Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 7436660 | Heat sinks for electronic enclosures An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the electronics enclosure, or alternately they may be operatively connected to th... | 10/14/2008 |
| 7403391 | Rack height cooling A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front f... | 07/22/2008 |
| 7390976 | Providing airflow to an electronics enclosure while providing protection and shielding against electromagnetic interference Methods and apparatus for shielding an object from relative high electromagnetic radio frequencies while allowing airflow to pass to and from the object are disclosed. According to one aspect of the present invention, a shield arrangement that shields a chassis incl... | 06/24/2008 |
| 7367385 | Optimized fins for convective heat transfer The invention includes a heat transfer geometry having first and second flow channels in parallel with each other. The flow cross-sectional area of individual channels varies along the length of the flowpath, with one channel undergoing an expansion and the other un... | 05/06/2008 |
| 7365976 | Electronic apparatus A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel wit... | 04/29/2008 |
| 7365977 | Electronic apparatus Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section,... | 04/29/2008 |
| 7359193 | Electronic equipment Electronic equipment includes a chassis that compose a case, a first printed circuit board, an MPU and a memory both of which are mounted in the case and consume high power, and a cooling fan for taking in air from the outside into the inside of the case. The coolin... | 04/15/2008 |
| 7269006 | Storage device, and storage part and dummy unit for storage device The present invention provides a dummy canister which can cool canisters with good efficiency. Canisters 2A and dummy canisters 2B are attached in a mixed configuration to the storage part 1C of a storage device 1. Each dummy canister ... | 09/11/2007 |
| 7269009 | Case for covering electronic parts and display apparatus including the same A case for covering electronic parts and efficiently discharging heat generated from the electronic parts and a display apparatus including the case are provided. The case includes at least one partition wall partially separating at least an inner space of the case.... | 09/11/2007 |
| 7259963 | Rack height cooling A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front f... | 08/21/2007 |
| 7233493 | Electronic device having a temperature control system including a ductwork assembly A ductwork assembly can be used with an electronic device wherein the electronic device includes a fan and the ductwork assembly is configured to receive a heat transfer fluid from the fan. A disperser lies within the ductwork assembly and is attached thereto in ord... | 06/19/2007 |
| 7211728 | Optical cage system preventing insertion of incorrect module The present invention relates to an opto-electronic system including an opto-electronic module and a cage assembly for electrically connecting and securing the electronic module to a host computer device. Corresponding mechanical features are provided on the module ... | 05/01/2007 |
| 7199310 | Electromagnetic interference shielding structures for computer hard-drive enclosures The present invention provides a configuration of a hard drive enclosure system and method for manufacture in which a polymer including electromagnetic interference shielding (EMI shielding) properties is configured such that shielding gaskets may be reduced or elim... | 04/03/2007 |
| 7184267 | Longitudinally cooled electronic assembly An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension, each tier supporting two lateral stacks of printed circuit board cards. Each tier has an associated distribution plenum contiguous to a top longitudinal end of the tier and an as... | 02/27/2007 |
| 7180738 | Communication cabinet and a method for dust removal of communications cabinet filters A communication cabinet, that includes: at least one fan, adapted to rotate at a first direction during a first period and to rotate at a second opposing direction during a second period; a controller, adapted to control the at least one fan; and at least one filter... | 02/20/2007 |
| 7173821 | Computer rack with power distribution system The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power ... | 02/06/2007 |
| 7170747 | Plug-in rack A mounting rack for aircraft has one or more rows, which are located one above the other, each having one or more compartments which are located alongside one another, for holding electronics units, with a compartment being designed for independent insertion and wit... | 01/30/2007 |
| 7158379 | Device for removing heat from a power connector A heat removal device includes a shroud on a top side of a printed circuit board that contains a power connector. An air intake vent is located underneath the printed circuit board and directs air up through printed circuit board vias into the shroud. Openings are l... | 01/02/2007 |
