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President Rutherford B. Hayes ; Said in 1876, after Alexander Graham Bell demonstrated the telephone to him at the White House
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| Number | Title | Issue Date |
| 7286346 | Peripheral device and electronic device A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component to the host device; a heat transfer device having a first end thermal... | 10/23/2007 |
| 7283365 | Jet impingement cooling apparatus and method A nozzle useful for enhancing localized cooling of electronic elements and the like is provided. The nozzle is mountable on a substantially planar face of a substrate. It is conformed to intercept a fluid flowing across said face and redirect it toward the substrate... | 10/16/2007 |
| 7281388 | Apparatus to use a refrigerator in mobile computing device An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator includes a cold reservoir to absorb heat generated by a heat generating unit of the mobile device. A heat exchanger is used to dissipate heat of a hot r... | 10/16/2007 |
| 7283843 | Systems and methods for receiver upgrade Systems and methods for an upgradeable and/or reconfigurable receiver are provided. In general, the present invention is directed to providing systems and methods for designing an electronic communication system having easy and cost effective upgradeable receiver sy... | 10/16/2007 |
| 7278467 | Liquid-cooled heat radiator kit A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, ea... | 10/09/2007 |
| 7278468 | Heat sink with multiple coolant inlets The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins dis... | 10/09/2007 |
| 7278471 | Multi-layered micro-channel heat sink The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a qua... | 10/09/2007 |
| 7278474 | Heat exchanger A heat exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (... | 10/09/2007 |
| 7280357 | Pump and electronic device having the pump In one embodiment of the invention, a pump includes a pump housing, an impeller, and a motor. The pump housing has a pump chamber and a heat receiving plate to couple to a heat generating unit, such as a CPU. The impeller is provided in the pump chamber. The motor c... | 10/09/2007 |
| 7278549 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 10/09/2007 |
| 7280363 | Apparatus for controlling thermal interface between cold plate and integrated circuit chip The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat si... | 10/09/2007 |
| 7280358 | Liquid loop with multiple heat exchangers for efficient space utilization A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability. ... | 10/09/2007 |
| 7280365 | Multi-processor module with redundant power One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the proce... | 10/09/2007 |
| 7278466 | Semiconductor device cooling apparatus In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact ther... | 10/09/2007 |
| 7277300 | Vent grid and electronic apparatus employing the same A vent grid has parallel first electrically-conductive members and parallel second electrically-conductive members intersecting with the first electrically-conductive members. The intersection between the first and second electrically-conductive members is forced to... | 10/02/2007 |
| 7277295 | Industrial ethernet switch According to one embodiment of the invention, an apparatus includes a housing having a front side and a bottom side adjacent the front side. The apparatus also includes a plurality of light generating devices each operable to generate light in response to operation ... | 10/02/2007 |
| 7277282 | Integrated circuit cooling system including heat pipes and external heat sink An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the h... | 10/02/2007 |
| 7277291 | Thermal transfer device A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an... | 10/02/2007 |
| 7277283 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting co... | 10/02/2007 |
| 7277284 | Microchannel heat sink A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip, and one or more recesses disposed in a surface communicated to the one ... | 10/02/2007 |
| 7277287 | Heat dissipation device with heat pipes A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat.... | 10/02/2007 |
| 7274566 | Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within ... | 09/25/2007 |
| 7274567 | Capillary tube bubble containment in liquid cooling systems According to some embodiments, a capillary tube may be utilized to facilitate bubble containment in liquid cooling systems. For example, a system may comprise a first volume to contain a liquid, a second volume to contain the liquid and a gas, a capillary tube confi... | 09/25/2007 |
| 7274568 | Apparatus and method for cooling semiconductor devices An apparatus and method for cooling semiconductor devices. A cooling system for semiconductor devices is disclosed and includes a semiconductor substrate, horizontal channels and a cooling medium. Specifically, the semiconductor substrate is incorporated into a die.... | 09/25/2007 |
| 7273088 | One or more heat exchanger components in major part operably locatable outside computer chassis One or more heat exchanger components of an apparatus are in major part operably locatable outside a computer chassis and serve to reduce one or more temperatures of one or more heat producing components supported with the computer chassis. ... | 09/25/2007 |
| 7273089 | Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components According to one embodiment of the invention, an electronic apparatus comprises a main unit, a display unit and a support unit. The main unit contains a heat-generating component and a heat-receiving portion. The heat-receiving portion is thermally connected to the ... | 09/25/2007 |
| 7273092 | Modularized cooler A modularized cooler includes the at least two heat radiator modules arranged in a stack, each heat radiator module having a set of radiation fins, heat-exchange tubes arranged in parallel and surrounded by the radiation fins, two locating plates holding the heat-ex... | 09/25/2007 |
| 7272005 | Multi-element heat exchange assemblies and methods of fabrication for a cooling system A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat excha... | 09/18/2007 |
| 7272006 | IC coolant microchannel assembly with integrated attachment hardware An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatu... | 09/18/2007 |
| 7270446 | Light module with combined heat transferring plate and heat transferring pipes A light module comprises a light unit, a heat transferring plate or a plurality of heat transferring pipes, and a plurality of heat dissipating fins. The heat transferring plate or heat transferring pipes are positioned on the bottom surface of the light unit to tra... | 09/18/2007 |
| 7267866 | Heat control method and heat controller A heat controller for an object, having a composite material formed of a base material radiating a large amount of heat at a high-temperature phase and a phase-change substance having insulation properties at a high-temperature phase, having metallic properties at a... | 09/11/2007 |
| 7269005 | Pumped loop cooling with remote heat exchanger and display cooling A notebook computer system that utilizes both natural convection and forced convection cooling methods is described. Specifically, at low power levels, the forced convection components are disabled to conserve energy and to reduce noise. ... | 09/11/2007 |
| 7267553 | Optical transceiver using optical sub-assembly having multiple lead pins connected to the substrate by a flexible printed circuit The present invention provides a coupling mechanism between the optical subassembly and the circuit board using the FPC board. The mechanism according to the present invention may release the mechanical stress induced in the root portion of the lead pin of the optic... | 09/11/2007 |
| 7268690 | Industrial ethernet switch According to one embodiment of the invention a rugged Ethernet switch includes a housing and a passive cooling system associated with the housing and being devoid of fans as operable to cool the Ethernet switch. Ethernet switch also includes software operable to per... | 09/11/2007 |
| 7269013 | Heat dissipation device having phase-changeable medium therein A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a pe... | 09/11/2007 |
| 7269011 | Impingement cooled heat sink with uniformly spaced curved channels A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit positi... | 09/11/2007 |
| 7265977 | Active liquid metal thermal spreader The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is dis... | 09/04/2007 |
| 7264359 | Cooling apparatus A cooling apparatus includes a heat receiving casing thermally joined to a heating object directly or indirectly, a first device having hoses which communicate inside of the heat receiving casing, a fluid medium inside the heat receiving casing and in the hoses. The... | 09/04/2007 |
| 7265978 | Control apparatus having fluid passage for cooling purpose A control apparatus includes a body, a fixation plate and a control circuit arrangement. The body includes first and second fluid passages, which conduct fluid. The fixation plate is installed to the body on one side of the body and includes a third fluid passage, w... | 09/04/2007 |
| 7265976 | Microchannel thermal management system A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a plurality of microchannels attached to the interior surface of the housi... | 09/04/2007 |
