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| Number | Title | Issue Date |
| 6434003 | Liquid-cooled power semiconductor device heatsink The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed c... | 08/13/2002 |
| 6422304 | System and method for cooling a central processing unit An auxiliary cooling system for cooling a central processing unit (CPU) of a computer. The system includes an inner tube provided within an outer tube. A first end of the outer tube is attached to a fan and a second end of the outer tube is attached to a ... | 07/23/2002 |
| 6421240 | Cooling arrangement for high performance electronic components A cooling arrangement facilitates the cooler and quieter operation of an electronic system located within an enclosure, wherein the electronic system includes a plurality of circuit boards having a plurality of integrated circuit elements disposed within ... | 07/16/2002 |
| 6407921 | Cooling unit for cooling a heat-generating component in an electronic apparatus A cooling unit having a heat-receiving portion and a heat-exchanging portion. The heat-receiving portion is thermally connected to a heat-generating component. The heat-exchanging portion receives heat from the heat-receiving portion, at a position differ... | 06/18/2002 |
| 6404640 | Liquid-cooled electronic apparatus An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A conne... | 06/11/2002 |
| 6381135 | Loop heat pipe for mobile computers A heat transfer device for a mobile computer system using a loop heat pipe, the evaporator of the loop heat pipe coupled to the processor die. The vapor space and liquid space are separated. The separation of the vapor space, and the wick structure of the... | 04/30/2002 |
| 6373700 | Heat sink modular structure inside an electronic product The present invention of a heat sink modular structure inside an electronic product comprises of a heat sink fan mounted on one end of an air channel pipe body blowing the heat thereon outward from an outlet of an air channel disposed inside the said air ... | 04/16/2002 |
| 6366460 | Heat dissipation structure for electronic apparatus component A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in th... | 04/02/2002 |
| 6364003 | Device and method for absorbing and radiating heat in very small space by alternately pushing two fluids A heat absorbing and radiating device includes a driving unit having communicable first fluid outlets and fourth fluid inlets, a heat-exchange unit communicating at an end with third fluid outlets of the driving unit and at another end with an inlet end o... | 04/02/2002 |
| 6356445 | Heat dissipating device for electronic device A heat dissipating device includes a heat sink (50) for removing heat from an electronic device (90), and a plurality of adjusters (45) for adjusting distance and contact force between the electronic device and the heat sink. The heat sink defines a plura... | 03/12/2002 |
| 6345665 | Cooling system The invention pertains to a new type of cooling system for cooling of heat sources, especially for cooling of electric components, with a cooler comprising, on a housing through which a coolant can flow, at least one first cooling surface that can be spla... | 02/12/2002 |
| 6317322 | Plate type heat pipe and a cooling system using same A plate type heat pipe having a hermetically sealed container installed so as to face a printed board on which at least one part to be cooled is mounted, wherein a block which passes through at least one main surface portion of the container is arranged w... | 11/13/2001 |
| 6317326 | Integrated circuit device package and heat dissipation device An integrated circuit device package is integrated with a heat dissipation member to reduce the number of junctions in a packaged integrated circuit device. For example, the integrated circuit device package may include a substrate and a thermally conduct... | 11/13/2001 |
| 6305463 | Air or liquid cooled computer module cold plate A cold plate that provides air or liquid cooling for a computer circuit module and has at least one mounting plate with a board mounting surface on one side for carrying a printed circuit board assembly and a cooling surface located on the other side. A c... | 10/23/2001 |
| 6301107 | Heat dissipation structure for electronic apparatus component A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in th... | 10/09/2001 |
| 6295199 | Electronics module and a method of manufacturing such a module The module has a metal substrate having one major face that is insulated and that carries electrical connection tracks, and at least one power component fixed to the substrate and having connection tabs (20) that are soldered to the tracks. The power comp... | 09/25/2001 |
| 6282089 | Portable computer cooling method and computer holder A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the at... | 08/28/2001 |
| 6275945 | Apparatus for radiating heat for use in computer system In a computer system using an expanded unit for obtaining an expanded function, a heat sink of a computer main body and a heat sink of the expanded unit are connected to each other when the computer main body and the expanded unit are connected to each ot... | 08/14/2001 |
| 6262891 | Component holder with circulating air cooling of electrical components A component carrier (2) with electric components (4) mounted thereon, having at least one channel (14) for cooling liquid, characterized in that the component carrier (2) has an air cooling body (6), and a fan (8) is associated with the component carrier ... | 07/17/2001 |
| 6252771 | Removable remote control amplifier An amplifier having removable remote controls and the ability to easily couple with other amplifiers for easy mounting is disclosed. The amplifier includes removable remote controls and isocoupling systems that connect two or more amplifiers and that elec... | 06/26/2001 |
