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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 8184438 | Control device A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic ... | 05/22/2012 |
| 7961469 | Method and apparatus for distributing a thermal interface material Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink.... | 06/14/2011 |
| 7813132 | Heat dissipation assembly A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface materi... | 10/12/2010 |
| 7729108 | Information handling systems having coatings with porous particles and processes of forming the same Particles having a relatively high porosity can be used in an information handling system or other information handling system. In one aspect, a portable information handling system can include an electrical circuit that can generate thermal energy during normal ope... | 06/01/2010 |
| 7609513 | Portable electronic device A portable electronic device includes a cover (10), a container (20) and a heater (40). The container is provided on the cover. The heater includes some exothermic materials. The heater is received in the container. ... | 10/27/2009 |
| 7593229 | Heat exchange enhancement A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surfa... | 09/22/2009 |
| 7589969 | Folding protective cover for heat-conductive medium A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollo... | 09/15/2009 |
| 7554807 | Heat sink having protective device for thermal interface material spread thereon A protective device (10) comprises a cap (100) and a strap (120) connecting with the cap (100). The cap (100) defines a cavity (102) which is adapted for accommodating thermal interface material (300) spread on a bott... | 06/30/2009 |
| 7489512 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature wit... | 02/10/2009 |
| 7441593 | Protective cover for heat-conductive material of heat sink A protective cover for protecting heat-conductive material of a heat sink includes a first plate with an opening to enclose the heat-conductive material and a second plate foldable to the first plate. Such that the heat-conductive material can be precisely protected... | 10/28/2008 |
| 7440280 | Heat exchange enhancement A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes... | 10/21/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7431072 | Heat sink with increased cooling capacity and semiconductor device comprising the heat sink A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of th... | 10/07/2008 |
| 7417078 | Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher ... | 08/26/2008 |
| 7385812 | Method and apparatus for a thermally conductive packaging technique for cooling electronic systems A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The... | 06/10/2008 |
| 7385821 | Cooling method for ICS The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an inte... | 06/10/2008 |
| 7382620 | Method and apparatus for optimizing heat transfer with electronic components A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Inc... | 06/03/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7372704 | Heat dissipating structure for IC chip of plasma display module and plasma display module having the same A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7365983 | Grease protecting apparatus for heat sink A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to th... | 04/29/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7365990 | Circuit board arrangement including heat dissipater A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices o... | 04/29/2008 |
| 7365972 | Electronic device with dual heat dissipating structures An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed o... | 04/29/2008 |
| 7361885 | Two-dimensional image detector A Pb plate and a base board loading electronic components such as a signal processing circuit and a power supply circuit are disposed on a case side so as to decrease the weight and the thickness of a sensor section. Besides, the case has a mechanical strength enoug... | 04/22/2008 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is form... | 04/22/2008 |
| 7362577 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 04/22/2008 |
| 7362583 | Thermal management device for multiple heat producing devices A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal s... | 04/22/2008 |
| 7358836 | Shield, and printed circuit board and electrical apparatus employing the same A shield is provided for a circuit breaker including a printed circuit board (PCB). The PCB is a generally planar member with a plurality of electrical components each having a corresponding shape. The shield includes at least one resilient sheet member at least par... | 04/15/2008 |
| 7358606 | Apparatus to compensate for stress between heat spreader and thermal interface material A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the ide... | 04/15/2008 |
| 7355276 | Thermally-enhanced circuit assembly A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conduct... | 04/08/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7352585 | Flip chip heat sink package and method An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first... | 04/01/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7348665 | Liquid metal thermal interface for an integrated circuit device A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in ... | 03/25/2008 |
| 7349219 | Memory module assembly including a clip for mounting a heat sink thereon A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat... | 03/25/2008 |
| 7349210 | Grease cover for heat dissipating apparatus A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53 | 03/25/2008 |
| 7348792 | Packaging reliability super chips A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ub... | 03/25/2008 |
| 7342794 | Heat sink with integral card guide A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least on... | 03/11/2008 |
| 7329948 | Microelectronic devices and methods A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When ... | 02/12/2008 |
