Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 7961465 | Low cost liquid cooling A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. T... | 06/14/2011 |
| 7961466 | High voltage bushing, a method of cooling a conductor thereof, and an electric power distribution system comprising such a bushing A high voltage bushing including an elongated electric conductor, a tubular insulator surrounding the conductor, and cooling mechanism for cooling the conductor. The cooling mechanism includes at least one cooling element extending along a fraction of the length of ... | 06/14/2011 |
| 7957144 | Heat exchange system for blade server systems and method A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sink associated to each of said plurality of server... | 06/07/2011 |
| 7952876 | Electric power converter The present invention provides a highly reliable electric power converter reduced in parasitic inductance. An electric power converter that includes a capacitor module which has a DC terminal, an inverter which coverts a direct current into an alternating cur... | 05/31/2011 |
| 7952875 | Stacked busbar assembly with integrated cooling A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system ... | 05/31/2011 |
| 7952873 | Passive conductive cooling module A cooling module includes a thermally conductive plate, a bladder disposed on at least one side of the plate, the bladder have a chamber, and fluid disposed in the chamber of the bladder wherein the bladder in an inflated state impresses the cooling module against a... | 05/31/2011 |
| 7952874 | Planer board with integrated cold plate A cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting compo... | 05/31/2011 |
| 7944694 | Liquid cooling apparatus and method for cooling blades of an electronic system chassis Apparatus and method are provided for facilitating liquid cooling of a plurality of blades of an electronic system chassis. The apparatus includes a chassis-level manifold assembly with a first coolant path and a plurality of second coolant paths. The first coolant ... | 05/17/2011 |
| 7940526 | Electrical module The invention relates to a module with a number of electrical or electronic components or switching circuits provided on a common cooler structure flowed through by a cooling medium. The entire cooler structure is made up of at least two plate-shaped coolers, which ... | 05/10/2011 |
| 7940527 | Cooling system for electronic structural units Cooling systems (1) suitable for cooling an electronic unit (2) or assembly. The cooling system is provided with a cooling channel (6). An electronic unit (2) rests over a heat-conducting cooler wall (7). A coolant guide apparatus ... | 05/10/2011 |
| 7933125 | Board unit and electronic apparatus A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material tha... | 04/26/2011 |
| 7929305 | Power electronics cooling system with flow orifice control A system includes a plurality of motor controllers. A coolant system for the plurality of motor controller has a common inlet line, a common outlet line, and a plurality of parallel branch lines leading to the plurality of motor controllers. A control selectively in... | 04/19/2011 |
| 7924564 | Integrated antenna structure with an embedded cooling channel According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the pluralit... | 04/12/2011 |
| 7916481 | Electronic board and cold plate for said board The invention relates to an electronic board that comprises: a planar projection plate (42) provided between an intake opening (70) and a discharge opening (72); and a plurality of rectilinear nozzles (86-90) extending through said... | 03/29/2011 |
| 7916480 | Busbar assembly with integrated cooling A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One ... | 03/29/2011 |
| 7911793 | Case and rack system for liquid submersion cooling of electronic devices connected in an array A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, h... | 03/22/2011 |
| 7911792 | Direct dipping cooled power module and packaging A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said... | 03/22/2011 |
| 7907406 | System and method for standby mode cooling of a liquid-cooled electronics rack System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines ... | 03/15/2011 |
| 7907398 | Liquid cooling system A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that ... | 03/15/2011 |
| 7898807 | Methods for making millichannel substrate, and cooling device and apparatus using the substrate A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of ... | 03/01/2011 |
| 7885070 | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coola... | 02/08/2011 |
| 7876561 | Cooling systems for variable speed drives and inductors A plastic liquid cooled variable speed drive or inductor provided. The cooler provides lightweight, space conservative, corrosive free cooling to the components as well as provides a mounting area for modules. A cooler can be mounted to the core of an inductor to ab... | 01/25/2011 |
| 7876562 | Electronic module having thermal cooling insert An electronic module is provided having enhanced thermal cooling of electronics. The module includes a housing, electronic circuitry contained within the housing, and a fluid cooling chamber extending through the housing. The chamber has generally conical shaped por... | 01/25/2011 |
| 7876563 | Cooling structure of power semiconductor device and inverter A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the co... | 01/25/2011 |
| 7872867 | Cooling system for an electronic component system cabinet An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet ... | 01/18/2011 |
| 7864529 | Electronic unit with sealed coolant passage To improve coolant sealing or reduce the risks in the event of leakage for an electronic unit, e.g. an engine control unit, containing electric and/or electronic components which are disposed on an upper side of a thermally conductive electronic base plate and therm... | 01/04/2011 |
| 7864528 | Liquid cooled high-frequency filter The invention refers to a high-frequency filter (1), comprising a filter housing (2), the filter housing (2) having at least one cover element (2a) with at least one resonator (5, 6, 7, 8, 9, 10, 11, 12) positioned therein a... | 01/04/2011 |
| 7864530 | Changing data center cooling modes A method of providing utilities to a computer data center is discussed. The method includes initially connecting one or more non-evaporative cooling units to a data center as primary cooling plants, obtaining a government-issued water permit, and after obtaining the... | 01/04/2011 |
| 7859845 | Phase change material cooling system A cooling system may comprise an array of plates, an array of channels, a conduit system, and a phase change material. The array of channels may have a number of a first type of channels alternating with a number of a second type of channels. The conduit system may ... | 12/28/2010 |
| 7855887 | Inverter unit An inverter unit includes a reactor and switching elements that form a voltage boost circuit that boosts a power supply voltage; a switching element for an inverter that forms an inverter circuit to be supplied with the power supply voltage boosted by the voltage bo... | 12/21/2010 |
| 7855888 | Cooling manifold assembly A cooling apparatus comprising a cooling manifold assembly is disclosed. The cooling manifold assembly comprises a manifold inlet end cap, a manifold outlet end cap and at least one cooling manifold. Cooling fluid flows into the manifold inlet end cap, through the c... | 12/21/2010 |
| 7852629 | Suspension device for a superconducting magnet heat shield enclosure A suspension device mounts a superconducting magnet heat shield enclosure that encompasses a low-temperature container, that encompasses a superconducting magnet and holds coolant for cooling the superconducting magnet. The low-temperature container has an outer hea... | 12/14/2010 |
| 7839640 | Electronic device and a thermal connector used therein An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first ... | 11/23/2010 |
| 7830664 | Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at le... | 11/09/2010 |
| 7826225 | Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator An expansion tank device 14 comprises a tank installation base 16 having a cooling liquid channel 17 and an expansion tank 18 provided on the upper surface of the installation base 16. The base 16 has a communication hole | 11/02/2010 |
| 7826226 | Electric power converter and mounting structure of semiconductor device An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wirin... | 11/02/2010 |
| 7817422 | Heat sink and cooling and packaging stack for press-packages A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material.... | 10/19/2010 |
| 7808781 | Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stres... | 10/05/2010 |
| 7808780 | Variable flow computer cooling system for a data center and method of operation Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted ... | 10/05/2010 |
| 7796388 | Direct cooled power electronics substrate The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically coppe... | 09/14/2010 |
