Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 8184437 | Modular test systems for severe environments A modular equipment testing apparatus is suitable for use in severe environments. The testing apparatus comprises a base computing unit, an interchangeable test instrument board, and an interchangeable equipment interface pod. The base computing unit and the interch... | 05/22/2012 |
| 8154864 | LED display module having a metallic housing and metallic mask The present invention is a robust LED display module for use in an electronic sign which display module includes a metallic housing, a heat conductive interface panel, an LED circuit board and LEDs, and a metallic mask arranged in intimate contact and association th... | 04/10/2012 |
| 8154872 | Portable hand held multi-source power inverter with pass through device A portable hand held power inverter/converter having a pass through device for simultaneously sourcing A.C. and multiple voltage D.C. power consuming devices through a single D.C. power source connection. Inverter and converter circuitry is provided to invert and co... | 04/10/2012 |
| 8144469 | Processor loading system A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, w... | 03/27/2012 |
| 8139355 | Memory module connector having memory module cooling structures One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM co... | 03/20/2012 |
| 8134835 | Compression clamping of semiconductor components The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated c... | 03/13/2012 |
| 8130498 | Heat sink of at least one electronic component The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on the first cooling body section, between the cooling body and the at le... | 03/06/2012 |
| 8089767 | Cooling system, cold plate and assembly having a cooling system A cooling system comprising a heat sink having, a first contact zone and a second contact zone, which are configured to absorb, a first heat flow from a first component, a second heat flow from a second component, and a first transmission means for transmission of t... | 01/03/2012 |
| 8085541 | Thin flat panel video display This document describes apparatus and methods for supplying electrical operating power to a thin form-factor display device, such as a flat panel video display device. In an illustrative example, components of a power supply for a flat panel video display are arrang... | 12/27/2011 |
| 8077466 | Heat sink, semiconductor device, and method of manufacturing heat sink A heat sink 109 is configured by a plate component having a combined structure composed of a recess and a projection formed thereon, wherein the recess is formed by allowing a part of the plate component to be set back from the surface level of the residual r... | 12/13/2011 |
| 8072759 | Electronic device According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit b... | 12/06/2011 |
| 8064202 | Sandwich structure with double-sided cooling and EMI shielding A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top struc... | 11/22/2011 |
| 8031470 | Systems and methods for thermal management A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclo... | 10/04/2011 |
| 8027163 | Display device A display device is disclosed. In one embodiment, the display device includes i) a display panel configured to display an image, ii) a chassis base configured to support the display panel, iii) an auxiliary chassis disposed between the display panel and the chassis ... | 09/27/2011 |
| 8018722 | Double bonded heat dissipation Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation. ... | 09/13/2011 |
| 8009420 | Heat transfer of processing systems A processing module may be provided. The processing module may include a mounting member configured to structurally support a first processing unit and receive thermal energy from the first processing unit through a coupling side of the first processing unit by cond... | 08/30/2011 |
| 7990699 | Heat dissipation device for memory module A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipe... | 08/02/2011 |
| 7978467 | Key sheet, press switch and electronic device provided with the press switch It is an object of the present invention to provide a key sheet and the like which can suppress local elevation of temperature, and effectively diffuse heat loss from electronic circuits. The key sheet includes: a viscoelastic sheet 16b having a viscoe... | 07/12/2011 |
| 7969730 | Portable computer with thermal control and power source shield A portable computer having a partially sealed cooling system is disclosed. The portable computer contains heat transfer materials that function to remove heat from a sealed area of the portable computer to an unsealed area where the heat may be more effectively diss... | 06/28/2011 |
| 7969739 | Heat diffusing structure of a portable electronic apparatus A portable electronic apparatus includes a first unit, a second unit, and a hinge unit. The first unit includes a first housing, a heat generating component inside the first housing, a first heat diffusing member disposed inside the first housing and diffusing heat ... | 06/28/2011 |
| 7969740 | Metal-based print board formed with radiators In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the meta... | 06/28/2011 |
| 7957131 | Electronic device thermal management An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device s... | 06/07/2011 |
| 7952879 | System and apparatus for efficient heat removal from heat-generating electronic modules This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating d... | 05/31/2011 |
| 7944697 | Electronic equipment Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an... | 05/17/2011 |
| 7944696 | Electronic apparatus An electronic apparatus includes a chassis and a heat sink. The heat sink forms one side wall of the chassis. The heat sink has inner and outer wall surfaces corresponding to inner and outer surfaces of the chassis. The heat sink has a guide portion guiding a drop o... | 05/17/2011 |
| 7936561 | LED heat dissipation aluminum bar and electricity conduction device A light-emitting diode (LED) heat dissipation aluminum bar and electricity conduction device includes a heat dissipation aluminum bar having a structure formed of multiple sections each having multiple heat dissipation fins. The heat dissipation aluminum bar forms a... | 05/03/2011 |
| 7933126 | Solid state relay with internal heat sink A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system. ... | 04/26/2011 |
| 7929293 | Heat dissipating assembly A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top ... | 04/19/2011 |
| 7920383 | Heat sink for dissipating heat and apparatus having the same A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat sour... | 04/05/2011 |
| 7911795 | Electronic device including electronic component, heat dissipating member and alloy layer A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 03/22/2011 |
| 7903412 | Mounting socket that dissipates heat from a network device A socket for mounting a network device is provided. The socket includes a top portion and a bottom portion. The top portion and bottom portion are sized to engage with a network communication device that may be inserted into an interior of the socket from a first si... | 03/08/2011 |
| 7903410 | Package board and method for manufacturing thereof A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in ... | 03/08/2011 |
| 7903411 | Cold plate stability A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin move... | 03/08/2011 |
| 7894192 | Integrated circuit package support system A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The stru... | 02/22/2011 |
| 7876553 | Flat-panel display apparatus According to the present invention, the amount of usage of a heat conductive member for fixing a self-luminous flat display panel to a metallic chassis member disposed at the back of the display panel is reduced in the thickness direction as well as in the surface d... | 01/25/2011 |
| 7876565 | Method of obtaining enhanced localized thermal interface regions by particle stacking Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pres... | 01/25/2011 |
| 7869215 | Portable electronic device incorporating extendable heat dissipation device An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The f... | 01/11/2011 |
| 7859847 | Spring adapted to hold electronic device in a frame An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring ... | 12/28/2010 |
| 7848107 | Heatsink mounting system A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a... | 12/07/2010 |
| 7843696 | Heat sink assembly A heat sink assembly includes a heat sink main body and a contact member attached to a base of the heat sink main body. The contact member includes a container with thermal grease contained therein and a movable cover movably attached to the container. The container... | 11/30/2010 |
