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| Number | Title | Issue Date |
| 5115858 | Micro-channel wafer cooling chuck A wafer cooling chuck (10) uses 3M micro-channel stock (12). A coolant manifold (14) surrounds ends (16) and (18) of the stock (12). A vacuum manifold (17) surrounds the coolant manifold (14) at end (16). A heat transfer fluid supply manifold (15) surroun... | 05/26/1992 |
| 5111280 | Thermal management of power conditioning systems A semi-conductor assembly including an elongated electrically conductive support structure defining a sinuous coolant flow path between respective upper and lower surfaces of the support structure. The sinuous coolant path includes alternating concave and... | 05/05/1992 |
| 5103374 | Circuit pack cooling using turbulators Disclosed is a fluid-cooled circuit pack which includes heat generating components on a front surface of a circuit board and another surface opposite to the front surface to create a channel for the flow of cooling fluid over the components. An array of r... | 04/07/1992 |
| 5099311 | Microchannel heat sink assembly The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated ... | 03/24/1992 |
| 5097207 | Temperature stable cryogenic probe station ATE is mounted directly to a support surrounding and removably receiving probe cards of differing thickness. An electrically heated chuck having a variable heat transfer coefficient heat exchanging face confronting a liquid nitrogen supplied plenum exhibi... | 03/17/1992 |
| 5097387 | Circuit chip package employing low melting point solder for heat transfer A circuit chip package and method for assembling the same is disclosed which employs low eutectic or melting point solder, such as an indium alloy, as a thermally conductive medium between each circuit chip and the package cover. The melting point of the ... | 03/17/1992 |
| 5097385 | Super-position cooling A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip.... | 03/17/1992 |
| 5088006 | Liquid film interface cooling system for semiconductor wafer processing A semiconductor wafer, liquid interface clamping and cooling system 80 includes a chuck 10 having clamping section 12 with a top surface 16 with three clamping/cooling circuit grooves machined therein for providing a liquid interface between a wafer under... | 02/11/1992 |
| 5086829 | Liquid cooling apparatus with improved leakage detection for electronic devices A liquid cooling apparatus includes a heat exchanger, a tank, leakage sensors, first and second level sensors, a timer counter, and a control section. The heat exchanger cools a coolant to be supplied to a heat generating portion in an electronic device. ... | 02/11/1992 |
| 5088005 | Cold plate for cooling electronics A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed... | 02/11/1992 |
| 5050037 | Liquid-cooling module system for electronic circuit components A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit boa... | 09/17/1991 |
| 5050036 | Liquid cooled integrated circuit assembly A liquid cooled integrated circuit assembly including a plurality of integrated circuit packages for housing and electrically interconnecting integrated circuits, a printed circuit board for mounting the integrated circuit packages, and flexing tubing for... | 09/17/1991 |
| 5046552 | Flow-through heat transfer apparatus with movable thermal via A heat transfer apparatus especially useful for cooling electronic components has a frame with a channel for the flow of heat transfer liquid, a flexible sheet connected to the frame, and a thermal via coupled to the sheet. As fluid flows through the chan... | 09/10/1991 |
| 5043797 | Cooling header connection for a thyristor stack In a liquid cooled thyristor stack in which a plurality of disk thyristors are stacked between a plurality of cold plates such that each thyristor has a cold plate on either side thereof, relatively rigid tubular connectors are provided which extend betwe... | 08/27/1991 |
| 5036384 | Cooling system for IC package A cooling system for an IC package includes a support plate arranged to oppose a wiring board on which a plurality of integrated circuits are mounted, a plurality of cooling plates fixed to the support plate by support members and each having a coolant ch... | 07/30/1991 |
| 5023695 | Flat cooling structure of integrated circuit A circuit assembly with circulation of coolant. A plurality of chips of integrated circuit are arranged on a substrate separately from each other in rows and columns. A circulating unit disposed on the substrate and having a planar shape circulates coolan... | 06/11/1991 |
| 5021924 | Semiconductor cooling device A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convectio... | 06/04/1991 |
| 5019939 | Thermal management plate A thermal management plate designed to take advantage of the thermally conductive path provided as an integral part of printed circuit board component assemblies. The plate is a shelf-like unit providing both thermal management of electronic assemblies an... | 05/28/1991 |
| 5019946 | High density interconnect with high volumetric efficiency Interconnected integrated circuits (16) packaged at a very high density are fabricated beginning with a plurality of substrates (50 or 400 or 500) where each substrate has metal edge contact sites (12 or 507). Several substrates are joined together in a s... | 05/28/1991 |
| 5012858 | Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semicond... | 05/07/1991 |
| 5000256 | Heat transfer bag with thermal via A heat transfer bag especially useful for cooling electronic components is made of a flexible sheet of material and is filled with a fluorochemical heat transfer liquid. A metallic thermal via extends through a hole in the bag for direct contact with an e... | 03/19/1991 |
