Did You Know...
...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7227273 | High frequency bus method Certain exemplary embodiments can include a system comprising an electric drive system for a machine. The system can include a rectifier adapted to convert AC power from an alternator to DC power. The system can include an inverter adapted to receive DC power from t... | 06/05/2007 |
| 7219714 | Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components A field-replaceable active pumped liquid heat sink module includes a front portion and a back portion, each including a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through ... | 05/22/2007 |
| 7215546 | Pump, electronic apparatus, and cooling system The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The cooling pump according to the invention includes: a rotor having a disk-sh... | 05/08/2007 |
| 7210832 | Illumination apparatus of light emitting diodes and method of heat dissipation thereof An illumination apparatus of light emitting diodes and method of heat dissipation thereof are provided. The present illumination apparatus is associated with a loop heat pipe (LHP) device. The LHP device includes a condenser communicating with an evaporator. The ill... | 05/01/2007 |
| 7200007 | Power stack A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are... | 04/03/2007 |
| 7193850 | Integrated heat removal and vibration damping for avionic equipment An electronic equipment rack system supports a printed wire board (PWB) assembly having a structural stiffener with a heat pipe mounted therein. The heat pipe is mounted within the structural stiffener directly adjacent the printed wire board to conduct thermal ener... | 03/20/2007 |
| 7193854 | Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the pr... | 03/20/2007 |
| 7190581 | Low thermal resistance power module assembly A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface... | 03/13/2007 |
| 7185696 | Cooling element for heat dissipation in electronic components A cooling element for heat dissipation in one or more electronic components includes a metal element with one or more slit-shaped receiving openings for one or more electronic components that are to be cooled. In its lengthwise extension, each receiving opening has ... | 03/06/2007 |
| 7180747 | Heat dissipation device for a computer mother board A heat dissipation device for a computer mother board includes a computer enclosure, a heat sink and a mother board. The computer enclosure includes a frame, front and rear panels, two side panels and top and bottom panels respectively connecting to the frame. One s... | 02/20/2007 |
| 7177151 | Cooling devices and systems Methods, systems, and devices are provided for cooling a heat source. One apparatus embodiment includes a housing, a fluid conduit, a pump within the housing and in communication with the fluid conduit for conveying fluid through the fluid conduit, and a turbine in ... | 02/13/2007 |
| 7173821 | Computer rack with power distribution system The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power ... | 02/06/2007 |
| 7159413 | Modular refrigeration system A modular refrigeration system includes a refrigeration device having a space configured for storage of products therein, a cooling system providing a coolant configured to cool the space, and at least one modular cooling element configured for placement at any one ... | 01/09/2007 |
| 7161804 | Housing structure of electronic device and heat radiation method therefor A sealed housing is provided with a body, a cover, and a movable fin for radiating heat while suppressing a change in internal pressure, and preventing invasion of water vapor or poisonous gas from the exterior to thereby avoid an accident caused by dew condensation... | 01/09/2007 |
| 7150109 | Dry-wet thermal management system A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the cha... | 12/19/2006 |
| 7151667 | Modular, scalable thermal solution One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first int... | 12/19/2006 |
| 7149084 | Redundant liquid cooling system and electronic apparatus having the same therein In an electronic apparatus, including personal computers, being called by a desktop type and a notebook type, as well as a server, etc., comprising a redundant cooling system, mounting a CPU 200 necessitating cooling in a housing 100, wherein a liquid ... | 12/12/2006 |
| 7147045 | Toroidal low-profile extrusion cooling system and method thereof A toroidally shaped LPE with a plurality of microtubes extending through the LPE is disclosed. The LPEs are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the microtubes of the LPEs and removes the heat from the ... | 12/12/2006 |
| 7149086 | Systems to cool multiple electrical components According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a first electrical component coupled to transmit heat to the first cont... | 12/12/2006 |
