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| Number | Title | Issue Date |
| 7468885 | Cooling device for interface card A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a plurality of cooling fins. A cooling flow path is formed between any two ad... | 12/23/2008 |
| 7466549 | Cooling arrangement for server blades A housing arrangement including a receiving housing with an interior inside which a cooling device and one or several electric units are accommodated. The cooling device includes a flow line and a return line extending at least partially between the base area and ce... | 12/16/2008 |
| 7463485 | Circuit board housing and circuit board assembly A circuit board assembly comprises a circuit board having a connector or contact pad, and a housing. The housing includes a casing having an open end, an end cover sealing the open end of the casing and having a conductor, a coolant inlet for introducing a coolant i... | 12/09/2008 |
| 7463486 | Transpiration cooling for passive cooled ultra mobile personal computer In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chas... | 12/09/2008 |
| 7460369 | Counterflow microchannel cooler for integrated circuits A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communica... | 12/02/2008 |
| 7450385 | Liquid-based cooling apparatus for an electronics rack A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each co... | 11/11/2008 |
| 7450384 | Card cage with parallel flow paths having substantially similar lengths A card cage configured to hold a set of electronics cards comprises a set of walls having an input and an output and a set of flow paths formed in the set of walls to enable a fluid to flow therein. The set of flow paths includes a first flow path formed between the... | 11/11/2008 |
| 7443678 | Flexible circuit board with heat sink A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface... | 10/28/2008 |
| 7443677 | Heat dissipation device A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat... | 10/28/2008 |
| 7443354 | Compliant, internally cooled antenna apparatus and method A phased array antenna system including a mandrel having compliant portions and an internally formed cooling passageway. The compliant portions are formed by removing portions of material along one end of the mandrel to form a plurality of pairs of generally U-shape... | 10/28/2008 |
| 7438120 | Cooling device The invention relates to a cooling device, which comprises a cooling fan and a heatsink. The heatsink is directly attached to the heating element to absorb its heat and the cooling fan is disposed on top of the heatsink to dissipate the heat. The heatsink includes a... | 10/21/2008 |
| 7440278 | Water-cooling heat dissipator A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the f... | 10/21/2008 |
| 7436666 | Thermal caching for liquid cooled computer systems The failure of a data center liquid cooling system can result in a rapid temperature rise in electronic components that may either damage a component, result in the loss of data housed within the component, or both. A supplemental liquid cooling system is placed wit... | 10/14/2008 |
| 7431071 | Fluid circuit heat transfer device for plural heat sources A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive ... | 10/07/2008 |
| 7433188 | Electronic package with direct cooling of active electronic components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic compone... | 10/07/2008 |
| 7430119 | Impeller and aligned cold plate According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle.... | 09/30/2008 |
| 7427566 | Method of making an electronic device cooling system A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrific... | 09/23/2008 |
| 7428150 | Computing platform component cooling with quick disconnect Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat dissipation device thermally coupled to a processor mounted on a printed circui... | 09/23/2008 |
| 7428152 | Localized thermal management system A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a plurality of thermal vias in thermal communication with the thermal manag... | 09/23/2008 |
| 7428151 | Cooling arrangement A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be co... | 09/23/2008 |
| 7424907 | Methods and apparatus for an integrated fan pump cooling module An integrated fan pump includes a fan, a pump, and an electrical drive mechanism such as an electric motor configured to simultaneously drive both the fan and pump with respect to the housing. A heat exchanger is preferably connected to the pump and the component to... | 09/16/2008 |
| 7426112 | Heat dissipating module A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion ... | 09/16/2008 |
| 7423875 | Liquid-cooling heat dissipating device for dissipating heat by a casing A liquid-cooling heat dissipating device for dissipating heat by a casing includes a casing having a liquid flow channel and a heat dissipating fin, both integrally formed on a wall of the casing. The casing includes a panel having a cold connector and a hot connect... | 09/09/2008 |
| 7423874 | Magneto-hydrodynamic heat sink A heat sink uses a pump assembly to generate a magnetic field. A direction of electrically and thermally conductive liquid flowing through the pump assembly is dependent on an orientation of the magnetic field and the direction of electrical current induced across f... | 09/09/2008 |
| 7420810 | Base heat spreader with fins A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components. ... | 09/02/2008 |
| 7420807 | Cooling device for electronic apparatus The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 a... | 09/02/2008 |
| 7420808 | Liquid-based cooling system for cooling a multi-component electronics system A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cool... | 09/02/2008 |
| 7418825 | IT equipment cooling A system for cooling gas heated by passing the gas over heat-producing equipment to cool the equipment comprises a heat exchanger including a first heat transfer mechanism configured to transfer heat from the heated gas to a first coolant, and a first condensing mod... | 09/02/2008 |
| 7420804 | Liquid cooling system including hot-swappable components The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the ... | 09/02/2008 |
| 7417858 | Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across segments of the plurality of pipes. Electrical currents are induced acr... | 08/26/2008 |
| 7417857 | Power-electronic-cooling device A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the invention, the cooling circuit can include deflectors and/or turbulato... | 08/26/2008 |
| 7414844 | Liquid cooled heat sink with cold plate retention mechanism A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient col... | 08/19/2008 |
| 7414843 | Method and apparatus for a layered thermal management arrangement Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one ... | 08/19/2008 |
| 7414845 | Circuit board assembly for a liquid submersion cooled electronic device A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, the... | 08/19/2008 |
| 7414846 | Cooling structure for interface card A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat i... | 08/19/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7408775 | Electrical module and support therefor with integrated cooling A rack system is disclosed that includes a plurality of electrical modules (48), a frame (10) supporting the plurality of electrical modules (48) that includes a plurality of frame members (16, 18, 20, 22, 26, 38, 39, 40) and a plurality ... | 08/05/2008 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate phy... | 08/05/2008 |
| 7408778 | Heat sinks for dissipating a thermal load Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the he... | 08/05/2008 |
| 7404433 | Liquid cooled heat sink A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing bei... | 07/29/2008 |
