315038 | Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area thereof. The thermal interface is attached to the cooling d... | 11/13/2001 |
| 6313995 | Cooling system of a printed board A cooling system can cool electronic devices with assurance following the heights of the electronic devices mounted on a printed board. The cooling system is thin and light in weight and can easily inspect and maintain the electronic devices. A cooling pi... | 11/06/2001 |
| 6303209 | Electrical apparatus having metal case with thermal insulation An electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing the electrical device; and a film on the external surface i... | 10/16/2001 |
| 6304448 | Power module Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface o... | 10/16/2001 |
| 6292367 | Thermally efficient semiconductor chip A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits are high power circuits and, during operation, generate "h... | 09/18/2001 |
| 6288900 | Warpage compensating heat spreader A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiff... | 09/11/2001 |
| 6285552 | Rectifier of an alternating current generator for vehicle A heat sink of an alternating current generator for a vehicle has a heat sink body formed from aluminum die-cast. An insert member is provided on the heat sink body and a diode is provided on the insert member. The insert member (1) surrounds the side wal... | 09/04/2001 |
| 6281575 | Multi-chip module A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semi... | 08/28/2001 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the... | 08/14/2001 |
| 6260611 | Heat dissipation module A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the packaging rubber body is prevented from overflow. The present mod... | 07/17/2001 |
| 6236568 | Heat-dissipating structure for integrated circuit package A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure i... | 05/22/2001 |
| 6226183 | Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement In an arrangement composed of a substrate and a heat sink, the substrate is provided on a first side with at least one power component arranged on a first large-surface printed circuit trace and, on a second side opposite the power component, with a secon... | 05/01/2001 |
| 6225571 | Heatsink with high thermal conductivity dielectric The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing side... | 05/01/2001 |
| 6222733 | Device and method for cooling a planar inductor The invention relates to a device for cooling a planar inductance coil, in particular a planar transformer, on a plate-shaped support having a plurality of conducting layers, wherein at least one conducting layer of the support, in co-operation with a cor... | 04/24/2001 |
| 6219245 | Electrically isolated power switching device mounting assembly for EMI reduction A power electronics chassis (10) and liquid-cooled heat sink mounting assembly for electric vehicles and other applications that use liquid coolant to cool power electronic devices (20) contained within an electrically conductive housing (12). The power e... | 04/17/2001 |
| 6215661 | Heat spreader An electronic package (10) designed to be mounted in a space vehicle includes active electronic components that produce heat energy during operation and has a shear plate (12) attached to a heat sink (13). A heat spreader (11) includes an L-shaped plate o... | 04/10/2001 |
| 6212073 | Heat sink An automatically mountable heat sink for effectively conducting and dissipating heat of an electronic part comprises a heat dissipation plate formed by bending a rectangular metal plate of aluminum, copper or the like by means of pressing along the lines ... | 04/03/2001 |
| 6208519 | Thermally enhanced semiconductor package A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink... | 03/27/2001 |
| 6205024 | Heat sink for rectifier A heat sink for a rectifier comprises two heat sink plates, six nail connectors and six diodes. Six diodes are formed by with packaging six dice during the heat sink manufacturing process so that the six diodes are completely embedded into six holes. Ther... | 03/20/2001 |
| 6201696 | Package for semiconductor power device and method for assembling the same A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating sub... | 03/13/2001 |
| 6195256 | Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for surface mounting on a printed circuit board. The internal ... | 02/27/2001 |
| 6175497 | Thermal vias-provided cavity-down IC package structure A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive layer for attaching the substrate to the heat sink. The sub... | 01/16/2001 |
| 6154366 | Structures and processes for fabricating moisture resistant chip-on-flex packages A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one s... | 11/28/2000 |
| 6125036 | Moisture barrier seals for cooled IC chip module assemblies A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.... | 09/26/2000 |
| 6115255 | Hybrid high-power integrated circuit The circuit comprises a dielectric board (1) metallized on both sides and comprising a topological metallization pattern (2) on the face side thereof and with at least one mounting pad (3) located in a recess (4) of the face side of the board (1) on a hea... | 09/05/2000 |
| 6114048 | Functionally graded metal substrates and process for making same The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional inse... | 09/05/2000 |
| 6108205 | Means and method for mounting electronics The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly recessed in a carrier in the printed board. The chips is placed o... | 08/22/2000 |
| 6108208 | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules An electromechanical assembly, having a pressed joint with a low thermal resistance which is residue free when disassembled, includes: 1) an integrated circuit module having a contact surface of a first material; 2) a temperature regulating unit having a ... | 08/22/2000 |
| 6101092 | Heat-dissipating structure of an electronic part A heat-dissipating structure in which a cylindrical projecting portion is formed in a shield case so as to project inwardly of the shield case and contact an electronic part encased in the shield case. This heat-dissipating structure has high heat conduct... | 08/08/2000 |
| 6097602 | Integrated circuit package heat sink attachment An interface between an integrated circuit package and a heat sink comprises a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer impregnated in a liquid-permeable mounting mesh sheet sandwiched between ... | 08/01/2000 |
| 6091603 | Customizable lid for improved thermal performance of modules using flip chips Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primar... | 07/18/2000 |
| 6084775 | Heatsink and package structures with fusible release layer Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to... | 07/04/2000 |
| 6081426 | Semiconductor package having a heat slug A semiconductor package uses no thermosetting adhesive for mounting a heat slug thereon, which adhesive requires a strict control during the storage and the production thereof. A semiconductor package comprises a circuit board having respective surfaces a... | 06/27/2000 |
| 6081428 | Cooling apparatus for electric devices A cooling apparatus for cooling a plurality of electric devices mounted on a printed circuit board with high cooling efficiency and low cost. The cooling apparatus includes a cooling plate for receiving heat generated by said electric devices and transmit... | 06/27/2000 |
| 6075701 | Electronic structure having an embedded pyrolytic graphite heat sink material An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite embedded within a metallic casing and intimately contacting an... | 06/13/2000 |
| 6073684 | Clad casting for laptop computers and the like Disclosed is a casing for an electronic device which includes a heat dissipation layer, inner and outer insulative layers along either side of the heat dissipation layer, and a heat pipe which has a portion in thermal-transfer contact with the heat dissip... | 06/13/2000 |
| 6067232 | System for connecting subsystems of dissimilar thermal properties A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated circuit package mounted on the second side of the chassis;... | 05/23/2000 |
