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| Number | Title | Issue Date |
| 7405935 | Service tray for a thermal management system A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within ... | 07/29/2008 |
| 7405936 | Hybrid cooling system for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/29/2008 |
| 7403392 | Liquid submersion cooling system A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electroni... | 07/22/2008 |
| 7403384 | Thermal docking station for electronics For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interf... | 07/22/2008 |
| 7400502 | Connector heat transfer unit A connector heat transfer unit is presented. A number of embodiments are presented. Each embodiment includes a housing capable electrically connecting one or more heat generating components to an electronic system and cooling the heat generating components. ... | 07/15/2008 |
| 7400503 | Systems for low cost coaxial liquid cooling According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented w... | 07/15/2008 |
| 7400504 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at le... | 07/15/2008 |
| 7398818 | Fluidic pump for heat management A heat producing device is placed in contact with a heat exchanger that is fluidically coupled to a fluid pump. The fluid pump operates to pumps fluid through a closed fluidic system between the heat exchanger and a spot where the heat can be dissipated. In an aspec... | 07/15/2008 |
| 7400505 | Hybrid cooling system and method for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/15/2008 |
| 7397665 | Integral heat-dissipation system for electronic boards A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the... | 07/08/2008 |
| 7397662 | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing plate-heat dissipaters 17 and 18 at the upper and lower ... | 07/08/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7394655 | Absorptive cooling for electronic devices Embodiments of this invention include active electrical components withing a housing that contains an absorptive cooler. The absorptive cooler is used to cool active electrical components, such as central processors or other heat-sensitive components. In some embodi... | 07/01/2008 |
| 7388746 | Heatsink assembly A heatsink assembly having a simple structure for coupling a heatsink and an electronic chip is provided with a heatsink which contacts an electronic chip mounted on a substrate and absorbs heat generated from the electronic chip; and a pressing member which is coup... | 06/17/2008 |
| 7385817 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coola... | 06/10/2008 |
| 7385821 | Cooling method for ICS The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an inte... | 06/10/2008 |
| 7385810 | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack Apparatus and method are provided for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-li... | 06/10/2008 |
| 7381346 | Thermal interface material A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface mat... | 06/03/2008 |
| 7380409 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of ... | 06/03/2008 |
| 7379301 | Integrated liquid cooling system An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump incl... | 05/27/2008 |
| 7375962 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surfac... | 05/20/2008 |
| 7372698 | Electronics equipment heat exchanger system An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near ... | 05/13/2008 |
| 7372697 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the h... | 05/13/2008 |
| 7372702 | Heat spreader According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a firs... | 05/13/2008 |
| 7371056 | Fluid pump, cooling system and electrical appliance A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the pump chamber is defined by the reserve tank, a fluid path forming member... | 05/13/2008 |
| 7371609 | Stacked module systems and methods The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical f... | 05/13/2008 |
| 7371615 | Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member ea... | 05/13/2008 |
| 7369409 | Apparatus, method, and control program for cooling electronic devices A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a... | 05/06/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7369412 | Heat dissipation device A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-... | 05/06/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7363831 | Environmental chamber for electronic systems testing and methods of use An environmental chamber for use with an environmental contamination testing system provides airborne contaminants effects for electronic systems. The environmental chamber includes a platform for supporting the plurality of electronic systems and receiving the sett... | 04/29/2008 |
| 7365973 | Cooling system and method A system for cooling a data center includes a plurality of cooling racks, with each cooling rack including a housing and cooling system components supported by the housing. The system further includes a fluid communication system coupled to the cooling system compon... | 04/29/2008 |
| 7365980 | Micropin heat exchanger An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a pixel like pattern over the substrate. ... | 04/29/2008 |
| 7365874 | Printer for authenticating a replaceable ink cartridge A printer is provided for authenticating a replaceable ink cartridge. The printer includes a processor. The replaceable ink cartridge can be releasably coupled to the processor and includes a first integrated circuit (IC). A printhead is interfaced to the processor ... | 04/29/2008 |
| 7365981 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and... | 04/29/2008 |
| 7365982 | Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a reservoir (14) containing liquid therein and distant from the heat sink, and a heat-transfer member. The heat-transfer member includes a heat-absorbing segment (162) contacting the... | 04/29/2008 |
| 7365990 | Circuit board arrangement including heat dissipater A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices o... | 04/29/2008 |
| 7365986 | Semiconductor cooling device and stack of semiconductor cooling devices To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a se... | 04/29/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