| 6236566 | Cooling element for a power electronic device and power electronic device comprising same A cooling element (2) for power electronic devices comprises heat-exchange fluid inlet and outlet apparatus (29) and an interior volume in which said fluid circulates. The element (2) is made from an electrically insulative material and comprises at least... | 05/22/2001 |
| 6233146 | Rotatable portable computer remote heat exchanger with heat pipe A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end per... | 05/15/2001 |
| 6226179 | Mounting structure of a semiconductor device module for a computer system A mounting structure for mounting a semiconductor device module in a computer system, comprises a housing for mounting a motherboard having peripheral ports for connecting with various peripheral devices, an opening formed in the housing for allowing the ... | 05/01/2001 |
| 6215661 | Heat spreader An electronic package (10) designed to be mounted in a space vehicle includes active electronic components that produce heat energy during operation and has a shear plate (12) attached to a heat sink (13). A heat spreader (11) includes an L-shaped plate o... | 04/10/2001 |
| 6215658 | Structure for housing and heat sinking equipment pieces in an aeronautic or space vehicle Structure for housing and heat sinking active equipment pieces (3; 2) in a space vehicle, comprising a constraining external container (1; 46) containing a cooling gas or a mixture of gases, means for mechanically holding said boxes (3; 2) into the contai... | 04/10/2001 |
| 6208511 | Arrangement for enclosing a fluid and method of manufacturing a fluid retaining enclosure An arrangement for enclosing a fluid includes a circuit board and an enclosure member. The circuit board includes an electronic component secured thereto. The enclosure member is secured to the circuit board such that the enclosure member and the circuit ... | 03/27/2001 |
| 6201221 | Method and apparatus for heat regulating electronics products A heating/cooling apparatus for electronic components of a wireless base station is described. The apparatus includes a heat exchanger having a material-filled chamber and a plurality of extrusions. The chamber is located adjacent to the electronic compon... | 03/13/2001 |
| 6181558 | Heat absorber and combination electrical apparatus producing heat and heat absorber A heat absorber including a container providing an internal cavity, phase change material, such as microencapsulated phase change material, residing in the cavity, the container including at least one wall of thermally conductive material in thermal conta... | 01/30/2001 |
| 6181553 | Arrangement and method for transferring heat from a portable personal computer An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, there is provided to the provision of an arrangement for increasing the cooling capacity of portable personal computers, particularly such as l... | 01/30/2001 |
| 6181551 | Pin soldering enhancement and method A multi-layer circuit board includes several metallic layers. Each metallic layer includes a metallic ring surrounding a component pin hole formed through each layer of the board. The ring is isolated from its respective metallic layer by a concentric gap... | 01/30/2001 |
| 6178088 | Electronic apparatus An electronic apparatus having a heat pipe that is thermally bonded to plates to internal and external enclosures. The electronic apparatus is located in a heat dissipative external enclosure. The electronic apparatus having at least one unit contained in... | 01/23/2001 |
| 6141215 | Hybrid cooling heat exchanger fin geometry and orientation A cooling system for a computer includes a chassis having a sidewall with an opening formed therein. A heat spreader plate is mounted in the chassis including a heat sink attached thereto adjacent the sidewall. The heat sink has a side mounted base and a ... | 10/31/2000 |
| 6115252 | Heat sink device for electronic devices A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a he... | 09/05/2000 |
| 6111750 | Electronic apparatus Electronic apparatus is contained in a heat dissipative external enclosure 2. The enclosure contains at least one unit contained in a thermally conductive internal housing 4,6 providing RF isolation and mounted on a wall 7 of the enclosure in thermal cont... | 08/29/2000 |
| 6108201 | Fluid control apparatus and method for spray cooling A fluid control apparatus is adapted for use with a spray plate 100 having at least one atomizer 120 which cools an associated printed circuit board 200 carrying one or more heat-generating components such as integrated circuits 220. At least one spray pl... | 08/22/2000 |
| 6104610 | EMI shielding fluid control apparatus An EMI shielding fluid control shroud is adapted for use in spray cooling EMI producing or EMI sensitive components. The EMI shielding shroud, carried between a printed circuit board and a spray plate, defines an interior spray cavity which prevents inter... | 08/15/2000 |
| 6080953 | Power supply device for electrical discharge machining The power supply device for electrical discharge machining includes circuit component elements for converting a voltage from a power supply to a given pulse voltage which can be supplied to a minute gap between an electrode and a workpiece so that electri... | 06/27/2000 |
| 6061235 | Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus incl... | 05/09/2000 |
| 6058012 | Apparatus, method and system for thermal management of an electronic system having semiconductor devices A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the hi... | 05/02/2000 |
| 6052284 | Printed circuit board with electronic devices mounted thereon A cooler-equipped printed circuit board, in which electronic devices arranged in a matrix form on the printed circuit board are covered with a sealed case held in liquidtight contact with the board and having a coolant channel from an inlet port and an ou... | 04/18/2000 |
