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Patent No. 5265827

Paddle Wheel Plane

An aircraft having vertical takeoff and landing capability provided with at least first and second laterally extending paddle wheels rotatable on a central axis perpendicular to the longitudinal axis of the aircraft fuselage and between its nose and tail.

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Class 361/698 - And liquid


Subclass of Class 361 - Electricity: electrical systems and devices
Definition: Subject matter wherein the fluid comprises (a) the air and
No. of patents: 302
Last issue date: 11/08/2011


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NumberTitleIssue Date
4646202Cabinet for electronic apparatus
A cabinet (1) for stowage of electronic printed circuit boards (2,3,4) for example, is adapted for permanent installation in a vehicle structure by allowing the boards to be readily removable. The cabinet can thus be readily cooled by both air and fluid j...
02/24/1987
4635709Dual mode heat exchanger
A dual mode heat exchanger 10 for cooling airborne electronics 12 through a cold plate 14. The heat exchanger either radiates heat to air through radiator fins 18 or absorbs heat by evaporative cooling. A liquid coolant contained in grooves 16 of the cold...
01/13/1987
4616694Fireproof cabinet system for electronic equipment
A fireproof cabinet system for electronic equipment including a wall shield with an outer metal layer that acts as a radiation shield, an inner support layer and an insulation layer. A water supply nozzle is mounted on top of the fireproof cabinet system ...
10/14/1986
4566529Cooling device, in which converters or rectifiers or other semiconductor components are immersed in boiling liquor
Cooling device for semiconductor components, including a chamber for receiving semiconductor components, boiling liquid disposed in the chamber for immersing the semiconductor components, a device connected to the chamber for supplying a cooling air to el...
01/28/1986
4514746Apparatus for cooling telecommunications equipment in a rack
A rack contains a number of shelves arranged on top of each other, which carry, among other things, board magazines with printed circuit boards. An apparatus for cooling the aforesaid printed circuit boards containing telecommunications or electronic equi...
04/30/1985
4494171Impingement cooling apparatus for heat liberating device
The present invention relates to an impingement cooling apparatus for use in the removal of heat from a heat liberating device. The apparatus includes a housing on which the device is secured and a stack of plates fitted within the housing. One of the pla...
01/15/1985
4493010Electronic packaging module utilizing phase-change conductive cooling
Each individual module includes a sealed chamber containing the electronic components being cooled, the liquid cooling medium, and at least one minature evaporator. The evaporator's outer surface area is in direct contact with the cooling medium, so as to...
01/08/1985
4450505Apparatus for cooling integrated circuit chips
A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellow...
05/22/1984
4414604Heat radiation system for electronic devices
A container for electronic devices including heat generating elements comprises at least a first vertical wall portion formed therein with a closed conduit system and a heat exchange medium filling said closed conduit system, said heat exchange medium cha...
11/08/1983
4368503Hollow multilayer printed wiring board
A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates (1), (2), (3) and (4), superposed upon each other with a predeterm...
01/11/1983
4327399Heat pipe cooling arrangement for integrated circuit chips
A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Int...
04/27/1982
4315300Cooling arrangement for plug-in module assembly
An improved cooling arrangement for an electronic plug-in module assembly ving a plurality of modules supported in grooves in a pair of parallel sides. Each parallel side is provided with fluid passageways for carrying a cooling liquid for removing heat t...
02/09/1982
4285027Cooling system
The invention is concerned with a cooling system for cooling telecommunication equipment at an unattended microwave relay station or the like located in desert or like regions where there is a large difference between the maximum daytime temperature and m...
08/18/1981
4245273Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
A package for mounting, interconnecting, and cooling a large number of integrated circuit semiconductor devices having a sintered multilayer ceramic substrate provided with an internal metallurgy network made up of voltage planes, X and Y signal planes, a...
01/13/1981
4233645Semiconductor package with improved conduction cooling structure
A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deform...
11/11/1980
4183400Heat exchanger
A heat exchanger including a heat-dissipating element, a heat-receiving element and a circulating means for circulating a liquid in a closed cycle between the heat-dissipating element and the heat-receiving element. The circulating means includes an air/l...
01/15/1980
4120021Cooling system for electronic assembly
The chassis for an electronic assembly includes a plurality of cooling bars which are mounted parallel to each other and spaced apart to receive electronic assembly modules. The cooling bars have internal passages for the flow of coolant, and the bars hav...
10/10/1978
4044396Heat pipe cooling of airborne phased array radar
A system for controlling temperature in phased array radar modules where a combination support plate-heat exchanger allows a cooling fluid to circulate therethrough and a heat pipe extends the length of the module and into the support plate-heat exchanger...
08/23/1977
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