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| Number | Title | Issue Date |
| 7262967 | Systems for low cost coaxial liquid cooling According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented w... | 08/28/2007 |
| 7262532 | Arrangement with an electronically commutated external rotor motor A motor structure resistant to liquid intrusion features two modules, the first having an electronically commutated external-rotor motor (20), which motor comprises an internal stator (22) that is arranged on a bearing tube (30) and is separated... | 08/28/2007 |
| 7262966 | Heat sink modules for light and thin electronic equipment A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover t... | 08/28/2007 |
| 7259965 | Integrated circuit coolant microchannel assembly with targeted channel configuration A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent an... | 08/21/2007 |
| 7260624 | Systems and methods for establishing interaction between a local computer and a remote computer Methods and devices provide for remote management of a local computer by transferring screen frames produced by the local computer for viewing at a remote computer. The screen frame data may be obtained by digitizing an analog video output of the local computer and ... | 08/21/2007 |
| 7258161 | Cooling system for densely packed electronic components A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board ... | 08/21/2007 |
| 7256991 | Non-peripherals processing control module having improved heat dissipating properties The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various ... | 08/14/2007 |
| 7256997 | Heat dissipating device having a fan duct A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70... | 08/14/2007 |
| 7255931 | Aluminum/ceramic bonding substrate and method for producing same When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grai... | 08/14/2007 |
| 7255153 | High performance integrated MLC cooling device for high power density ICS and method for manufacturing A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the su... | 08/14/2007 |
| 7256998 | Heat-dissipating structure with air-guiding device A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipati... | 08/14/2007 |
| 7255154 | Cooling device A cooling device includes a heat-radiating device and a centrifugal pump provided in a closed circulation passage for circulating refrigerant. The centrifugal pump contacts and absorbs heat from heat-generating electronic parts by heat exchange of the refrigerant th... | 08/14/2007 |
| 7257002 | Heat radiation device for memory module There is disclosed a heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed... | 08/14/2007 |
| 7254957 | Method and apparatus for cooling with coolant at a subambient pressure According to one embodiment, an apparatus includes a fluid coolant and structure which reduces a pressure of the fluid coolant through a subambient pressure at which the coolant has a cooling temperature less than a temperature of the heat-generating structure. The ... | 08/14/2007 |
| 7257000 | Thermally enhanced pressure regulation of electronics cooling system A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Cond... | 08/14/2007 |
| 7257003 | Electronic unit casing An elastic seal member is formed at the surface of a metal plate included in a gasket, which faces toward a lid, and another elastic seal member is formed at the surface of the metal plate facing toward a side wall. At the metal plate, the seal member is disposed fu... | 08/14/2007 |
| 7254024 | Cooling apparatus and method A Micro Blade is described for implementing an electronic assembly having a thin profile; it is a miniaturized stand-alone unit that is mechanically and thermally rugged, and connects to external components using a cable. The electronic assembly is preferably fabric... | 08/07/2007 |
| 7254027 | Processor module for system board Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and ... | 08/07/2007 |
| 7254025 | Cooling mechanisms associated with card adapter A structure may be coupled to an adapter coupling two or more modules together. In some embodiments, the structure may direct air and/or dissipate heat from the modules into the air. The structures may direct air to components on a module that might receive less air... | 08/07/2007 |
| 7252167 | Electrical apparatus, cooling system therefor, and electric vehicle An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial struct... | 08/07/2007 |
| 7252140 | Apparatus and method for enhanced heat transfer One embodiment of the cooling module is implemented as a device having a heat sink and an integrated synthetic jet actuator. The heat sink is configured to have a channel and a jet distribution system associated with the synthetic jet actuator directs fluid flow int... | 08/07/2007 |
