Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 6038129 | Cooling electronic apparatus An electronic apparatus having a heat dissipative external enclosure is disclosed. The external enclosure having a containment wall from which depend extended surfaces or fins having a length extending vertically and defining channels therebetween. The th... | 03/14/2000 |
| 5999404 | Spray cooled module with removable spray cooled sub-module An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a co... | 12/07/1999 |
| 5953211 | Apparatus including heat sink structure for removing heat from a printed circuit board An apparatus, such as a computer, comprises a housing having an interior portion into which a printed circuit board may be inserted. The printed circuit board, when inserted, is supported by a support structure. A spring mechanism resiliently supports a h... | 09/14/1999 |
| 5946189 | Pivotable support and heat sink apparatus removably connectable without tools to a computer processor A combination support and heat sink structure is mounted within a computer housing for pivotal movement between connected and disconnected positions and includes a pair of cooling plates, one air cooled and the other liquid cooled, carried in a spaced apa... | 08/31/1999 |
| 5940270 | Two-phase constant-pressure closed-loop water cooling system for a heat producing device A cooling device for a machine, especially, but not limited to, a device for cooling the central processing unit (CPU) of a desktop computer, thereby increasing the speed at which it can operate. In the preferred embodiment, the cooling device includes a ... | 08/17/1999 |
| 5886872 | Pivotable support and heat sink apparatus removably connectable without tools to a computer processor A combination support and heat sink structure is mounted within a computer housing for pivotal movement between connected and disconnected positions and includes a pair of cooling plates, one air cooled and the other liquid cooled, carried in a spaced apa... | 03/23/1999 |
| 5880931 | Spray cooled circuit card cage A spray cooled circuit card cage includes opposed card guides separated by opposed card cage side panels. Each card guide carries a top rail and lower manifold. The manifold provides coolant fluid to a plurality of spray plate assemblies, which direct a s... | 03/09/1999 |
| 5870823 | Method of forming a multilayer electronic packaging substrate with integral cooling channels Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating elect... | 02/16/1999 |
| 5863455 | Colloidal insulating and cooling fluid Colloidal fluids having improved insulating and/or cooling properties. Embodiments of the invention involve colloidal fluids which comprise a carrier liquid and a dispersed phase of non-metallic particles, wherein the colloidal fluid has a saturation magn... | 01/26/1999 |
| 5841634 | Liquid-cooled baffle series/parallel heat sink A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port remov... | 11/24/1998 |
| 5729995 | Electronic component cooling unit In an electronic component cooling unit, parts of the outer surfaces of a plurality of passageways in which refrigerant flows are coupled to one surface of a cold plate on the other surface of which an electronic component is mounted, and a header tank is... | 03/24/1998 |
| 5620646 | Method for cooling electrical components in a plastics processing machine A cooling method that involves circulating a liquid coolant through the motor housings and mounting surfaces for electrical/electronic components, such as the electric motors and associated electronic drives, in electric plastic processing machines. Speci... | 04/15/1997 |
| 5621614 | Apparatus for mounting and enclosing an appliance The apparatus of the present invention comprises a housing defining a closed interior volume of a size sufficient to accommodate the appliance, a first heat sink located within the housing, a second heat sink located outside the housing, a reversible heat... | 04/15/1997 |
| 5596228 | Apparatus for cooling charge coupled device imaging systems Apparatus for cooling charge-coupled device (CCD) imaging systems. The apparatus comprises a thermoelectric cooler thermally coupled to the imaging system for transferring heat away from and cooling the imaging system portion of the imaging system. The th... | 01/21/1997 |
| 5508884 | System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind. The system for dissipating heat of the invention is of the type comprising a sealed metal enclosure (21) the interior volume of which co... | 04/16/1996 |
| 5475563 | PCMCIA card heat removal apparatus and methods Operating heat generated by a PCMCIA card inserted into the base housing portion of a computer, representatively a notebook computer, is dissipated by a heat sink system disposed within the base housing. In response to insertion of the card into its assoc... | 12/12/1995 |
| 5457603 | Arrangement for cooling electronic equipment by radiation transfer An arrangement for cooling electronic equipment in a space by using radiation transfer, wherein the equipment includes heat-emitting electronic components mounted on a circuit board or the like. According to the invention, each circuit board or the like i... | 10/10/1995 |
| 5455458 | Phase change cooling of semiconductor power modules Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperatur... | 10/03/1995 |
| 5424916 | Combination conductive and convective heatsink A combination conductive and convective heatsink for use in an electronic module including a heatsink member having first and second major planar surfaces; each surface adapted for thermally engaging with an adjacent electronic circuit element. The heatsi... | 06/13/1995 |
| 5384687 | Cooling structure for electronic circuit package A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plat... | 01/24/1995 |
