Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 6845011 | Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component An electronic apparatus includes a first housing and a second housing. The first housing incorporates a pump. The second housing incorporates a heat-radiating portion. The pump has a heat-receiving portion. A circulation path for circulating liquid coolant connects ... | 01/18/2005 |
| 6839234 | Cooling device and an electronic apparatus including the same A pump for circulating a coolant has a housing thereof in direct thermal connection with an electronic component. This provides both the improvement of cooling efficiency of a cooling device and the realization of a compact, slim design of the device. ... | 01/04/2005 |
| 6833992 | Electronic apparatus having a plurality of radiators in which liquid coolant flows An electronic apparatus comprises a heat-generating component, a main unit having a heat-receiving portion thermally connected to the heat-generating component, and a display unit supported by the main unit. The display unit incorporates a heat-radiating portion whi... | 12/21/2004 |
| 6832646 | Cooler for electronic device This is a cooler for dissipating heat away from an electronic device (A). The cooler includes a liquid cooling mechanism (B), a forcible air cooling mechanism (C) and a substrate (D). The liquid cooling mechanism includes a set of metal pipes (20-21) connecte... | 12/21/2004 |
| 6799628 | Heat exchanger having silicon nitride substrate for mounting high power electronic components A heat exchanger includes a silicon nitride substrate. Electronic components may be surface mounted to the substrate. A fluid passageway in the heat exchanger allows a coolant to flow therethrough and carry away heat from the electronic components. ... | 10/05/2004 |
| 6785134 | Embedded liquid pump and microchannel cooling system Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die coolin... | 08/31/2004 |
| 6757169 | Electronic apparatus In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, ... | 06/29/2004 |
| 6741469 | Refrigeration cooling assisted MEMS-based micro-channel cooling system A refrigeration cooling assisted MEMS-based micro-channel cooling system that removes high heat densities generated by microelectronic components using a primary cooling system thermally coupled with a secondary chip embedded cooling system. ... | 05/25/2004 |
| 6717811 | Heat dissipating apparatus for interface cards A heat dissipating apparatus for use with an interface card including a display card or other add-on card has a heat sink, a heat pipe located on the heat sink and an airflow generator located on the hear sink. The apparatus can discharge heat generated by the inter... | 04/06/2004 |
| 6714413 | Compact thermosiphon with enhanced condenser for electronics cooling A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises ... | 03/30/2004 |
| 6665184 | Tapered cold plate Cold plates, permanently plumbed into card cage, cool circuit boards that are equipped with personality plates to improve thermal transfer. The personality plates have a contoured surface that is the complement of the circuit board's landscape. The person... | 12/16/2003 |
| 6665185 | Apparatus and method for embedded fluid cooling in printed circuit boards A circuit board cooler employs a closed fluid delivery system to transfer heat from electronic components to a cooling fluid. One or more channels embedded within the circuit board carry cooling fluid to the components where the fluid absorbs heat from th... | 12/16/2003 |
| 6661658 | Fluid-cooled heat sink for electronic components A fluid-cooled heat sink for electronic components includes a first metal plate designed to be positioned in contact with at least one electronic component and a second plate having a first face and a second face. The first face of the second plate is joi... | 12/09/2003 |
| 6648064 | Active heat sink An active heat sink uses a liquid coolant to transfer heat from a hot zone to a cool zone. The liquid coolant is propelled using a motor comprised of a plurality of external coils that are in magnetic communication with a plurality of magnets attached to ... | 11/18/2003 |
| 6650542 | Piezoelectric actuated jet impingement cooling Embodiments in accordance with the present invention provides active thermal management of the heat generated at localized hot spots on the microelectronic die by using fluid impingement cooling. The combination of orifices constructed using piezoelectric... | 11/18/2003 |
| 6646879 | Spray evaporative cooling system and method A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase f... | 11/11/2003 |
| 6639798 | Automotive electronics heat exchanger An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. Th... | 10/28/2003 |
| 6639797 | Computer having cooling device In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is tr... | 10/28/2003 |
| 6631077 | Heat spreader with oscillating flow A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The o... | 10/07/2003 |
| 6621707 | Liquid-cooled electronic apparatus An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A conne... | 09/16/2003 |
| 6611425 | Electronic apparatus An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a heat-generating element, a heat-dissipating pipe is thermally connect... | 08/26/2003 |
| 6603662 | Computer cooling system A computer cooling system including a cooling fluid source, and a cooling duct array adapted to distribute cooling fluid from the cooling fluid source over a plurality of high dissipation components on a circuit board.... | 08/05/2003 |
| 6591898 | Integrated heat sink system for a closed electronics container An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for therm... | 07/15/2003 |
| 6587343 | Water-cooled system and method for cooling electronic components A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic ci... | 07/01/2003 |
| 6580609 | Method and apparatus for cooling electronic components A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase f... | 06/17/2003 |
| 6549407 | Heat exchanger retention mechanism A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached t... | 04/15/2003 |
| 6542365 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of the... | 04/01/2003 |
| 6529376 | System processor heat dissipation A system for heat dissipation in data processing applications is disclosed, including a heat transfer unit matably engaged with a data processing unit and adapted to transfer heat from the data processing unit to a fluid, a fluidic transport system couple... | 03/04/2003 |
| 6525527 | Cooling system for a module IC handler A cooling system for a module IC handler is provided. The cooling system includes an air jet for cooling heat generated from the module IC where the IC is tested. The cooling system includes a base plate, an air jet body mounted on the base plate and havi... | 02/25/2003 |
| 6519149 | Radiator mechanism and electronic apparatus It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic... | 02/11/2003 |
| 6510053 | Circuit board cooling system A circuit board cooling system includes a thermally conductive element sandwiched between two circuit boards. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached circuit cards. The thermally conductive el... | 01/21/2003 |
| 6507492 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 01/14/2003 |
| 6504721 | Thermal cooling apparatus A method and apparatus for cooling a heat source in an electronic device is provided. The apparatus includes a vapor chamber with a heat source at a first end. A heat sink can be provided at a second end of the vapor chamber. The vapor chamber absorbs the... | 01/07/2003 |
| 6504720 | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module A cooling unit has a vessel that is filled with a refrigerant. The vessel includes a heat receiving portion for receiving heat from a heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a ... | 01/07/2003 |
| 6504719 | Computer system that can be operated without a cooling fan A computer system is provided having a heat exchanger that is relatively large. Although the heat exchanger is large, it is still sufficiently light because of its plastic material. Because of the large size of the heat exchanger, a relatively large surfa... | 01/07/2003 |
| 6501658 | Heatsink mounting with shock absorbers Shock absorbers or other dampening mechanisms are added to an assembly including a heatsink, a semiconductor device, and a board, to reduce shock and/or vibration induced relative motion between the heatsink and the board.... | 12/31/2002 |
| 6501654 | Microfluidic devices for heat transfer In accordance with the present invention there is provided a microfluidic heat exchange system for cooling heat-generating components of electronic equipment, computers, lasers, analytical instruments, medical equipment and the like. Both direct contact a... | 12/31/2002 |
| 6462949 | Electronic enclosure cooling system A cooling apparatus using "low profile extrusions" is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in ap... | 10/08/2002 |
| 6442023 | Electronic power device An electronic power device comprising support plates each having one face receiving one or more power components and an opposite face in contact with a cooling fluid for cooling said power components by conduction, wherein at least one support plate is as... | 08/27/2002 |
| 6437981 | Thermally enhanced microcircuit package and method of forming same A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and form... | 08/20/2002 |
