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| Number | Title | Issue Date |
| 7362574 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surfac... | 04/22/2008 |
| 7362582 | Cooling structure using rigid movable elements A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for ... | 04/22/2008 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is form... | 04/22/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
| 7360582 | Flow distributing unit and cooling unit having bypass flow A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are c... | 04/22/2008 |
| 7359198 | System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at least a portion of a turbulence-inducing device arranged in the path, and... | 04/15/2008 |
| 7359192 | Cooling device for heat-generating electronic component A cooling device includes a heat sink (10), a fan (30), and a fan duct (50) covering the heat sink and fan therein. The heat sink includes a base (12) defining at least a through hole (18) at each of two opposite sides thereof. The... | 04/15/2008 |
| 7359197 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 04/15/2008 |
| 7353859 | Heat sink with microchannel cooling for power devices An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are inte... | 04/08/2008 |
| 7353860 | Heat dissipating device with enhanced boiling/condensation structure A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condens... | 04/08/2008 |
| 7353862 | Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a panel (14) distant from the heat sink, a heat transfer member includes a heat exchanger (22) thermally engaging with the heat sink and at least one heat pipe (24), a duct ( | 04/08/2008 |
| 7355857 | Heat sink gasket A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the recept... | 04/08/2008 |
| 7355852 | Modular liquid cooling of electronic assemblies An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to th... | 04/08/2008 |
| 7355855 | Compliant thermal interface structure utilizing spring elements A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a ... | 04/08/2008 |
| 7352577 | Liquid-cooled heat dissipation module A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump;... | 04/01/2008 |
| 7352581 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit inc... | 04/01/2008 |
| 7352576 | Multi-processor system and tubelike computer module thereof A multi-processor system has a tubelike computer module including plural mother boards configured onto plural side walls of a rack body to form a unitary, continuous and non-segment airflow channel. The airflow channel of the tubelike computer module has larger spac... | 04/01/2008 |
| 7352591 | Substrate mounted with electronic element thereon and liquid ejection head including the substrate A substrate mounted with an electronic element thereon comprises a metal base, a ceramic insulator, and a radiator. The insulator is provided on a first side of the base. The insulator has a heat-generating electronic element mounted on a side thereof opposite to a ... | 04/01/2008 |
| 7351240 | Thermodynamically driven reversible infuser pump for use as a remotely controlled gastric band An implantable artificial sphincter system provides long-term adjustment via transcutaneous energy transfer (TET), minimizing invasive adjustment through adding or removing fluid via a syringe. An infuser device provides bi-directional fluid transfer via a flexible ... | 04/01/2008 |
| 7349213 | Coolant control unit, and cooled electronics system and method employing the same A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and secon... | 03/25/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7342788 | RF power amplifier assembly with heat pipe enhanced pallet An RF amplifier assembly employing a finned heat sink and a heat pipe enhanced aluminum pallet is disclosed. The hybrid heat pipe enhanced aluminum pallet reduces the spreading thermal conduction resistance associated with the conduction of localized energy from RF ... | 03/11/2008 |
| 7342789 | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few... | 03/11/2008 |
| 7339788 | Cooling unit and flow distributing element for use in such unit A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outl... | 03/04/2008 |
| 7339793 | Interposable heat sink for adjacent memory modules A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first ... | 03/04/2008 |
| 7337829 | Cooling unit A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiat... | 03/04/2008 |
| 7337830 | Cooling device of electronic device A disclosed cooling device of an electronic device includes a cooling section thermally connected to the heat-generating electronic device so as to cool the electronic device with cooling water forcibly supplied from a pump, and a heat exchanging section thermally c... | 03/04/2008 |
| 7339789 | Modular, scalable thermal solution One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first int... | 03/04/2008 |
| 7337255 | Distributed data handling and processing resources system The distributed data handling and processing resources system of the present invention includes a) a number of data handling and processing resource nodes that collectively perform a desired data handling and processing function, each data handling and processing re... | 02/26/2008 |
| 7336493 | Cold plate cooling apparatus for a rack mounted electronic module Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower sur... | 02/26/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7336487 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated ... | 02/26/2008 |
| 7336486 | Synthetic jet-based heat dissipation device A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating... | 02/26/2008 |
| 7335984 | Microfluidics chips and methods of using same Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the in... | 02/26/2008 |
| 7336485 | Heat sink detection In one embodiment, a printed circuit board assembly comprises a heat sink having an electrically conductive mounting support and a printed circuit board including detection circuitry to detect an electrical connection between the electrically conductive mounting sup... | 02/26/2008 |
| 7336489 | Waterproof thermal management module and portable A waterproof thermal management module for a portable electronic device that including a housing and a heat source is disclosed. The waterproof thermal management module includes a separated chamber, a heat absorber, a radiator, a heat pipe and a fan. The separated ... | 02/26/2008 |
| 7333334 | Liquid cooling system and electronic equipment using the same For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which... | 02/19/2008 |
| 7331378 | Microchannel heat sink The invention provides a heat sink for flowing coolant into inlet manifold channels extending into a inlet edge of a manifold where the flow is forced downward into parallel and spaced micro-channels extending across the manifold channels and re-directing the coolan... | 02/19/2008 |
| 7331377 | Diamond foam spray cooling system A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section... | 02/19/2008 |
| 7331380 | Radial flow micro-channel heat sink with impingement cooling A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fi... | 02/19/2008 |
