Quotables
"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 7333343 | Titanium crash survivable memory unit A high strength, light weight crash survivable memory unit (CSMU). The CSMU includes memory storage devices surrounded by a heat resistive material. A housing surrounds the heat resistive material. The housing includes a plurality of panels that include Titanium. Tw... | 02/19/2008 |
| 7331377 | Diamond foam spray cooling system A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section... | 02/19/2008 |
| 7330354 | Mobile terminal device and method for radiating heat therefrom In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the elec... | 02/12/2008 |
| 7330355 | Fixed pillar with heat loss A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body. The plurality of grooves is respectively set on two sides of the metal... | 02/12/2008 |
| 7330356 | Case of mobile terminal A case for a mobile terminal is provided which allows for improved dissipation of heat generated by internal components. The improved case includes a first cover coupled to a second cover with a space formed therebetween to accommodate a heat generating portion of t... | 02/12/2008 |
| 7330352 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 02/12/2008 |
| 7330353 | Modular heat sink fin modules for CPU A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individua... | 02/12/2008 |
| 7329948 | Microelectronic devices and methods A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When ... | 02/12/2008 |
| 7329008 | Shock-resistant arrangement for, and method of, protecting a heat source from damage A lightweight, compact image projection system, especially for mounting in a housing having a light-transmissive window, is operative for causing selected pixels in a raster pattern to be illuminated to produce an image of high resolution of VGA quality or higher in... | 02/12/2008 |
| 7327569 | Processor module with thermal dissipation device Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and... | 02/05/2008 |
| 7327577 | Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes the... | 02/05/2008 |
| 7327150 | Integrated circuit package resistance measurement For one embodiment, an integrated circuit includes a node to couple one or more components to the integrated circuit to carry current through a package for the integrated circuit. The integrated circuit also includes a monitor to measure a resistance of the package ... | 02/05/2008 |
| 7327571 | Thermal load balancing systems and methods Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat si... | 02/05/2008 |
| 7327573 | Heat sink clip with cammed handle A heat sink clip (1) includes a main body (10), a post (40), a spring (50) and a cammed handle (30). The main body includes a horizontal portion (12) and two locking arms (16). A locking hole (17) is defined in... | 02/05/2008 |
| 7327574 | Heatsink module for electronic device A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The re... | 02/05/2008 |
| 7327028 | Embedded heat spreader for folded stacked chip-scale package In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shape... | 02/05/2008 |
| 7327037 | High density nanostructured interconnection A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one ... | 02/05/2008 |
| 7327022 | Assembly, contact and coupling interconnection for optoelectronics A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip ... | 02/05/2008 |
| 7325941 | Backlight assembly A backlight assembly having protrusions in a side surface between a side supporter and a cover shield is provided. The protrusions prevent the cover shield from being deformed by an external force and prevent disconnection of a wire between the side supporter and th... | 02/05/2008 |
| 7327015 | Semiconductor device package A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall... | 02/05/2008 |
| 7327575 | Locking device for heat sink A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) definin... | 02/05/2008 |
| 7327027 | Thermal interface structure with integrated liquid cooling and methods A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are... | 02/05/2008 |
| 7324344 | Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit b... | 01/29/2008 |
| 7324342 | Electronics assembly and electronics package carrier therefor An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly al... | 01/29/2008 |
| 7324353 | Image display apparatus and shield casing thereof A shield casing of an image display apparatus including a casing which covers other than a front surface of an image display device having an electromagnetic wave emitter and shielding the electromagnetic waves, a protection panel on which a conductive film is lamin... | 01/29/2008 |
| 7323767 | Standoffs for centralizing internals in packaging process A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrat... | 01/29/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7323358 | Method and system for sizing a load plate A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed... | 01/29/2008 |
| 7323796 | Motor-driven tool In a motor-driven tool, a carbon brush part 8 is arranged between a suction port 6 and a commutator 11 of the motor and includes a cylindrical side wall 8a. The cylindrical side wall 8a located on an outer periphery o... | 01/29/2008 |
| 7322400 | Cooling apparatus having low profile extrusion A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process. ... | 01/29/2008 |
| 7324343 | Thermally conductive holder The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive composition. The thermally conductive composition includes a silicone rubbe... | 01/29/2008 |
| 7321491 | Heat sink for a portable computer A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portab... | 01/22/2008 |
| 7321493 | Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions c... | 01/22/2008 |
| 7321492 | Heat sink module for an electronic device Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate an... | 01/22/2008 |
| 7321490 | Connecting apparatus of notebook computer display card A connecting apparatus of a notebook computer display card is described. The connecting apparatus has a motherboard and a dual in-line module slot. The dual in-line module slot for coupling to a notebook computer display card is disposed on a surface of the motherbo... | 01/22/2008 |
| 7319588 | Heat dissipation device A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation u... | 01/15/2008 |
| 7319592 | Recyclable protective cover for a heat-conductive medium A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, a... | 01/15/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7319593 | Industrial light fixture with spring-bracket over capacitor An industrial light fixture of the type including a housing with a base member and a top member and containing power-related components includes a spring-bracket secured to bracket-securement point(s), extending along the capacitor to hold the capacitor in place and... | 01/15/2008 |
| 7317618 | Combined board level shielding and thermal management An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical compon... | 01/08/2008 |
