Did You Know...
...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!
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| Number | Title | Issue Date |
| 7068508 | Docking station cooling system including liquid-filled hollow structure A docking station includes a housing receiving a portable computer. A liquid-filled hollow structure is provided on a portion of the housing. The liquid-filled hollow structure is in thermally conductive relation to the portable computer when the portable computer i... | 06/27/2006 |
| 7064953 | Electronic package with direct cooling of active electronic components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic compone... | 06/20/2006 |
| 7055341 | High efficiency cooling system and heat absorbing unit The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minu... | 06/06/2006 |
| 7050299 | Electronic equipment An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is t... | 05/23/2006 |
| 7044195 | Heat dissipation structure A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one pene... | 05/16/2006 |
| 7038329 | Quality power from induction generator feeding variable speed motors A prime mover (28) in a heat recovery system drives an induction generator (8) which feeds power to a utility grid (9) through a breaker (10) but also powers a load including auxiliary induction motors (11, 12). To provide acceptab... | 05/02/2006 |
| 7031156 | Reduced package volume convectively cooled sealed electrical system and method A sealed modular control and monitoring system is provided which affords location of electrical control and monitoring components adjacent to an application. The system comprises modular components which are mounted on a shared thermal base. The base is sealed to th... | 04/18/2006 |
| 7027302 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 04/11/2006 |
| 7024573 | Method and apparatus for cooling heat generating components A device and a system for cooling heat generating electronics is disclosed. In one embodiment, the invention is a system for cooling at least one computer component. The system has a plurality of cold plates which are adapted to transfer heat from a plurality of com... | 04/04/2006 |
| 7023699 | Liquid cooled metal thermal stack for high-power dies The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic... | 04/04/2006 |
| 7016195 | Cooling fluid pump and electric apparatus, such as personal computer, provided with the pump A cooling fluid pump in which a cooling fluid is caused to flow to cool a heating element includes a casing brought into a direct contact or an indirect contact via a heat transfer member with the heating element, a pump chamber defined in the casing, an impeller ro... | 03/21/2006 |
| 7016192 | Electrical power converter method and system employing multiple-output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 03/21/2006 |
| 7011143 | Method and apparatus for cooling electronic components A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with ... | 03/14/2006 |
| 7002247 | Thermal interposer for thermal management of semiconductor devices A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal inte... | 02/21/2006 |
| 6997241 | Phase-change heat reservoir device for transient thermal management A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to trans... | 02/14/2006 |
| 6992892 | Method and apparatus for efficient temperature control using a contact volume A substrate holder for supporting a substrate, including an exterior supporting surface, a cooling component, a heating component positioned adjacent to the supporting surface and between the supporting surface and the cooling component, and a contact volume positio... | 01/31/2006 |
| 6979772 | Integrated heat dissipating enclosure for electronic product An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cool... | 12/27/2005 |
| 6973801 | Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second coo... | 12/13/2005 |
| 6972950 | Method and apparatus for cooling a portable computer A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section dire... | 12/06/2005 |
| 6972957 | Modular power converter having fluid cooled support A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 12/06/2005 |
| 6955212 | Water-cooler radiator module A water-cool radiator module comes with a supporting part having a shell body; the shell body includes a fan and a water tank; the water tank is connected to a cold water pipe and a hot water pipe; an extended section of the cold water pipe and hot water pipe is con... | 10/18/2005 |
| 6955063 | Cooling of electronics and high density power dissipation systems by fine-mist flooding A cooling method and apparatus including a mist-generating device is configured to generate a mist of droplets from water, dielectric liquids or any cooling liquids. The mist is produced having such volume, momentum, concentration and quality of scale so as to deter... | 10/18/2005 |
| 6951446 | Fan cover heat dissipation assembly for a host computer CPU A fan cover assembly installed within a computer case of a host computer, thereby providing a heat dissipating effect of for a CPU (central processing unit). Configured for usage in a slim IU industrial server computer case, whereby the fan cover assembly is structu... | 10/04/2005 |
| 6937469 | Insert module with permeable separation unit adapted for cooling requirement An insert module includes a housing having a component area for bearing one or more components, and a channel area communicating with at least one of an entrance and an exit of a cooling medium flow. The insert module provides at least a part of a flow path of the c... | 08/30/2005 |
| 6937474 | Chipset cooling device of video graphic adapter card A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device of a VGA card, two heatsinks a... | 08/30/2005 |
| 6937471 | Method and apparatus for removing heat from a circuit An apparatus includes a circuit having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part which... | 08/30/2005 |
| 6934154 | Micro-channel heat exchangers and spreaders Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC ... | 08/23/2005 |
| 6924978 | Method and system for computer system ventilation Embodiments of the present invention provides an electronic component cooling system and method that diverts a portion of a cooling fan's cooling air from high power electronic components such as processors and directs the cooling air to other electronic components ... | 08/02/2005 |
| 6920045 | Heat-dissipating assembly A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being dispos... | 07/19/2005 |
| 6918431 | Cooling assembly A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the ... | 07/19/2005 |
| 6915653 | Semiconductor cooling device A semiconductor cooling device includes a cold plate for cooling a semiconductor element, a condenser, and an inverter-controlled refrigerant pump, all of which are fluid connected in series with each other to define a refrigerating cycle. The semiconductor cooling ... | 07/12/2005 |
| 6913075 | Dendritic fiber material A thermal interface includes nanofibrils. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of larger diameter fibers. The nanofibrils have a diameter of less than about 1 micron, and may advantageously be formed from... | 07/05/2005 |
| 6909606 | Electronic device cooling system and method of use An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is th... | 06/21/2005 |
| 6903932 | Covering element for subassemblies A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be ... | 06/07/2005 |
| 6903929 | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. I... | 06/07/2005 |
| 6903931 | Cold plate assembly An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body... | 06/07/2005 |
| 6898072 | Cooled electrical terminal assembly and device incorporating same A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid ... | 05/24/2005 |
| 6888720 | Distributed graphitic foam heat exchanger system A system for cooling at least two electronic components comprises a plurality of graphitic foam products which are each thermally coupled to a corresponding component, a plurality of housings which are each mounted over a corresponding foam product and which each co... | 05/03/2005 |
| 6885556 | Electronic apparatus An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid drive... | 04/26/2005 |
| 6873526 | Quiet “fan” A system and method for cooling by orchestrated movement of pistons to displace gases or fluids. The present invention uses a plurality of pistons which move in arranged patterns that force air through a channel in a single direction. The movement of air displaces h... | 03/29/2005 |
