Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 8085531 | Anisotropic thermal conduction element and manufacturing method An anisotropic thermal conductive element that can conduct heat from a thermal source with high efficiency in the thickness direction which maintaining strength and a method of making the element. To achieve the above, an anisotropic thermal conductive element that ... | 12/27/2011 |
| 8081465 | Cooling apparatus for semiconductor chips A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sh... | 12/20/2011 |
| 8081464 | High-voltage switch with cooling An exemplary encapsulated high-voltage switch is disclosed which contains a heat-generating current conductor, a metal encapsulation surrounding the current conductor, and a cooling element. A cooler of the cooling element is fixed on a part of the encapsulation tha... | 12/20/2011 |
| 8077465 | Heat sink assembly with fixing member A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing me... | 12/13/2011 |
| 8072758 | Automotive inverter assembly In an embodiment, an automotive inverter assembly has at least one component for cooling. The inverter assembly has a supporting body for supporting the at least one component. The supporting body defines at least part of a volume through which flows a cooling fluid... | 12/06/2011 |
| 8054629 | Microfins for cooling an ultramobile device The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device. ... | 11/08/2011 |
| 7944695 | Motor controller A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink (1), reducing the number of parts, and reducing the man-hours of assembling is provided. In a motor controller including an extrusion heat sink (1)... | 05/17/2011 |
| 7852632 | Heat dissipation module and detachable expansion card using the same A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring ... | 12/14/2010 |
| 7839630 | Heat dissipation device and computer using same A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation devi... | 11/23/2010 |
| 7826227 | Heat dissipation device A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the... | 11/02/2010 |
| 7778033 | Thermally conductive covers for electric circuit assemblies A method of producing a thermally conductive cover for an electric circuit assembly having a plurality of heat dissipating components is disclosed. The thermally conductive cover including a top surface, a bottom surface, and at least one rib extending downwardly fr... | 08/17/2010 |
| 7751192 | Heatsink method and apparatus A heatsink having tapered geometry that improves passive cooling efficiency is discussed. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flow... | 07/06/2010 |
| 7580263 | Heat dissipation device with a fan holder A heat dissipation device includes a heat sink assembly, a fan holder and two fans mounted on the two sides of the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and a fin assembly thermally co... | 08/25/2009 |
| 7573709 | Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes the... | 08/11/2009 |
| 7567435 | Heat sink assembly A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably co... | 07/28/2009 |
| 7539017 | Heat dissipating device for central processor A heat dissipating device includes an electric member, a heat sink having a base to be secured on the electric member. The base includes an upper surface and includes four corner areas, and includes four posts extended upwardly from the four corner areas thereof res... | 05/26/2009 |
| 7486515 | Fluid circulator for fluid cooled electronic device An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator includes a first thin sheet exhibiting a first coefficient of thermal expa... | 02/03/2009 |
| 7440261 | Power regulator with a bypass and splice capability A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a conductive resilient tab and a conductive rigid tab. The cooling fins are ... | 10/21/2008 |
| 7423877 | Heat dissipation device A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a mid... | 09/09/2008 |
| 7417859 | Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same A heat radiating assembly employable by a plasma display apparatus for radiating heat generated by a signal transmission unit, which transmits electric signals from a circuit unit that drives a plasma display panel and includes an electronic device covered by a prot... | 08/26/2008 |
| 7414848 | Heat dissipation device A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat... | 08/19/2008 |
| 7414845 | Circuit board assembly for a liquid submersion cooled electronic device A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, the... | 08/19/2008 |
| 7411791 | Extendable heat dissipation apparatus An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base.... | 08/12/2008 |
| 7411290 | Integrated circuit chip and method for cooling an integrated circuit chip An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the su... | 08/12/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7382616 | Cooling system for computer hardware The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is provided. The system is mountable to a first side of a circuit board. The... | 06/03/2008 |
| 7382615 | Heat dissipation device A heat dissipation device for an electronic unit includes a heat sink (10), a pair of fan holders (30, 40) and a fan (50) mounted on the heat sink via the fan holders. The heat sink includes a base (11) with a plurality of fins (15... | 06/03/2008 |
| 7370692 | Heat dissipating structure having different compactness A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each o... | 05/13/2008 |
| 7371965 | Modular cage with heat sink for use with pluggable module A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives t... | 05/13/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7367385 | Optimized fins for convective heat transfer The invention includes a heat transfer geometry having first and second flow channels in parallel with each other. The flow cross-sectional area of individual channels varies along the length of the flowpath, with one channel undergoing an expansion and the other un... | 05/06/2008 |
| 7365988 | Cycling LED heat spreader A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased power levels thus providing both improved lighting ... | 04/29/2008 |
| 7365987 | Structure for heat dissipation of integrated circuit chip and display module including the same A circuit board having a first IC chip mounted thereon, and a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portio... | 04/29/2008 |
| 7365975 | Heat dissipation device having a fan holder for attachment of a fan A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions exten... | 04/29/2008 |
| 7362578 | Heat sink fastening system A heat sink assembly for removing heat from an electronic component includes a retention clip having a central body and a securing member extending from the central member. The central member has an opening there through, and the securing member is configured to sec... | 04/22/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
| 7359195 | Heatsink Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end contacting a heat source to absorb heat from the heat source and a heat-... | 04/15/2008 |
| 7359196 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 04/15/2008 |
| 7357174 | Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to enga... | 04/15/2008 |
| 7352582 | Reinforcing structure, display device, and electronic apparatus To provide a display device with high reliability, which is capable of supporting a display panel well even when the display panel is enlarged, and capable of radiating the heat generated in the display panel well. A display device 100 of the present inventio... | 04/01/2008 |
