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Neuroimaging as a Marketing Tool
Neuroimaging as a means for validating whether a stimulus such as advertisement, communication, or product evokes a certain mental response such as emotion, preference, or memory, or to predict the consequences of the stimulus on later behavior such as consumption or purchasing.
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| Number | Title | Issue Date |
| 7111963 | Light source with heat transfer arrangement A light source includes a light head and a heat transfer arrangement. The light head includes a tubular supporting frame, which has an interior space, and a luminary unit provided on the supporting frame. The heat transfer arrangement, for dissipating heat generated... | 09/26/2006 |
| 7110256 | Communication device A communication device which efficiently dissipates locally generated heat, and at the same time is small in size and light in weight, is provided. A high-efficiency heat-dissipating fin section having fins disposed on an heat pipe which is bent into an S shape is m... | 09/19/2006 |
| 7110259 | Heat dissipating device incorporating heat pipe A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between th... | 09/19/2006 |
| 7110258 | Heat dissipating microdevice A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid... | 09/19/2006 |
| 7110260 | Method and apparatus for cooling heat-generating structure An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed i... | 09/19/2006 |
| 7106594 | Simplified mounting configuration that applies pressure force to one central location A heat transfer assembly comprising of an electronic component attached to an attachment point located on a circuit board and a clamping mechanism which applies a downward force against a block. In return, the block applies force against a heat transfer device which... | 09/12/2006 |
| 7105382 | Self-aligned electrodes contained within the trenches of an electroosmotic pump A device where the electrodes of an electroosmotic pump are located directly in the flow-producing region of the electroosmotic pump is described as well as methods of forming such a device. Placing the electrodes of an electroosmotic pump directly in the flow-produ... | 09/12/2006 |
| 7105959 | Cooling jacket and motor unit with cooling jacket A cooling jacket for an electric motor and a motor unit with a cooling jacket mounted on an electric motor having simple structure and capable of being manufactured with reduced number of processes. A cooling pipe made of copper and the like is bent, and held by pla... | 09/12/2006 |
| 7104313 | Apparatus for using fluid laden with nanoparticles for application in electronic cooling An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid. ... | 09/12/2006 |
| 7104312 | Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exch... | 09/12/2006 |
| 7106590 | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve... | 09/12/2006 |
| 7106588 | Power electronic system with passive cooling The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the ... | 09/12/2006 |
| 7104078 | Spray cooling system for transverse thin-film evaporative spray cooling A spray cooling system for transverse evaporative spray cooling in a narrow gap which may generally include a mixing zone, a converging zone, a cooling conduit, and a re-circulation conduit. The spray cooling system in some of its embodiments, provides among other t... | 09/12/2006 |
| 7102374 | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a sp... | 09/05/2006 |
| 7100677 | Integrated liquid cooling system for electrical components A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank define... | 09/05/2006 |
| 7101770 | Capacitive techniques to reduce noise in high speed interconnections Improved methods and structures are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. The present invention offers an improved signal to noise ration. The present invention provides for the fabr... | 09/05/2006 |
| 7096928 | Flexible loop thermosyphon A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit ... | 08/29/2006 |
| 7099153 | Heat dissipating structure for an electronic device A heat dissipating structure for an electronic device includes a heat source and a heat dissipating member. The heat dissipating member has an inner wall, an outer wall, and a plurality of partition walls. The inner wall receives heat transfer from the heat source. ... | 08/29/2006 |
| 7095612 | Cooled electrical terminal assembly and device incorporating same A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid ... | 08/22/2006 |
| 7095613 | Watertight plate and power supply device including the same Provided are a watertight plate where a resin is prevented from leaking and a power supply device including the same. In a base plate (watertight plate) of the present invention, when demarcating a channel by allowing a channel sidewall to contact with a cover plate... | 08/22/2006 |
| 7096292 | On-chip inter-subsystem communication A data transfer interface includes facilities for a subsystem including the data transfer interface to internally prioritize transactions with other subsystems, using facilities of the data transfer interface. In one embodiment, the subsystem also includes with the ... | 08/22/2006 |
| 7090001 | Optimized multiple heat pipe blocks for electronics cooling A plate is thermally coupled to a heat generating device and thermally coupled to two heat pipes. Each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. One or more additional heat pipes can be coupled t... | 08/15/2006 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 7092255 | Thermal management system and method for electronic equipment mounted on coldplates According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow ... | 08/15/2006 |
| 7092254 | Cooling system for electronic devices utilizing fluid flow and agitation A cooling system, the system comprises a housing having an inlet and an outlet, a liquid to be flown from the inlet into the housing and out of outlet to exit the housing. The housing further has an interior portion for an electronic device to reside therein and a v... | 08/15/2006 |
| 7090044 | Electrical apparatus, cooling system therefor, and electric vehicle An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial struct... | 08/15/2006 |
| 7088585 | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valv... | 08/08/2006 |
| 7086247 | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a s... | 08/08/2006 |
| 7086452 | Method and an apparatus for cooling a computer A heat exchanging system that includes a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device, where the system includes a pump coupled to the tube, and a temperature sens... | 08/08/2006 |
| 7086453 | Integrated liquid cooling system for electrical components A liquid cooling system includes a cooling body (10), and a liquid circulation module (20). The cooling body comprises a cooling base (11) for thermally contacting a heat source, and a heat sink (14) mounted on the cooling base. An intern... | 08/08/2006 |
| 7082778 | Self-contained spray cooling module A semiconductor chip cooling system having a body that forms an enclosed spray chamber, and having a thermal-transmittance wall configured to conformingly adjoin to a chip, a substrate or printed circuit board carrying one or more chips, or another such heated devic... | 08/01/2006 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integra... | 08/01/2006 |
| 7078803 | Integrated circuit heat dissipation system An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attac... | 07/18/2006 |
| 7079393 | Fluidic cooling systems and methods for electronic components A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the ... | 07/18/2006 |
| 7079391 | Cooling device for an electrical or electronic unit The invention refers to a cooling device for an electrical/electronic unit, comprising a heat-conductive base body, which has an envelope surface and which is suitable for being contacted with the unit to be cooled, further comprising a cooling profile body which is... | 07/18/2006 |
| 7075329 | Signal isolators using micro-transformers A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a si... | 07/11/2006 |
| 7073569 | Cooling assembly with spirally wound fin The subject invention provides a heat sink for a liquid cooled cooling assembly for removing heat generated by an electronic device. The heat sink includes a flow diverter having a hyperbolic cross section disposed on a base for absorbing a significant portion of th... | 07/11/2006 |
| 7075784 | Systems and methods for providing a dynamically modular processing unit Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an e... | 07/11/2006 |
| 7075785 | Electronic apparatus An electronic apparatus includes a lower housing, an electronic component provided in the lower housing, an upper housing connected to the lower housing, a plurality of fastening members fastening the upper housing and the lower housing to each other and fixed to th... | 07/11/2006 |
| 7075788 | Computer cooling system and method A computer system includes an enclosure, a forced air cooling system configured to create air flow within the enclosure, a printed circuit board and an air flow blockage member. The printed circuit board is within the enclosure and includes a plurality of connectors... | 07/11/2006 |
