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| Number | Title | Issue Date |
| 7359210 | Shock absorbing system for circuit boards A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may in... | 04/15/2008 |
| 7355857 | Heat sink gasket A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the recept... | 04/08/2008 |
| 7355858 | Heat sink for surface-mounted semiconductor devices and mounting method A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-acti... | 04/08/2008 |
| 7355148 | Temperature exchanging element made by extrusion, and its applications The invention relates to a temperature exchanging element made by extrusion and able to receive a heating element and/or heat conducting element, and radiation fins. It is constituted of a single-piece base incorporating an external face equipped with means to recei... | 04/08/2008 |
| 7355855 | Compliant thermal interface structure utilizing spring elements A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a ... | 04/08/2008 |
| 7353859 | Heat sink with microchannel cooling for power devices An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are inte... | 04/08/2008 |
| 7355431 | Test arrangement including anisotropic conductive film for testing power module A testing apparatus and method for testing a semiconductor device, and more particularly a test arrangement for measuring a guaranteed power loss of a semiconductor module, not requiring the module to have on-board decoupling capacitors for the power loss test. The ... | 04/08/2008 |
| 7355848 | System and method for removing heat from a subscriber optical interface A system and method removes heat from an enclosure or housing of a subscriber optical interface. When a subscriber optical interface housing is attached to a structure such that a partially enclosed volume of space remains between the structure and the subscriber op... | 04/08/2008 |
| 7355851 | Power adapter with fan assembly and control circuit A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes a fan assembly (which is integral to the housing) to draw in air. The... | 04/08/2008 |
| 7355853 | Module structure and module comprising it A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history... | 04/08/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7352585 | Flip chip heat sink package and method An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first... | 04/01/2008 |
| 7352581 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit inc... | 04/01/2008 |
| 7352582 | Reinforcing structure, display device, and electronic apparatus To provide a display device with high reliability, which is capable of supporting a display panel well even when the display panel is enlarged, and capable of radiating the heat generated in the display panel well. A display device 100 of the present inventio... | 04/01/2008 |
| 7352583 | Flexible lead for a pressfit diode bridge An improvement to a bridge rectifier assembly of the type used to convert alternating current produced by an motor vehicle alternator into direct current. The bridge rectifier assembly of this type comprises a heat sink, a plurality of pressfit diodes installed in t... | 04/01/2008 |
| 7350299 | Method for reducing socket warpage A method and a structure for reducing socket warpage in an embodiment by forming at least one groove in a socket housing contiguous to a surface mount region for an electrical device and securing a rigid bar in the groove. ... | 04/01/2008 |
| 7350999 | Trash can plug A fastener and plug device for mounting a trashcan bar to a trashcan and for covering the hollow ends of the trashcan bar includes a plug portion and a fastener portion. The plug portion includes an end cap and a plurality of spaced apart discs for enclosing the ope... | 04/01/2008 |
| 7352586 | Auxiliary supporting structure of circuit board and assembling method for the same An auxiliary supporting structure of a circuit board is for supporting at least one part of the circuit board. The circuit board has a CPU socket for connected to a CPU, and a through hole through which a heat sink fixing element passes. The auxiliary supporting str... | 04/01/2008 |
| 7347249 | Fixing device for a radiator A fixing device for a radiator provides a joining side projecting outward from a lateral side of each of the elastic strip members and has an engaging part at two inclining ends of the respective elastic strip member. The respective joining side is inserted into a l... | 03/25/2008 |
| 7349225 | Multifunctional composite sandwich element with embedded electronics A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core region, embedded electrical conductors within the central... | 03/25/2008 |
| 7349220 | Memory module assembly A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping th... | 03/25/2008 |
| 7349217 | IC socket assembly The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit b... | 03/25/2008 |
| 7349207 | Heat dissipating audio systems and methods thereof An audio system includes a housing which has at least one port, at least one speaker driver with a diaphragm located in the housing, a tube made of one or more thermally conductive materials and having at least two openings, and at least one electronic component whi... | 03/25/2008 |
| 7349219 | Memory module assembly including a clip for mounting a heat sink thereon A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat... | 03/25/2008 |
| 7349218 | Locking device for a heat sink A locking device is for locking a heat sink to an electronic device. The locking device includes a retaining frame and a guiding member positioned on the retaining frame. The guiding member includes a seat having a base sitting on the retaining frame, a sleeve exten... | 03/25/2008 |
| 7347349 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 03/25/2008 |
| 7349210 | Grease cover for heat dissipating apparatus A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53 | 03/25/2008 |
| 7349214 | Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of... | 03/25/2008 |
| 7349221 | Device for increased thermal conductivity between a printed wiring assembly and a chassis A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the ro... | 03/25/2008 |
| 7345885 | Heat spreader with multiple stacked printed circuit boards A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein. ... | 03/18/2008 |
| 7345880 | Heat sink module A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened... | 03/18/2008 |
| 7345879 | Heat dissipation device A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a bas... | 03/18/2008 |
| 7344384 | Bolster plate assembly for processor module assembly Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolst... | 03/18/2008 |
| 7342792 | Chassis structure for plasma display module and plasma display module including the chassis structure A chassis structure for a plasma display module, and a plasma display module including the chassis structure effectively dissipate heat generated by a plasma display panel and improve assembly of the plasma display module. The chassis base includes: a front plate; a... | 03/11/2008 |
| 7342794 | Heat sink with integral card guide A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least on... | 03/11/2008 |
| 7342795 | Heat sink assembly A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204... | 03/11/2008 |
| 7341460 | Electrical connector An electrical connector for electrically connecting a chip module with a printed circuit board (3), the printed circuit board (3) defines a number of second holes (3) and a central hole, (3) the electrical connector comprises, a housing (... | 03/11/2008 |
| 7342298 | Metal lid with improved adhesion to package substrate A metal lid for packaging semiconductor chips is stamped to form a sloped sidewall with a set-back from the edge of a package substrate. After the metal lid is placed over the semiconductor chip, molding compound is formed around portions of the exposed perimeter of... | 03/11/2008 |
| 7342787 | Integrated circuit cooling apparatus and method In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium... | 03/11/2008 |
| 7342797 | Interposable heat sink for adjacent memory modules A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first ... | 03/11/2008 |
