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| Number | Title | Issue Date |
| 5986882 | Electronic apparatus having removable processor/heat pipe cooling device modules therein A computer server unit has a closely spaced series of parallel, facing processor modules with inner edge portions thereof being operatively and removably received in socket connectors on a main system board within the server unit housing. Voltage regulati... | 11/16/1999 |
| 5982616 | Electronic apparatus with plug-in heat pipe module cooling system A self-contained liquid cooled heat sink system disposed in a computer has a plurality of socket portions through which a cooling liquid is pumped. Operating heat from a plurality of heat-generating computer components, representatively circuit board-moun... | 11/09/1999 |
| 5978220 | Liquid cooling device for a high-power semiconductor module In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved l... | 11/02/1999 |
| 5969944 | Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply... | 10/19/1999 |
| 5966286 | Cooling system for thin profile electronic and computer devices An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comp... | 10/12/1999 |
| 5963425 | Combined air and refrigeration cooling for computer systems A cabinet with air inlet and exhaust openings includes one or more air-moving devices for the air cooling of circuit cards contained within the cabinet. The circuit cards are insertable into a board (back plane) which also contains an electronic circuit m... | 10/05/1999 |
| 5959351 | Liquid-cooled electronic device There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling... | 09/28/1999 |
| 5956229 | Injection molded thermal interface system A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled t... | 09/21/1999 |
| 5953211 | Apparatus including heat sink structure for removing heat from a printed circuit board An apparatus, such as a computer, comprises a housing having an interior portion into which a printed circuit board may be inserted. The printed circuit board, when inserted, is supported by a support structure. A spring mechanism resiliently supports a h... | 09/14/1999 |
| 5950714 | Cooling apparatus for an electronic component This invention relates to a cooling apparatus for at least one electronic component. The cooling apparatus includes a first member which has an inner surface and an outer surface. The outer surface of the first member is adapted for mounting the electroni... | 09/14/1999 |
| 5947188 | Method and a device for permitting cooling of heat-sensitive components A device (10) for cooling heat-sensitive components is disclosed. The device includes a housing (12) for receiving the components, and attachment means integral with the housing for attaching the device (10) to another component (24). The attachment means... | 09/07/1999 |
| 5943211 | Heat spreader system for cooling heat generating components An isothermal equilibrium system takes point sources of heat generated by the operation of heat generating components and spreads the heat throughout the system where the heat may be dissipated. An atomizer for atomizing a liquid coolant, is positioned in... | 08/24/1999 |
| 5940270 | Two-phase constant-pressure closed-loop water cooling system for a heat producing device A cooling device for a machine, especially, but not limited to, a device for cooling the central processing unit (CPU) of a desktop computer, thereby increasing the speed at which it can operate. In the preferred embodiment, the cooling device includes a ... | 08/17/1999 |
| 5940269 | Heat sink assembly for an electronic device A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided above integrated circuits of the electronic product, with ... | 08/17/1999 |
| 5930115 | Apparatus, method and system for thermal management of a semiconductor device A thermal management structure to provide mechanical isolation and heat removal for an unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and sub... | 07/27/1999 |
| 5926369 | Vertically integrated multi-chip circuit package with heat-sink support A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The prob... | 07/20/1999 |
| 5926370 | Method and apparatus for a modular integrated apparatus for multi-function components A modular integrated computer apparatus that includes a CPU or VLSI module connected to a printed circuit board, a power converter, and one or more associated electric power cables; and is a supporting infrastructure that ensures ease of use. The field re... | 07/20/1999 |
| 5925929 | Cooling apparatus for electronic elements A cooling apparatus for electronic device comprises an electronic element unit which comprises a base member, a thermal conductive electric insulating layer soldered to the base member and a plurality of electronic elements soldered to the thermal conduct... | 07/20/1999 |
| 5923530 | Electronic apparatus incorporating a circuit module having a heat sink A circuit module comprising a circuit board, a function component, and a heat sink. The circuit board has a number of circuit components and a circuit element which generates heat while operating. The function component is secured to the circuit board by ... | 07/13/1999 |
| 5923533 | Multiple tile scaleable cooling system for semiconductor components A fluid-cooling system for the edge-cooling of semiconductor tiles that are arranged into rows and columns and are mounted on one or more panels is constructed with a coolant supply and return pipe and individual coolant supply and return lines for each o... | 07/13/1999 |