| 5001548 | Multi-chip module cooling There is disclosed a liquid cooled multi-chip semi-conductor module comprising multiple semi-conductor devices each having one surface prepared with electrical interconnect means for mechanical and electrical attachment to an electrical interconnect subst... | 03/19/1991 |
| 5001601 | Modular cooling fixture for power transistors A modular cooling fixture for power transistors include a carrier plate. Transistors are mounted to the plate and insulated transistor leads pass through openings formed in the plate for connection to a printed circuit board. Spacers fasten the board to t... | 03/19/1991 |
| 4998181 | Coldplate for cooling electronic equipment A system for cooling, positioning and supporting phased array microwave modules within a phased array radar system wherein the modules are disposed in cooling tubes, the cooling tubes being arranged to permit coolant to continuously pass in close proximit... | 03/05/1991 |
| 4989070 | Modular heat sink structure There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink of modular construction suitable for semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said modular heat sink containing inserts with chip substr... | 01/29/1991 |
| 4971144 | Liquid ribbon cooler A flexible liquid ribbon cooler for use with electronic components which includes a plurality of elongate thermo-conductive members, which are circular in cross-section, and which are positioned side by side. A bottom and a top layer of thermo-conductive ... | 11/20/1990 |
| 4964019 | Multilayer bonding and cooling of integrated circuit devices A method to mount and cool integrated circuit chips within a multilayer printed wiring board structure. The method makes the use of tape automated bonding or flip chip dice attachment techniques in such a way that a cavity may be formed above and below th... | 10/16/1990 |
| 4962444 | Cold chassis for cooling electronic circuit components on an electronic board The problem of providing a compact high intensity cooling system for use with a cold chassis (42) for an electronic board (18) in a modular electronic system is solved by providing a frame (44) having a plurality of projecting ribs (46) defining grooves (... | 10/09/1990 |
| 4949219 | Module sealing structure A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a pl... | 08/14/1990 |
| 4942497 | Cooling structure for heat generating electronic components mounted on a substrate A cooling structure for heat generating electronic components mounted on a substrate. The cooling structure includes a cold plate fixed on the substrate which is provided with first through holes opposed to the respective upper surfaces of the heat genera... | 07/17/1990 |
| 4928206 | Foldable printed circuit board A printed circuit board assembly is disclosed which includes a number of rigid printed circuit boards connected by a number of flexible printed circuit panels. Integrated circuits and similar components are mounted on the rigid printed circuit boards. The... | 05/22/1990 |
| 4921039 | Device for the protection and thermal conditioning of apparatus in particular electronic apparatus generating heat A device for the protection and thermal conditioning of electronic apparatus generating heat consisting of a plurality of conduits in which a thermal carrying fluid flows, disposed in a spiral array structurally independent and with lengths outside the de... | 05/01/1990 |
| 4920574 | Cooling system for an electronic circuit device A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coola... | 04/24/1990 |
| 4910542 | Single-lens reflex camera with built-in flash A single-lens reflex camera with a flash unit built into the camera body above the viewing pentaprism. The unit is movable from an operating position to a non-operating position, preferably enclosed in the camera body. The built-in flash unit may be autom... | 03/20/1990 |
| 4908757 | Static frequency converter, especially a frequency converter controlling and/or adjusting the performance data of an electromotor The invention relates to a static frequency converter in a housing, especially a frequency converter controlling and/or adjusting the performance data of an electromotor. The housing is shaped as a pressure-resistant casing sealed toward the ambient and a... | 03/13/1990 |
| 4897763 | Circuit arrangement having a plurality of electrical elements to be cooled The electrical elements to be cooled (111-138) is a low-ohmic high-power source are connected via cooling channels (60-63, 66, 77, 70-72, 76-80) in the electrical conductors (9, 211, 311, 10, 215, 315, . . . ) as parallel cooling circulations to a cooling... | 01/30/1990 |
| 4888663 | Cooling system for electronic assembly A configuration of an electronics unit is disclosed wherein a plurality of circular circuit cards are arranged in an aligned, parallel relationship. Each card has a central circular inner opening formed therein. A plurality of inner and outer spacer eleme... | 12/19/1989 |
| 4884630 | End fed liquid heat exchanger for an electronic component A body having a bottom and first and second ends and a cavity therein. A plurality of substantially parallel spaced fins are positioned in the cavity. A liquid inlet is centrally positioned in the first end of the body and a liquid outlet is centrally pos... | 12/05/1989 |
| 4879629 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation A liquid cooled integrated circuit module includes a substrate, a plurality of chips mounted on the substrate, and electrical conductors integrated into the substrate to interconnect the chips. A compliant member which is completely seamless overlies all ... | 11/07/1989 |
| 4879632 | Cooling system for an electronic circuit device A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-mel... | 11/07/1989 |