| 7079387 | Computer cooling system and method A computer system includes an enclosure, a backplane within the enclosure, a replaceable unit releasably connected to the backplane, an air cooling system configured to create an air flow along the replaceable unit and an air flow blocking system. The air flow block... | 07/18/2006 |
| 7064953 | Electronic package with direct cooling of active electronic components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic compone... | 06/20/2006 |
| 7061758 | Heat-dissipating fan device A fan impeller of a heat-dissipating fan device is mounted in a receiving space of a fan housing, and includes coupling ribs that extend radially and outwardly from an outer surrounding surface of a hub cap and that are spaced apart angularly from each other, a smal... | 06/13/2006 |
| 7009839 | Adjustable power supply housing with compensating air baffle An assembly for housing a power supply unit within a data processing system includes a carrier bracket for attaching to the power supply unit, a housing tray to engage the bracket moveably and define a size adjustable space for receiving the power supply unit, and a... | 03/07/2006 |
| 6977346 | Vented circuit board for cooling power components The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedesta... | 12/20/2005 |
| 6968958 | Stackable and detachably coupled electronic device modules An apparatus comprises a first electronic device module that comprises a structural stackable rack component that is attached to and supports an electronic device. A second electronic device module that comprises a stackable rack component that is attached to and su... | 11/29/2005 |
| 6912131 | Electronic components card air deflector Cooling means are provided for directing cooling air over a desired portion of an electronic components card. A deflector attachable to the electronic components card for directing cooling air over the card is provided. The deflector is adapted to be moved with resp... | 06/28/2005 |
| 6817405 | Apparatus having forced fluid cooling and pin-fin heat sink A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing ... | 11/16/2004 |
| 6801429 | Package structure compatible with cooling system The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electri... | 10/05/2004 |
| 6735079 | Heat dissipation apparatus The present invention is related to a venting apparatus for a computer. The apparatus includes a chassis plate and a venting plate. The chassis plate has a first hole and a second hole. The venting plate has a plurality of venting apertures. The venting plate is sel... | 05/11/2004 |
| 6577502 | Mobile computer having a housing with openings for cooling A mobile computer comprising a lower panel, a top panel, side panels, an electrical computer component, a plurality of keyboard keys, and a computer screen. The lower panel can be located over a horizontal surface. The top panel is vertically spaced from ... | 06/10/2003 |
| 6495913 | Semiconductor clamped-stack assembly A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extendi... | 12/17/2002 |
| 6441312 | Electronic package with plurality of solder-applied areas providing heat transfer An electronic package in which an electronic component (e.g., LSI chip module) includes a heat dissipating surface (e.g., metal layer) and is positioned on a printed wiring board such that the heat dissipating surface is located adjacent a heat transfer a... | 08/27/2002 |
| 6426459 | EMI shielding vent panel for high volume applications An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive media having an outer periphery supported within an electrically-conductive f... | 07/30/2002 |
| 6362417 | EMI shielded vent panel and method An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive ... | 03/26/2002 |
| 6356435 | CPU fan assembly An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer ("PC") system and exhausts it from the PC prior to adversely affecting other... | 03/12/2002 |
| 6313988 | Server with reduced space requirement A computer for a server or work station which has two air cooling streams one stream leads from outside the chassis across the motherboard and through a vented power supply then directly into the environment and is driven by a fan inside the power supply.... | 11/06/2001 |
| 6301107 | Heat dissipation structure for electronic apparatus component A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in th... | 10/09/2001 |
| 6297446 | High performance EMC vent panel The inventive EM panel comprises multiple layers of perforated metal sheets that are electrically connected with each other. Since multiple sheets are used, the holes can be larger than in a single sheet shield, as attenuation improvements from increased ... | 10/02/2001 |
| 6282089 | Portable computer cooling method and computer holder A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the at... | 08/28/2001 |
| 6233146 | Rotatable portable computer remote heat exchanger with heat pipe A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end per... | 05/15/2001 |
| 6198627 | Noise reduction back cover for computer devices A back cover assembly is provided for use in a device including a housing having a plurality of walls forming an enclosure. A blower mechanism is adapted to cause exhaust air to flow from an interior of the housing to an exterior of the housing. The back ... | 03/06/2001 |
