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| Number | Title | Issue Date |
| 6424529 | High performance heat exchange assembly Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins and at least one porous reticulated foam block that fills the space between the fins.... | 07/23/2002 |
| 6418020 | Heat dissipation device with ribbed fin plates A heat dissipation device includes a thermally conductive base plate and a plurality of thermally conductive fin plates that are in thermal communication with the base plate. Each adjacent pair of the fin plates defines a channel therebetween, through whi... | 07/09/2002 |
| 6418033 | Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first solder bumps between the first and second microelectronic ... | 07/09/2002 |
| 6407917 | Fluid flow management system A fluid flow management system for enhancing cooling of a circuit pack. The system includes a bar extending transverse to the direction of fluid flow. The bar breaks up the otherwise laminar flow into a turbulent flow.... | 06/18/2002 |
| 6404632 | Mechanical configuration for retaining inboard mounting hardware on finned heat dissipating devices A method and apparatus to retain mounting hardware on a heat-sink or heat-pipe. One embodiment of the invention involves a method to assemble a component having a heat dissipation device with a plurality of heat dissipation fins on a substrate. A second e... | 06/11/2002 |
| 6404044 | Semiconductor package with stacked substrates and multiple semiconductor dice A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections w... | 06/11/2002 |
| 6404633 | Securing equipment for a heat dissipater of CPU A securing equipment for a heat dissipater of a CPU includes a holed main body, and a movable element. The heat dissipater is positioned in a holding member for the bottom to abut the top of the CPU. The main body has rear hooks separably connected to rea... | 06/11/2002 |
| 6396693 | Heat sink A heat sink includes a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink at one side, and two hook plates respectively... | 05/28/2002 |
| 6392887 | PLGA-BGA socket using elastomer connectors An electronic assembly that may include an elastomeric connector. The elastomeric connector may couple the solder ball of a BGA integrated circuit package to a substrate. The elastomeric connector provides an interconnect that may compensate for variation... | 05/21/2002 |
| 6392886 | Heat sink assembly A heat sink assembly includes a heat sink (30), a clip (20), and a fastener (10). The heat sink has a base (301) and a plurality of parallel fins (302) extending therefrom. A pair of barbs (303) is symmetrically formed on outmost sides of two adjacent cen... | 05/21/2002 |
| 6373702 | Cooling structure and display apparatus containing the cooling structure A cooling structure for cooling an exothermic panel such as a plasma display panel by releasing heat therefrom, comprising: a chassis structure for holding the exothermic panel; a plurality of circuit board connecting portions, a plurality of heat radiati... | 04/16/2002 |
| 6370025 | Electronic module An electronic module of the invention is so structured that a plurality of first electronic components are mounted on a top surface of a card-like substrate; a first radiating board is commonly stuck to two or more top surfaces of the first electronic com... | 04/09/2002 |
| 6366461 | System and method for cooling electronic components A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediate... | 04/02/2002 |
| 6365964 | Heat-dissipating assembly for removing heat from a flip chip semiconductor device A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the chip (12) when mounted to a flexible substrate (16). Heat is conducted from t... | 04/02/2002 |
| 6362959 | Docking station with thermoelectric heat dissipation system for docked portable computer A portable computer docking base has incorporated therein a thermoelectric cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer operatively docked to the base. The cooling system includes a thermoelectric (P... | 03/26/2002 |
| 6357514 | Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mounta... | 03/19/2002 |
| 6356435 | CPU fan assembly An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer ("PC") system and exhausts it from the PC prior to adversely affecting other... | 03/12/2002 |
| 6330153 | Method and system for efficiently removing heat generated from an electronic device A system for cooling an electronic device comprising a heat sink including a channel having an inlet and an outlet, with the channel coupled to an airflow generation system that generates airflow between the inlet and outlet. Heat is removed from an elect... | 12/11/2001 |
| 6330157 | Variable thermal exchanger and method thereof This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated de... | 12/11/2001 |
| 6319756 | Heat sink for chip stacking applications A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outsi... | 11/20/2001 |
| 6310776 | Transverse mountable heat sink for use in an electronic device The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat... | 10/30/2001 |
| 6301115 | Heat sink devices for use in electronic devices A heat sink device for use in desktop electronic devices comprises a heat sink which can be firmly attached to a CPU assembly with extremely great strength. The holes to be formed in the CPU circuit board of the CPU assembly or the heat sink can be made a... | 10/09/2001 |
| 6288899 | Method and apparatus for heat dissipation in a multi-processor module This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. T... | 09/11/2001 |
| 6282089 | Portable computer cooling method and computer holder A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the at... | 08/28/2001 |
| 6278607 | Smart bi-metallic heat spreader A variable area heat sink has a first heat sink area and a second heat sink area. A bridge is connected to the first heat sink area and includes a bi-metallic portion operable to connect and disconnect with the second heat sink area in response to a tempe... | 08/21/2001 |
| 6269002 | Heat sink with flow guide A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base w... | 07/31/2001 |
| 6263955 | Heat sink with open region A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base w... | 07/24/2001 |
| 6263067 | Telephone exchange related main distribution arrangement The invention comprises a main distribution arrangement for a telephone exchange, including a rack (1); several subscriber-related connectors whose positions are affixed to the rack, coordinated to one or more connection terminals (2a); and several extern... | 07/17/2001 |
| 6257327 | Heat sink including pedestal A heat sink including a pedestal. The heat sink is used to dissipate heat from an electrical component such as a processor (e.g., a Pentium.RTM. Pro processor). The pedestal is arranged on the heat sink such that a gap which is formed between a surface of... | 07/10/2001 |
| 6256201 | Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of... | 07/03/2001 |
| 6246584 | Heat sink A heat sink includes a thermally conductive body and at least one clip to secure the conductive body to a circuit board with a central processing unit interposed between the heat sink and the circuit board. The conductive body has a base with a flat botto... | 06/12/2001 |
| 6236568 | Heat-dissipating structure for integrated circuit package A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure i... | 05/22/2001 |
| 6233146 | Rotatable portable computer remote heat exchanger with heat pipe A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end per... | 05/15/2001 |
| 6230789 | Heat dissipating device and method making the same The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs thereon, an aluminum folded fin with a number of inverted U-sh... | 05/15/2001 |
| 6223815 | Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit A cooling unit having a first heat sink and a second heat sink. The first heat sink overlaps a heat-generating component. The second heat sink covers the first heat sink. The first heat sink having a plurality of heat-conducting sections extending away fr... | 05/01/2001 |
| 6223813 | Ultra high-density, high-performance heat sink An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be e... | 05/01/2001 |
| 6222265 | Method of constructing stacked packages A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections w... | 04/24/2001 |
| 6201700 | Box design for maximum heat dissipation A system and method for dissipating thermal energy created by multiple electronic circuit boards packaged within a single housing and while in operation are disclosed. The system and method enhances heat convection and heat conduction across and through t... | 03/13/2001 |
| 6201695 | Heat sink for chip stacking applications A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outsi... | 03/13/2001 |
| 6191944 | Heat sink for electric and/or electronic devices A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.... | 02/20/2001 |
