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Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
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| Number | Title | Issue Date |
| 7310233 | Apparatus and method for transferring heat from an electrical module An apparatus for transferring heat from an electrical module includes: (a) a thermally conductive base member having a plurality of edges establishing a polygonal perimeter and having a first side for presentation toward the electrical module; and (b) a heat transfe... | 12/18/2007 |
| 7307841 | Electronic package and method of cooling electronics An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry... | 12/11/2007 |
| 7302998 | Normal-flow heat exchanger A heat exchanger (120) includes a core (130) containing inlet manifold (140), outlet manifold (126), interconnecting channels (144) and a heat-transfer surface (128). Each interconnecting channel fluidly communicates at one ... | 12/04/2007 |
| 7304380 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 12/04/2007 |
| 7301772 | Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals. ... | 11/27/2007 |
| 7301773 | Semi-compliant joining mechanism for semiconductor cooling applications A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a v... | 11/27/2007 |
| 7301755 | Architecture for power modules such as power inverters Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additional... | 11/27/2007 |
| 7300821 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 11/27/2007 |
| 7301771 | Heat-receiving apparatus and electronic equipment A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body. ... | 11/27/2007 |
| 7299647 | Spray cooling system for transverse thin-film evaporative spray cooling A spray cooling system for transverse thin-film evaporative spray cooling in a narrow gap which generally includes a framework, a cooling cavity, a plurality of atomizers oriented to transversely spray coolant across the electronic components to be cooled, and prefe... | 11/27/2007 |
| 7300203 | Non-contacting sensor multichip module with integral heat-sinks A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and ... | 11/27/2007 |
| 7301770 | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally ... | 11/27/2007 |
| 7299967 | Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks The invention relates to an innovative method for manufacturing plate stacks, particularly for manufacturing coolers or cooler elements or heat sinks at least one plate stack, with at least two plate-shaped elements made of metal, for example copper, and provided wi... | 11/27/2007 |
| 7296618 | Liquid cooling system and electronic apparatus using the same A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resi... | 11/20/2007 |
| 7298620 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic device comprises a base, a heat dissipation member provided with two heat-dissipating plate groups intercrossed with each other and defining a plurality of air passages. At least a heat pipe connects ... | 11/20/2007 |
| 7298623 | Organic substrate with integral thermal dissipation channels, and method for producing same A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-... | 11/20/2007 |
| 7298619 | Cable management arm with integrated heat exchanger In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at least two arm members, at least one flexible coupling configured to ... | 11/20/2007 |
| 7298617 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coola... | 11/20/2007 |
| 7298618 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at le... | 11/20/2007 |
| 7295440 | Integral cold plate/chasses housing applicable to force-cooled power electronics An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral par... | 11/13/2007 |
| 7294926 | Chip cooling system A chip cooling system including a semiconductor device having a bulk region, wherein at least one fluid channel extends at least partially through the bulk region, the fluid channel having an inlet and an outlet, a fluid inlet port in fluid communication with the ch... | 11/13/2007 |
| 7295433 | Electronics assembly having multiple side cooling and method An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device p... | 11/13/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7293423 | Method and apparatus for controlling freezing nucleation and propagation An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from ... | 11/13/2007 |
| 7295435 | Heat sink having ferrofluid-based pump for nanoliquid cooling A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source, which is then directed away from the heat source by the ferrofluid-base... | 11/13/2007 |
| 7292438 | Liquid-cooling heat dissipation module A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a pump, a heat sink, and a guide member. The pump is attached to the fan an... | 11/06/2007 |
| 7290993 | Piezoelectric devices and methods and circuits for driving same A drive circuit (18) produces a drive signal having a waveform of a predetermined waveform shape for a device (10) having a piezoelectric actuator (14). The drive circuit (14) includes a memory (140) which stores waveform shape dat... | 11/06/2007 |
| 7292437 | Heat dissipation assembly for computing devices Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing spe... | 11/06/2007 |
| 7292439 | Thermal management system and method for electronic assemblies According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both the electron... | 11/06/2007 |
| 7289327 | Active cooling methods and apparatus for modules A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling comp... | 10/30/2007 |
| 7289325 | Power converter cooling A power conversion system which uses a plurality of transistors to convert DC power to AC power is made more efficient by the use of liquid refrigerant to cool the transistors. A plurality of passages are formed in a cold plate on which the transistors are mounted, ... | 10/30/2007 |
| 7288895 | System to improve display efficiency based on recycling local heat source A system to improve display efficiency based on recycling a local heat source. In one embodiment, the system includes a display and a lamp to illuminate the display. Heat from a heat generating component within the system in transferred to the lamp. In one embodimen... | 10/30/2007 |
| 7289331 | Interposable heat sink for adjacent memory modules A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first... | 10/30/2007 |
| 7287965 | Piezoelectric devices and methods and circuits for driving same A drive circuit (18) produces a drive signal for a pump (10) having a piezoelectric actuator (14), with the piezoelectric actuator (14) forming a part of the drive circuit (18) and serving to shape a waveform of the drive signal. T... | 10/30/2007 |
| 7289329 | Integration of planar transformer and/or planar inductor with power switches in power converter A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled... | 10/30/2007 |
| 7289326 | Direct contact cooling liquid embedded package for a central processor unit A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CP... | 10/30/2007 |
| 7286346 | Peripheral device and electronic device A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component to the host device; a heat transfer device having a first end thermal... | 10/23/2007 |
| 7286355 | Cooling system for electronic devices A plurality of pouch bodies (14, 16, 18) are supported side-by-side from an assembly that includes a manifold block (26). The manifold block (26) includes an inlet manifold (28) and an outlet manifold (30). A liquid coolant (e.g. w... | 10/23/2007 |
| 7284389 | Two-fluid spray cooling system A cooling system including a housing forming a cooling chamber containing the component submerged in a pool of alcohol, oil or glycerine, a sprayer configured to spray water at the component through the oil or glycerine, and a heat exchanger configured to cool the o... | 10/23/2007 |
| 7286354 | Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head An electronic part-mounted substrate includes a plate made of metal, an insulating material layer which is formed of a ceramic material on a surface of the plate and which has a surface provided with a heat generating IC thereon, and a thermal conductive member whic... | 10/23/2007 |