| 5268812 | Cooling multi-chip modules using embedded heat pipes An apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substr... | 12/07/1993 |
| 5251095 | Low temperature conduction module for a cryogenically-cooled processor A hermetic electronic assembly incorporating cryogenically-cooled and air-cooled elements in an integrated assembly. A hermetic cryogenically-cooled enclosure is disposed in close physical proximity to one or more air-cooled circuit cards to minimize phys... | 10/05/1993 |
| 5213153 | Heat radiating device A radiating device 10 has a rectangular parallelepiped block 11. Block 11 includes a first group of holes 12 to 19 and a second group of holes 20 to 23 causing convection of air. Passages for circulating gas and liquid serving as a heat pipe, are formed t... | 05/25/1993 |
| 5144811 | Condensation control system for water-cooled electronics A water cooling condensation control system having a water inlet line valve which is opened only when the equipment being cooled is receiving electrical power, an ambient temperature sensor for sensing the dry bulb temperature of the ambient air in the vi... | 09/08/1992 |
| 5131456 | Bimetallic insert fin for high conduction cooling structure A high conduction cooling structure useful for dissipating heat from integrated circuit devices includes a cooling base (10), a bulk heat transfer element (18), adjacent spaced apart cooling fins (14 and 16), and a bimetallic strip (22). The cooling base ... | 07/21/1992 |
| 5131233 | Gas-liquid forced turbulence cooling A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effec... | 07/21/1992 |
| 5091824 | Hold down interconnection stick A hold down interconnection stick is provided which is fastened to the ou walls of a container of an electronic system and to the electronic printed circuit boards which form a part of the electronic system. The stick is also provided with heat dissipati... | 02/25/1992 |
| 5048599 | Leak tolerant liquid cooling system employing an improved air purging mechanism A leak tolerant liquid cooling system for electrical components comprises a cooling circuit which contains a pump and conduits that circulate a liquid coolant past the electrical components and through the bottom chamber of a purge tank. This purge tank a... | 09/17/1991 |
| 5021924 | Semiconductor cooling device A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convectio... | 06/04/1991 |
| 5016138 | Three dimensional integrated circuit package This invention discloses a three-dimensional, high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together. Techniques for interconnecting the layers to one another and for connectin... | 05/14/1991 |
| 4997032 | Thermal transfer bag A thermal transfer means comprising a flexible bag or pouch filled with a chemically inert, electrically nonconductive, nonflammable, essentially gas-free, thermally stable, thermally conductive, body of liquid comprising fluorochemical liquid. Said bag i... | 03/05/1991 |
| 4967832 | Cooling method and apparatus for integrated circuit chips A method and apparatus for lowering integrated circuit chip ambient temperatures uses negative pressure to induce cooling liquid flow, rather than prior art positive pressure approaches, thereby preventing undesirable cooling liquid leakage outside of the... | 11/06/1990 |
| 4965658 | System for mounting and cooling power semiconductor devices Semiconductor apparatus for mounting and cooling disc type semiconductor devices. The apparatus includes two disc type semiconductor devices each having a pole face thereof in contact with a first terminal bar, that bar in turn being in contact, through t... | 10/23/1990 |
| 4944344 | Hermetically sealed modular electronic cold plate utilizing reflux cooling A modular reflux cooling plate (10) having a condensing region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. The condenser (11) and boiling channels (12) can be const... | 07/31/1990 |
| 4941530 | Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling A modular reflux cooling plate (10) having a condenser region (11) above the boiling channels (12) or above and below (11,24) the region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircra... | 07/17/1990 |
| 4897762 | Cooling system and method for electronic circuit devices In a system for cooling electronic circuit devices to be tested, e.g., LSIs a cooling fluid is sprayed against the cooling surface of an electronic circuit device to cool the device, and also air is supplied in the opposite direction to the flow of the co... | 01/30/1990 |
| 4798238 | Shelter for thermally conditioning electronic appliances This invention relates to a shelter for thermally conditioning in particular electronic appliances which generate heat. The shelter comprises a closed box-like structure with thermoinsulating walls which houses the appliance to be conditioned, as well as ... | 01/17/1989 |
| 4772980 | Immersion cooling safety monitoring system A safety monitoring system for an immersion cooling system of a large, high-density electronic assembly such as a supercomputer protects against the possibility of toxic gas formation due to overheating and breakdown of the cooling liquid caused by a syst... | 09/20/1988 |
| 4704658 | Evaporation cooling module for semiconductor devices An evaporation cooling module for cooling plural semiconductor chips bonded on circuit boards immersed in a coolant within the module employs immersed heat exchangers associated with bubble traps which trap gaseous bubbles of evaporated coolant and mainta... | 11/03/1987 |
| 4698728 | Leak tolerant liquid cooling system A leak tolerant cooling system, for cooling electrical components with a liquid comprises: a frame holding a plurality of printed circuit boards, each of which have electrical components attached thereto; a top reservoir, mounted on the frame above the bo... | 10/06/1987 |