| 7144624 | Dendritic fiber material A thermal interface includes nanofibrils. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of larger diameter fibers. The nanofibrils have a diameter of less than about 1 micron, and may advantageously be formed from... | 12/05/2006 |
| 7143412 | Method and apparatus for optimizing performance in a multi-processing system A technique for improving performance in a multi-processor system by reducing access latency by correlating processor, node and memory allocation. Specifically, a Process/Thread Scheduler is modified such that system mapping and node proximity tables may be referenc... | 11/28/2006 |
| 7134288 | System, method, and apparatus for providing a thermal bypass in electronic equipment A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some ... | 11/14/2006 |
| 7131487 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat a... | 11/07/2006 |
| 7132161 | Fiber adhesive material A fiber velvet comprising nano-size fibers or nanofibrils attached to micro-size fibers is disclosed. Methods of manufacturing the velvet as well as various uses of the velvet are also described. For example, the fiber velvet can be used as a thermal interface or as... | 11/07/2006 |
| 7133286 | Method and apparatus for sealing a liquid cooled electronic device A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate,... | 11/07/2006 |
| 7130189 | Method and apparatus for cooling a portable computer A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section dire... | 10/31/2006 |
| 7129901 | Electromagnetic gravity drive for rolling axle array system An azimuth drive for a radar array comprises an electromagnetic track mounted to a wheel on which the radar array is mounted; and a magnetized carriage assembly operatively coupled to the electromagnetic track and capable of moving along the track in a tangential di... | 10/31/2006 |
| 7126822 | Electronic packages, assemblies, and systems with fluid cooling To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to a heat spreader. The heat spreader ha... | 10/24/2006 |
| 7120020 | Electronic assemblies with high capacity bent fin heat sinks An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan a... | 10/10/2006 |
| 7114550 | Cooling device for heat-generating elements A cooling device for cooling heat generating elements in which a cooling effect is produced by collision of a coolant with the back face side of heat-generating elements (1). The coolant (10) is introduced into a coolant introduction chamber (3)... | 10/03/2006 |
| 7113401 | System for airflow management in electronic enclosures A system for airflow management in an electronic enclosure includes a backplane assembly having at least one backplane connector, at least one daughter card, and components disposed on the daughter card oriented to facilitate front-to-back airflow, wherein inlet coo... | 09/26/2006 |
| 7111674 | Heat dissipating housing with interlocking chamfers and ESD resistance A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one ... | 09/26/2006 |
| 7095612 | Cooled electrical terminal assembly and device incorporating same A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid ... | 08/22/2006 |
| 7086458 | Heat sink structure with flexible heat dissipation pad A heat sink module includes a heat dissipation pad. The heat dissipation pad is flexible and has a cambered shape, and is pressed to become a flat plate when disposed between the heat sink module and a CPU. The heat dissipation pad restores to its original cumbered ... | 08/08/2006 |
| 7088583 | System for airflow management in electronic enclosures A dual-blower assembly includes a single blower housing, the single blower housing defined by a base and opposite top, a pair of opposing side walls and a pair of opposing end walls intermediate the base and the top; a pair of inlet openings in the top; a front blow... | 08/08/2006 |
| 7086247 | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a s... | 08/08/2006 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integra... | 08/01/2006 |
| 7078803 | Integrated circuit heat dissipation system An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attac... | 07/18/2006 |
| 7079394 | Compact cooling device A cooling device for a chip in a portable computer that uses a horizontal flat fan in the corner of a portable computer housing with air outlets through heatsinks that enhance exhaust air flow over heat pipes from the chip and out through the computer housing. The e... | 07/18/2006 |
| 7072180 | Gas collecting device, test head and IC device testing apparatus A heating element cooling cover 5 for covering IC devices 44 mounted on a substrate 4, wherein a coolant is circulated to be able to contact the IC devices 44, and a groove 54 (bypath) is provided for an air and the coolant to flow... | 07/04/2006 |
