Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
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| Number | Title | Issue Date |
| 8144468 | Display device A display device according to the present invention comprises a display panel, an accommodating part accommodating the display panel, circulating means for circulating air in the accommodating part around the display panel, a heat exchanger collecting heat from the ... | 03/27/2012 |
| 8116080 | Container-based data center having greater rack density A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height... | 02/14/2012 |
| 8085540 | Tandem fan assembly with airflow-straightening heat exchanger A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an ... | 12/27/2011 |
| 8081462 | Modular liquid cooling system A method and kit of components for configuring electronics cooling configurations, the kit comprising a plurality of passageway forming members, each forming member including an extruded member having first and second ends and forming at least one passageway and at ... | 12/20/2011 |
| 8077464 | Directly injected forced convention cooling for electronics Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least on... | 12/13/2011 |
| 8059406 | Heat sink for memory and memory device having heat sink In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is... | 11/15/2011 |
| 7983044 | Electrical apparatus, cooling system therefor, and electric vehicle An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial struct... | 07/19/2011 |
| 7969738 | Computer A computer includes a casing in which an opening is formed, a heat generating element which is provided inside of the casing, a main cooling unit which is disposed between the opening of the casing and the heat generating element and cools heat which is generated fr... | 06/28/2011 |
| 7957145 | Electric power converter An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current t... | 06/07/2011 |
| 7885075 | Heat dissipation device A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the h... | 02/08/2011 |
| 7804687 | Liquid-cooled rack with pre-cooler and post-cooler heat exchangers used for EMI shielding A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mou... | 09/28/2010 |
| 7738251 | Modular computing environments A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping contai... | 06/15/2010 |
| 7724524 | Hybrid immersion cooled server with integral spot and bath cooling A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The prim... | 05/25/2010 |
| 7692926 | Integrated thermal systems The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (... | 04/06/2010 |
| 7649739 | Circuit device A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insu... | 01/19/2010 |
| 7602609 | Cooling system and method of use A system of cooling and method of use that includes a connector having a data reader capable of reading a wireless identifier and/or a breaker box capable of routing liquid cooling to at least one server. In a preferred embodiment, both the quick connector and the b... | 10/13/2009 |
| 7602610 | Electronic device According to one embodiment, an electronic device is provided with a heat transfer unit and a pressing member. The heat transfer unit includes a heat receiving portion thermally connected to a heat generating component, a heat radiating section thermally connected t... | 10/13/2009 |
| 7548420 | Electrical drive unit The present invention relates to an electrical drive unit comprising a circuit board, a plurality of components, attached to a first side of the circuit board, a heat sink, arranged on the first side of the circuit board, a positioning assembly, arranged on a second... | 06/16/2009 |
| 7545646 | Cooling assembly A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a location remote from the electronic component. A heat sink is mounte... | 06/09/2009 |
| 7529091 | Power semiconductor module and method for cooling a power semiconductor module The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit ... | 05/05/2009 |
| 7525802 | Computer with heat dissipation system A computer includes a motherboard (2), an enclosure (1), and a fan (153). The motherboard has a first heat generating device (21 ) mounted thereon. The enclosure has a substantially sealed first compartment (10), and an airflow cha... | 04/28/2009 |
| 7511959 | Scalable computing apparatus Disclosed are scalable computing pods that may be embodied in trailers, storage containers, or other portable structures that optimize computing, power, cooling and building infrastructure. The pods integrate required power and cooling infrastructure to provide a st... | 03/31/2009 |
| 7508672 | Cooling system Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat ... | 03/24/2009 |
| 7443675 | Heat pipe with guided internal grooves and heat dissipation module incorporating the same A heat pipe includes a heat receiving section, a heat transfer section, and a heat dissipation section. A groove structure is formed inside the heat pipe and extends from the heat receiving section to the heat dissipation section. The groove structure includes at le... | 10/28/2008 |
| 7440280 | Heat exchange enhancement A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes... | 10/21/2008 |
| 7436666 | Thermal caching for liquid cooled computer systems The failure of a data center liquid cooling system can result in a rapid temperature rise in electronic components that may either damage a component, result in the loss of data housed within the component, or both. A supplemental liquid cooling system is placed wit... | 10/14/2008 |
| 7429720 | Electric heating pipe and electric heating apparatus using it The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast hea... | 09/30/2008 |
| 7420810 | Base heat spreader with fins A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components. ... | 09/02/2008 |
| 7418998 | Chamber sealing valve According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing por... | 09/02/2008 |
| 7414844 | Liquid cooled heat sink with cold plate retention mechanism A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient col... | 08/19/2008 |
| 7411791 | Extendable heat dissipation apparatus An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base.... | 08/12/2008 |
| 7403392 | Liquid submersion cooling system A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electroni... | 07/22/2008 |
| 7400507 | Fastening structure A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member, a heat spreader having its attached side connected to the heatsink module, he... | 07/15/2008 |
| 7397665 | Integral heat-dissipation system for electronic boards A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the... | 07/08/2008 |
| 7391617 | Cooling arrangement for a computer system A cooling arrangement for a computer system includes a base plate, a system board which coupled to the base plate, a processor arranged on the system board, and a cooling apparatus arranged on the processor. A holding plate is provided between the base plate and the... | 06/24/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7372698 | Electronics equipment heat exchanger system An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near ... | 05/13/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7365973 | Cooling system and method A system for cooling a data center includes a plurality of cooling racks, with each cooling rack including a housing and cooling system components supported by the housing. The system further includes a fluid communication system coupled to the cooling system compon... | 04/29/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
