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| Number | Title | Issue Date |
| 7609518 | Cooling computer components A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided betwee... | 10/27/2009 |
| 7609519 | Coolant control unit and cooled electronics system employing the same A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and secon... | 10/27/2009 |
| 7602608 | Narrow gap spray cooling in a globally cooled enclosure Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality o... | 10/13/2009 |
| 7599184 | Liquid cooling loops for server applications Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is... | 10/06/2009 |
| 7595987 | Heat dissipation assembly for computing devices Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing spe... | 09/29/2009 |
| 7593227 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of ... | 09/22/2009 |
| 7586747 | Scalable subsystem architecture having integrated cooling channels A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided be... | 09/08/2009 |
| 7580261 | Semiconductor cooling system for use in electric or hybrid vehicle A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling syste... | 08/25/2009 |
| 7564685 | Motherboards with integrated cooling A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that... | 07/21/2009 |
| 7561424 | Method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method A device for cooling electronic components of a control unit in an unmanned flying vehicle. A container contains a liquid cooling medium. A temperature sensor is adapted to sense the temperature of the electronic components during the flight of the vehicle. A spraye... | 07/14/2009 |
| 7551439 | Fluid cooled electronic assembly An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the... | 06/23/2009 |
| 7551441 | Heat dissipation assembly for computing devices An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor... | 06/23/2009 |
| 7551438 | Information processing blade and information processing apparatus using the same An information processing blade computer includes a board having a blade structure such that the board is stored in a main body of an information processing apparatus; a part contained in a circuit which is mounted on the board to execute an process, wherein heat is... | 06/23/2009 |
| 7551440 | System and method for cooling an electronic component A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one he... | 06/23/2009 |
| 7548425 | Heat-Receiving apparatus and electronic equipment A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body. ... | 06/16/2009 |
| 7548424 | Distributed transmit/receive integrated microwave module chip level cooling system A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive module... | 06/16/2009 |
| 7545644 | Nano-patch thermal management devices, methods, & systems Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity. The cavity can be positioned intermediate a hea... | 06/09/2009 |
| 7542291 | Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct. | 06/02/2009 |
| 7542292 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 06/02/2009 |
| 7539016 | Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to perm... | 05/26/2009 |
| 7529089 | Heat-dissipating device connected in series to water-cooling circulation system A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the no... | 05/05/2009 |
| 7522417 | Multi-mode fluid cooling system and method A cooling system and method that significantly improves spray evaporative cooling by using a mixture of cooling fluids having different boiling points. The cooling fluid mixture is sprayed onto a surface to be cooled. Efficient cooling with reduced cooling fluid vol... | 04/21/2009 |
| 7522418 | Electronic equipment and rack apparatus An electronic equipment has a heat-generating part therein. A housing accommodates component parts including the heat-generating part. A cooling-medium circulation system circulates a liquid internal cooling-medium between a heat-absorbing part and a heat-radiating ... | 04/21/2009 |
| 7518867 | Electronic device cooling device and electronic device cooling method An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device... | 04/14/2009 |
| 7515416 | Structures for holding cards incorporating electronic and/or micromachined components This invention provides a structure for holding cards having electronic and/or micromachined components. A chassis comprises a plurality of bays for receiving cards such that the cards are oriented parallel to one another. Each bay comprises a fin front-plate fabric... | 04/07/2009 |
| 7515415 | Embedded microchannel cooling package for a central processor unit An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU h... | 04/07/2009 |
| 7511957 | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orif... | 03/31/2009 |
| 7508668 | Electric power converter and mounting structure of semiconductor device An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wirin... | 03/24/2009 |
| 7508670 | Thermally conductive shelf Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic module includes an expandable member defining a fluid passage between a ... | 03/24/2009 |
| 7508669 | Cooling device for an electronic component, especially for a microprocessor A cooling device (1) for an electronic component (3), especially for a microprocessor, includes a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic ... | 03/24/2009 |
| 7495914 | Narrow gap spray cooling in a globally cooled enclosure Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality o... | 02/24/2009 |
| 7492594 | Electronic circuit modules cooling A cooling structure for electrical circuit devices having a pair of cooling ducts, each having a coolant passageway therein, and an electrical circuit device housing formed by a pair of spaced apart heat transfer plates each joined to a housing side to provide a sea... | 02/17/2009 |
| 7492595 | Semiconductor cooling device and stack of semiconductor cooling devices To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a se... | 02/17/2009 |
| 7486513 | Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few... | 02/03/2009 |
| 7486514 | Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coola... | 02/03/2009 |
| 7480142 | Boost spring holder for securing a power device to a heatsink A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated with... | 01/20/2009 |
| 7477514 | Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations A cooling method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured ... | 01/13/2009 |
| 7477513 | Dual sided board thermal management system A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal management system generally includes a housing surrounding a portion of a pri... | 01/13/2009 |
| RE40618 | Integrated cooling system Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled ... | 01/06/2009 |
| 7471515 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a p... | 12/30/2008 |
