"I watched his countenance closely, to see if he was not deranged ... and I was assured by other senators after he left the room that they had no confidence in it."
U.S. Senator Smith of Indiana ; After seeing Samuel Morse demonstrate the telegraph.
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 5166862 | Panel for mounting electronics There is provided a panel for mounting electronic components to circuit breakers. The panel includes formations for cooling electronic components, a method for sealing the electronic adjustment switches against tampering, and a method for preventing inval... | 11/24/1992 |
| 5161089 | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same A thermally optimized piston for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section, a central cylindrical section, and a lower diverging section. In a preferred embodiment, the thermally... | 11/03/1992 |
| 5150274 | Multi-chip-module A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling sys... | 09/22/1992 |
| 5150278 | Finned housing An electrical component housing has a wall with an outwardly facing wall shaped to define rows of cooling fins with row channels between. Gaps are provided in the fin rows to define angle channels at 30° to 60° to the row channels.... | 09/22/1992 |
| 5138522 | Cabinet for housing electrical components A cabinet for housing electrical components therein, including a horizontal passage (42) for ventilation extending crosswise horizontally through a ceiling portion of the cabinet, a ventilation unit (43) allowing air to enter the horizontal passage (42), ... | 08/11/1992 |
| 5138521 | Electronic component assembly with direct mounting for proper and effective cooling This electronic component assembly includes: a body construction comprising a planar base portion, a fin provided as projecting from the planar base portion of the body construction, and a heat generating element fixedly attached to the planar base portio... | 08/11/1992 |
| 5133403 | Cooling arrangement for semiconductor devices and method of making the same A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN... | 07/28/1992 |
| 5105336 | Modular multilevel electronic cabinet An electronic cabinet is described which contains both control circuits containing heat producing components and a plurality of circuit breakers. The control circuits and the circuit breakers are located inside the cabinet with heat dissipating fins being... | 04/14/1992 |
| 5099254 | Modular transmitter and antenna array system A module for constructing a modular transmitter is disclosed. The module contains antenna elements along the front edge of a base. RF circuitry is fabricated on both the top and the bottom sides of the base. The base contains heat pipes to carry heat away... | 03/24/1992 |
| 5097385 | Super-position cooling A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip.... | 03/17/1992 |
| 5089935 | Control device case A control device case is disclosed which is comparatively small in size and is safe and easy to operate. The control device case includes a case body in the form of a rectangular hollow pipe having a substantially rectangular cross section. The case body ... | 02/18/1992 |
| 5072787 | Finned heat sink A radiator comprising a radiating block including a hollow air path through which cooling air flows, outer cooling faces on which a plurality of heated bodies to be cooled are mounted, and a plurality of cooling fins disposed within the hollow air path so... | 12/17/1991 |
| 5025307 | Modular semiconductor device A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that mem... | 06/18/1991 |
| 5023695 | Flat cooling structure of integrated circuit A circuit assembly with circulation of coolant. A plurality of chips of integrated circuit are arranged on a substrate separately from each other in rows and columns. A circulating unit disposed on the substrate and having a planar shape circulates coolan... | 06/11/1991 |
| 5019943 | High density chip stack having a zigzag-shaped face which accommodates connections between chips A high density integrated circuit module is comprised of a plurality of integrated circuit chips; each of the chips has top and bottom surfaces and thin sides; and all of the chips are arranged in a stack in which the sides of the chips form multiple face... | 05/28/1991 |
| 4953058 | Modular segment adapted to provide a passively cooled housing for heat generating electronic modules A modular segment that is adapted to receive heat generating electronic assemblies therewithin. The modular segments may be joined together to form a housing and the electronic assemblies are electrically interconnected through a hollow channel provided i... | 08/28/1990 |
| 4940085 | Fluid heat exchanger for an electronic component A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towa... | 07/10/1990 |
| 4928207 | Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston In an improved circuit module with a flat chip-carrying substrate and cylindrical pistons that contact the chips for cooling, each piston has an axial bore that carries a dielectric liquid to the chip and the lower face of the piston (facing the chip) is ... | 05/22/1990 |
| 4921043 | Shelter device for the production and thermal conditioning of apparatus, in particular electronic apparatus generating heat A container device for the protection and thermal conditioning of electronic apparatus generating heat consisting of two heat exchangers each consisting of a plurality of ring form, closed circuits, structurally independent, containing a fluid acting as a... | 05/01/1990 |
