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| Number | Title | Issue Date |
| 7333331 | Power unit device and power converter device A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its manufacturing aspect is excellent. The power unit device has a heat sink having... | 02/19/2008 |
| 7333332 | Heatsink thermal module with noise improvement The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multipl... | 02/19/2008 |
| 7331185 | Heat radiator having a thermo-electric cooler A heat radiator having a thermo-electric cooler uses a plurality of heat radiation modules to induce forced thermal conduction at respective hot spots. The heat radiator comprises a first heat radiation module with a radiator fin set in which the fins are connected ... | 02/19/2008 |
| 7327574 | Heatsink module for electronic device A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The re... | 02/05/2008 |
| 7324336 | Flow through cooling assemblies for conduction-cooled circuit modules A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable ... | 01/29/2008 |
| 7320593 | Light emitting diode light source for curing dental composites Light Emitting Diode Light Sources for Dental Curing are disclosed. Some embodiments of the invention include structures such as Light Emitting Diode Array(s), heat sink, heat dissipation, heat pipe, and control circuitry are disclosed. ... | 01/22/2008 |
| 7321494 | Graphics card apparatus with improved heat dissipating mechanisms A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewith... | 01/22/2008 |
| 7316265 | Method for passive phase change thermal management In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity. ... | 01/08/2008 |
| 7312986 | Cooling device for an electronic apparatus A cooling device comprises a circulation passage through which a liquid coolant flows, and a pump provided in the circulation passage configured to circulate the liquid coolant along the circulation passage. The pump includes, (1) a pump casing including a pump cham... | 12/25/2007 |
| 7312995 | Cooling system for computer electronics A cooling system is provided for supplying a coolant flow to a cold plate associated with a processing chip of an electronic device to cool the processing chip. The system includes an electric motor driven fan; a radiator; an accumulator tank connected to the radiat... | 12/25/2007 |
| 7304846 | Heatsink device of video graphics array and chipset Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more hea... | 12/04/2007 |
| 7299860 | Integral fastener heat pipe Invention disclosures novel design of structural components and fasteners that in addition to sound mechanical strength reveal excellent thermal characteristics, which allows using them as super efficient heat sinking/management solutions. ... | 11/27/2007 |
| 7301763 | Electronic device An electronic device includes a chamber having a chamber wall surface defining a liquid-tight sealed space; an electronic unit housed in a liquid-tight case, the case being disposed in the chamber to define an intermediate space between the case and the chamber wall... | 11/27/2007 |
| 7298619 | Cable management arm with integrated heat exchanger In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at least two arm members, at least one flexible coupling configured to ... | 11/20/2007 |
| 7295437 | Heat dissipation device for multiple heat-generating components A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (... | 11/13/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7294926 | Chip cooling system A chip cooling system including a semiconductor device having a bulk region, wherein at least one fluid channel extends at least partially through the bulk region, the fluid channel having an inlet and an outlet, a fluid inlet port in fluid communication with the ch... | 11/13/2007 |
| 7292438 | Liquid-cooling heat dissipation module A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a pump, a heat sink, and a guide member. The pump is attached to the fan an... | 11/06/2007 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7283364 | Thermal management apparatus The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrus... | 10/16/2007 |
| 7278467 | Liquid-cooled heat radiator kit A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, ea... | 10/09/2007 |
| 7280358 | Liquid loop with multiple heat exchangers for efficient space utilization A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability. ... | 10/09/2007 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump. ... | 09/25/2007 |
| 7273088 | One or more heat exchanger components in major part operably locatable outside computer chassis One or more heat exchanger components of an apparatus are in major part operably locatable outside a computer chassis and serve to reduce one or more temperatures of one or more heat producing components supported with the computer chassis. ... | 09/25/2007 |
| 7274566 | Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within ... | 09/25/2007 |
| 7272000 | Heat dissipating structure of interface card A heat dissipating structure of an interface card is applied in an electronic device. The structure includes a heat dissipating apparatus attached to a circuit board of the electronic device, wherein the heat dissipating apparatus comprises a heat sink and a fan rec... | 09/18/2007 |
| 7272002 | Auxiliary cooling methods and systems for electrical device housings Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situ... | 09/18/2007 |
| 7265974 | Multi-heatsink integrated cooling device A multi-heatsink integrated cooling device comprises a crossflow cooler and a primary heatsink thermally connected by heat-spreading means. The crossflow cooler comprises a casing with an inlet and an outlet, and a radial impeller and heat-exchanging means located i... | 09/04/2007 |
| 7265977 | Active liquid metal thermal spreader The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is dis... | 09/04/2007 |
| 7265975 | CPU heat dissipating device structure A heat dissipating device includes a heat dissipating block, a liquid contained in the heat dissipating block, a first conduit joined to one end of the heat dissipating block, a second conduit joined to the other end of the heat dissipating block, a guiding tube, he... | 09/04/2007 |
| 7262965 | Thermal structure for electric devices A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin m... | 08/28/2007 |
| 7258161 | Cooling system for densely packed electronic components A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board ... | 08/21/2007 |
| 7256998 | Heat-dissipating structure with air-guiding device A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipati... | 08/14/2007 |
| 7252139 | Method and system for cooling electronic components A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled... | 08/07/2007 |
| 7254023 | Heat dissipation assembly A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower holder is secured to the first heat sink with the inlet of the blowe... | 08/07/2007 |
| 7254024 | Cooling apparatus and method A Micro Blade is described for implementing an electronic assembly having a thin profile; it is a miniaturized stand-alone unit that is mechanically and thermally rugged, and connects to external components using a cable. The electronic assembly is preferably fabric... | 08/07/2007 |
| 7251137 | Electronic component cooling apparatus An electronic component, cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for givin... | 07/31/2007 |
| 7235889 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat sprea... | 06/26/2007 |
| 7233494 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. ... | 06/19/2007 |
| 7230832 | Cooled electronic assembly and method for cooling a printed circuit board A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected ... | 06/12/2007 |