| 5920457 | Apparatus for cooling electronic devices using a flexible coolant conduit An apparatus for cooling an electronic assembly. The electronic assembly is placed in thermal contact with a single, continuous and monolithic coolant conduit capable of housing a coolant. A plurality of removable cold plates are coupled to the conduit, t... | 07/06/1999 |
| 5915463 | Heat dissipation apparatus and method A heat dissipation apparatus (51) has a lid (12) and an optimized fin arrangement (16) located in a cavity (57) of a base (11). Semiconductor chips (41, 42, 43, 44, 45, and 46) are coupled to the lid (12), and a heat conducting medium (47) is forced into ... | 06/29/1999 |
| 5907473 | Environmentally isolated enclosure for electronic components A spray cooled enclosure and method for obtaining a substantially improved operating environment for at least one electronic component/card located within the enclosure. The spray cooled enclosure includes a closed compartment that isolates the electronic... | 05/25/1999 |
| 5901038 | Power supply system for high density printed circuit boards The present invention is a mounting structure for a power supply. The mounting structure of the present invention allows power to be coupled from a power supply to a predetermined area on a motherboard adjacent one or more high power demand components, su... | 05/04/1999 |
| 5901037 | Closed loop liquid cooling for semiconductor RF amplifier modules A closed loop liquid cooling system for an RF transistor module including a plurality of elongated microchannels connected between a pair of coolant manifolds for conducting liquid coolant beneath one or more transistor dies to dissipate the heat generate... | 05/04/1999 |
| 5901036 | Cooling device for electrical assemblies A cooling device is provided which is firmly connectable to a carrier. The cooling device includes cooling channels for guiding a coolant stream and which have at least one flat side for a highly thermally conductive connection to at least one electrical ... | 05/04/1999 |
| 5892656 | Thermoelectric generator A thermoelectric generator system. The thermoelectric generator has at least one hot side heat exchanger and at least one cold side heat exchanger and at least one thermoelectric module with thermoelectric elements installed in an injection molded eggcrat... | 04/06/1999 |
| 5892279 | Packaging for electronic power devices and applications using the packaging A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper... | 04/06/1999 |
| 5889651 | Circuit board cooling apparatus A supply pipe for supplying air to the peripheral surface of a circuit board container unit is provided in a test head. Nozzles are connected to the supply pipe. Each nozzle has at least one hole opposing a circuit board and corresponding to one IC on the... | 03/30/1999 |
| 5875098 | Thermoelectric module with gapless eggcrate A thermoelectric module having a gapless insulating eggcrate providing insulated spaces for a large number of p-type and n-type thermoelectric elements. The absence of gaps in the walls of the spaces virtually eliminates the possibility of interwall short... | 02/23/1999 |
| 5871042 | Liquid cooling apparatus for use with electronic equipment A liquid cooling apparatus for use with electronic equipment includes a frame adapted to fit in a chassis with electronic equipment. An inner container and outer container are attached to the frame. A liquid inlet is disposed in the frame and has an openi... | 02/16/1999 |
| 5870823 | Method of forming a multilayer electronic packaging substrate with integral cooling channels Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating elect... | 02/16/1999 |
| 5872699 | Electronic apparatus, housing for electronic apparatus and housing manufacturing method An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of ... | 02/16/1999 |
| 5870284 | Integrated power supply frame including integrated circuit (IC) mounting and cooling The present invention encompasses a mounting structure on which both a power supply and a integrated circuit (IC) chip module are mounted. In one embodiment, the present invention encompasses a mounting structure for mounting a power supply and an integra... | 02/09/1999 |
| 5863455 | Colloidal insulating and cooling fluid Colloidal fluids having improved insulating and/or cooling properties. Embodiments of the invention involve colloidal fluids which comprise a carrier liquid and a dispersed phase of non-metallic particles, wherein the colloidal fluid has a saturation magn... | 01/26/1999 |
| 5864466 | Thermosyphon-powered jet-impingement cooling device A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to th... | 01/26/1999 |
| 5862037 | PC card for cooling a portable computer A PCMCIA PC card powers a fan for cooling a portable computer. The card having a first end, a second end, and defines an air conduit between the ends. A fan attaches to the first end for blowing air towards the second end and into a portable computer. A P... | 01/19/1999 |
| 5859763 | Multi chip module cooling apparatus The multi chip module cooling apparatus of the present invention includes a cold plate having a sealed housing formed with a first side member, a second side member and an interior space, and a metal block having a refrigerant vapor flow passage and a coo... | 01/12/1999 |
| 5856716 | Cooling case for an electrical device, and a method of manufacturing it A cooling case for an electrical device, the case comprising: a thermally conductive inner ferrule for surrounding the electrical device; an outer enclosure adjacent to the outside surface of the inner ferrule and including a feed inlet and an exhaust outlet for a ... | 01/05/1999 |
| 5841634 | Liquid-cooled baffle series/parallel heat sink A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port remov... | 11/24/1998 |