| 4920574 | Cooling system for an electronic circuit device A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coola... | 04/24/1990 |
| 4908734 | Housing for motor control unit A control unit according to the invention has a plastic case (v) housing only power components (v), such as transistors for an inverter, among components constituting a control circuit. Other circuit components such as resistors are mounted on a printed c... | 03/13/1990 |
| 4884168 | Cooling plate with interboard connector apertures for circuit board assemblies A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externall... | 11/28/1989 |
| 4765397 | Immersion cooled circuit module with improved fins A circuit module that contains a planar array of chips has an improved fin assembly that transfers heat to a liquid coolant that is circulated through the fins in a single pass so that there is a tendency for the upstream edge of the fins to run cold and ... | 08/23/1988 |
| 4724901 | Device for releasing heat A heat releasing device comprising a heat transmitting block having a heat source attaching portion and a bore extending therethrough, a looped heat pipe having at least one pair of straight tubular portions, the first of the straight tubular portions bei... | 02/16/1988 |
| 4682208 | Transistor protection device A transistor protection device in accordance with the present invention includes a base platform consisting of a flat aluminum board for fixing a power transistor with small screws or the like. A supporting plate is placed at a prescribed distance from th... | 07/21/1987 |
| 4660123 | Appliance for releasable fastening of a cooling member to an integrated module A spring clip, bent into a H-shaped and comprising a centrally-disposed opening corresponding to the core diameter of the cooling member, the spring clip comprising a parting line for a single-sided spreading upon introduction between the cooling ribs of ... | 04/21/1987 |
| 4601202 | Gas turbine engine component cooling system The invention comprises a system for cooling a component in a gas turbine engine, and, in particular, for cooling an engine electronic control thereof. The cooling system includes a housing for mounting the control having a plurality of heat transfer fins... | 07/22/1986 |
| 4594643 | Device for fixing a cooling member on the cooling surface of an integrated module A device for fixing a cooling member on the cooling surface of an integrated module, the cooling member having a base plate with several cooling fins disposed on opposite sides of a central core, has an insulating frame with two supporting yokes which res... | 06/10/1986 |
| 4588023 | Device for releasing heat A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged fins on at least one of its opposite sides, and a heat pipe ... | 05/13/1986 |
| 4468717 | Apparatus for cooling integrated circuit chips A multichip thermal conduction module has improved cooling in a housing having at least one board mounted therein including a plurality of chips on the board. A heat conducting plate is mounted in the housing adjacent the chips. A cold plate abuts heat co... | 08/28/1984 |
| 4449578 | Device for releasing heat A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged fins on at least one of its opposite sides, and a heat pipe ... | 05/22/1984 |
| 4447842 | Finned heat exchangers for electronic chips and cooling assembly A PC board supported by a frame has an electronic chip secured thereto. The chip has a pair of heat exchange fins. Each fin projects through a groove and into a channel of a cooling module intermediate a cooling surface of the cooling module and an expans... | 05/08/1984 |
| 4369838 | Device for releasing heat A heat releasing device comprising a base plate integrally formed with a multiplicity of tongue-like raised fins on at least one side thereof by skiving, each of the skived fins being divided at least at its forward end into a plurality of portions by sli... | 01/25/1983 |
| 4315300 | Cooling arrangement for plug-in module assembly An improved cooling arrangement for an electronic plug-in module assembly ving a plurality of modules supported in grooves in a pair of parallel sides. Each parallel side is provided with fluid passageways for carrying a cooling liquid for removing heat t... | 02/09/1982 |
| 4283754 | Cooling system for multiwafer high density circuit A high density arrangement for interconnecting integrated circuit devices, of a type which includes a stack of numerous wafers formed primarily of metal, wherein some of the wafers holding integrated circuit chips have overhanging edge portions at one sid... | 08/11/1981 |
| 4245273 | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices A package for mounting, interconnecting, and cooling a large number of integrated circuit semiconductor devices having a sintered multilayer ceramic substrate provided with an internal metallurgy network made up of voltage planes, X and Y signal planes, a... | 01/13/1981 |
| 4144932 | Heat sink for rotating electronic circuitry A heat dissipating and mounting structure for an electrical circuit includes a disc which is mounted to a rotatable shaft. The disc extends outward from the shaft to present a front surface upon which the circuit is mounted and a rear surface upon which c... | 03/20/1979 |
| 3993123 | Gas encapsulated cooling module A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains e... | 11/23/1976 |