Did You Know...
...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 4764845 | Cooled component assembly A component assembly is provided comprising a housing having connector means extending externally thereof, locating means mounted in the housing, a plurality of components located by said locating means, the components being connected to one another and t... | 08/16/1988 |
| 4753287 | Circuit board installation A thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation comprises a tubular metal housing of high thermal conductivity closed at one end and having at that end a screw-threaded stud... | 06/28/1988 |
| 4720770 | Constant impedance integrated circuit connector An interconnecting grid is disclosed for joining integrated circuit components. The grid has the form of a honeycomb, and is made up of a plurality of interconnected hexagonal conduits, each conduit surrounding an associated pin extended from the integrat... | 01/19/1988 |
| 4715115 | Package for water-scale semiconductor devices The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.... | 12/29/1987 |
| 4709301 | Package A method for forming a package, and corresponding package structure are disclosed. An electronic component is mounted on a substrate via a spacer, and the component is electrically connected to wiring embedded in the substrate. A space is defined in betwe... | 11/24/1987 |
| 4658331 | Mounting an integrated circuit chip to an etched circuit board An integrated circuit chip is mounted to an etched circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material each run extending between a contact pad that is exposed at a... | 04/14/1987 |
| 4612601 | Heat dissipative integrated circuit chip package An integrated circuit chip package has a substrate, a plurality of integrated circuit chips, a plurality of heat radiation plates, a heat radiation cover, a heat sink rigidly mounted on the heat radiation cover and a plurality of terminals. The plurality ... | 09/16/1986 |
| 4605986 | Cooled electrical circuit component, particularly switching-type semiconductor To increase the heat capacity of a heat sink and heat dissipating structure combined with an electrical component, typically a transistor, for example of the TO 220 or SOT 93 type, a heat transferring base plate (3), with the interposition of an insulatin... | 08/12/1986 |
| 4593342 | Heat sink assembly for protecting pins of electronic devices An electronic device, such as an integrated circuit chip, having pins for connection to a circuit board or the like is secured to a relatively massive heat sink. The heat sink is releasably secured to support means such that the electronic device and its ... | 06/03/1986 |
| 4591659 | Multilayer printed circuit board structure A composite printed circuit board structure including multiple layers of graphite interleaved with layers of a dielectric material, such as a polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layers are copper clad, and at le... | 05/27/1986 |
| 4583149 | Device for heat dissipation of printed circuit plates Printed circuit plates (12) are held at their edges in a housing (10) and carry on one side electrical components (16). For heat dissipation of the printed circuit plates (12) these plates carry a good heat conducting layer (20). The heat conducting layer... | 04/15/1986 |
| 4564801 | Semiconductor mounted on a yoke in heat transfer relationship A dimmer switch assembly consists of a conductive yoke which has two insulation housings connected thereto which carry respective subassemblies for the dimmer switch. A cavity in the first housing receives the main power semiconductor device of the dimmer... | 01/14/1986 |
| 4551787 | Apparatus for use in cooling integrated circuit chips An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is co... | 11/05/1985 |
| 4546410 | Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink An electronic circuit package mountable to a heat sink is provided with burstable membrane means adhesively stuck to the circuit package and containing thermoconductive material. Upon mounting of the circuit package to the heat sink, the membrane means ru... | 10/08/1985 |
| 4546411 | Mounting of a compact circuit package to a heat sink or the like A compact circuit package includes a housing providing a cavity for containing heat generating electrical components. A ceramic substrate is mounted to close the cavity. The package is adapted to be mounted in heat transferring relationship with a heat si... | 10/08/1985 |
| 4528615 | Repeater housing and circuit mounting structure An undersea communication cable system repeater housing and electronic circuits mounting structure includes a vessel having an electrical insulator covering an inside surface of the vessel. A heat conducting structure for mounting electronic circuits incl... | 07/09/1985 |
| 4521829 | Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards Integrated modules are disposed on a rigid printed circuitboard with the entire rear surface of each module in contact with a common cooling plate. The individual contact pressure of the integrated modules against the cooling plate occurs by way of resili... | 06/04/1985 |
| 4509096 | Chip-carrier substrates A substrate for a leadless chip carrier is formed on a rigid multi-layer circuit board. Layers of copper-clad invar are secured to opposite sides of the board, and on top of these are mounted respective layers of elastomeric material. An electrically-cond... | 04/02/1985 |
| 4503485 | Arrangement for carrying electrical and/or electronic components An arrangement for mounting circuit components which operate at high power densities at high potential levels, which arrangement includes means defining a major and a minor insulating layer on the latter of which the components are mounted, the arrangemen... | 03/05/1985 |
| 4367523 | Rectifier bridge unit A highly compact rectifier unit constituted by a sub-assembly potted within an insulating case having a metal base plate of high thermal conductivity to provide a heat sink for dissipating heat generated by the sub-assembly to enhance the current rating a... | 01/04/1983 |
| 4314311 | Plug-in card support providing electric and thermal connections A card-edge connector support providing electric and thermal connections for cards or boards of the printed circuit type in which removal of thermal energy constitutes an essential requirement. The support comprises a common flat base adapted to carry a p... | 02/02/1982 |
| 4258411 | Electronic device packaging arrangement The subject electronic device packaging arrangement is designed to enhance heat transfer from an electronic device to the printed circuit board to which it is attached. This is accomplished by employing a thermally conductive base having a depression in t... | 03/24/1981 |
| 4186422 | Modular electronic system with cooling means and stackable electronic circuit unit therefor A modular electronic system having cooling means has a plurality of stacked electronic circuit units. Each stackable circuit unit has a rectangular frame having a pair of end members which support a plurality of spaced-apart, cooling channels. A cooling p... | 01/29/1980 |
| 4162514 | Arrangement for semiconductor power components An arrangement for semiconductor power components in an installation, in which at least one semiconductor power component is placed between contact pieces and is enclosed in a housing exhibiting an insulator and connecting pieces. The arrangement includes... | 07/24/1979 |
| 4151547 | Arrangement for heat transfer between a heat source and a heat sink An arrangement for improving the transfer of heat from a heat source to a heat sink. The improvement is provided by the use of a malleable dimpled wafer which is deformed between the heat source and heat sink so as to improve the direct contacting of the ... | 04/24/1979 |
| 4092697 | Heat transfer mechanism for integrated circuit package Heat is removed from silicon devices in an integrated circuit package by means of a thermal liquid material contained in a film mounted on the underside of a cover enclosing the integrated circuit device. The film is electrically non-conductive and the fi... | 05/30/1978 |
| 4069498 | Studded heat exchanger for integrated circuit package Heat is removed from the silicon devices in an integrated circuit package by means of a stud which is slidably mounted in a cap enclosing the integrated circuit device. A low melt solder is used to join the stud to the cap and the same solder is also depo... | 01/17/1978 |
| 4060847 | Cooling arrangement for electrical power contactor A power contactor device includes at least one power relay contained within an electrically insulating plastic housing. Electrical busses carrying current to the relay contacts also serve as a means for removing the heat generated by those contacts and ot... | 11/29/1977 |