| 7249718 | Cooling system with a variable maximum operation level A cooling system for an electronic system having at least one heat-generating component includes at least one fan and an operation level setting mechanism. The at least one fan is configured to blow air through the electronic system to thereby dissipate heat generat... | 07/31/2007 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
| 7251137 | Electronic component cooling apparatus An electronic component, cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for givin... | 07/31/2007 |
| 7249625 | Water-cooling heat dissipation device A heat dissipation system includes a housing, a circulator and a cooler. The housing has at least one surface made of heat-conductive metal to contact with a heat source. The housing includes a recess with a passage formed on the bottom to contain cooling liquid and... | 07/31/2007 |
| 7251139 | Thermal management arrangement for standardized peripherals Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device. ... | 07/31/2007 |
| 7248475 | Wireless device enclosure using piezoelectric cooling structures An enclosure for a wireless device includes a first compartment and a second compartment. The first compartment is to house some or all of the electronic circuitry of the wireless device and is sealed from an exterior environment. The second compartment is adjacent ... | 07/24/2007 |
| 7246940 | Method and apparatus for managing the temperature of thermal components A temperature management system for managing the temperature of a discrete, thermal component. The temperature management system comprises a heat exchanger thermally coupled with the thermal component. The system also comprises a fluid transfer device that circulate... | 07/24/2007 |
| 7248478 | Coolant cooled type semiconductor device A semiconductor device includes a cooling unit in which coolant flows, a semiconductor chip having two main surfaces press-pinched by the cooling unit, and an electronic member different from the semiconductor chip. The electronic member is located to contact the co... | 07/24/2007 |
| 7246655 | Heat transfer device A heat transfer device including a sealed container, a base layer, formed on the bottom face of the container, and a wick is provided. The wick has a plurality of projections protruding upward from the base layer. A fluid is encapsulated in the container. The heat t... | 07/24/2007 |
| 7248483 | High power density insulated metal substrate based power converter assembly with very low BUS impedance An electrical power circuit assembly including an insulated metal substrate (IMS) printed circuit board (PCB), a filter (PCB), and one or more bus bars disposed between the IMS PCB and the filter (PCB), the bus bar geometry configured to reduce the inductance betwee... | 07/24/2007 |
| 7245495 | Feedback controlled magneto-hydrodynamic heat sink A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is ... | 07/17/2007 |
| 7245493 | Cooler for cooling electric part A cooler cools a plurality of electric parts from both sides thereof. The cooler includes a plurality of cooling units including a pair of cooling tubes for flowing coolant therethrough. A pair of cooling tubes having a flat shape is disposed to sandwich the electri... | 07/17/2007 |
| 7243705 | Integrated circuit coolant microchannel with compliant cover An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a c... | 07/17/2007 |
| 7243706 | Heatsink for power devices A heatsink for a power device comprises an upper conductive plate providing a first surface; a lower conductive plate providing a second surface; a middle conductive plate provided between the upper and lower plates, the middle plate having a hollow portion and a so... | 07/17/2007 |
| 7240500 | Dynamic fluid sprayjet delivery system An adaptable semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. Within the enclosure is a sprayer delivery system with a height-controllable sprayer fo... | 07/10/2007 |
| 7242574 | Robust customizable computer processing system The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligenc... | 07/10/2007 |
| 7242581 | Liquid cooling system and an electronic apparatus applying the same therein A liquid cooling system, enabling protection from corrosion due to liquid coolant for a long time-period (5–10 years) while cooling a heat-generation body effectively, comprises a pump 108, a heat-receiving jacket 107, a radiator for radiating heat i... | 07/10/2007 |
| 7235164 | Electrokinetic pump having capacitive electrodes An electrokinetic pump achieves high and low flow rates without producing significant gaseous byproducts and without significant evolution of the pump fluid. A first feature of the pump is that the electrodes in the pump are capacitive with a capacitance of at least... | 06/26/2007 |
| 7236363 | Liquid cooled system module Example sealed electronics modules are described. The sealed electronics module may include electronics components. The sealed electronics module may also include one or more connectors configured to provide one or more detachable liquid connections to a liquid tran... | 06/26/2007 |
