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| Number | Title | Issue Date |
| 7233491 | Frame-level thermal interface component for transfer of heat from an electronic component of a computer system A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from ... | 06/19/2007 |
| 7233493 | Electronic device having a temperature control system including a ductwork assembly A ductwork assembly can be used with an electronic device wherein the electronic device includes a fan and the ductwork assembly is configured to receive a heat transfer fluid from the fan. A disperser lies within the ductwork assembly and is attached thereto in ord... | 06/19/2007 |
| 7230827 | Method and apparatus for venting a chassis A chassis venting apparatus includes a chassis defining a chassis enclosure, the chassis enclosure including a first wall, and a chassis vent structure extending from the first wall and into the chassis enclosure, the chassis vent structure defining a chassis ventin... | 06/12/2007 |
| 7226353 | Cabinet for computer devices with air distribution device A cabinet for housing computer devices with an internal air distribution system is disclosed. The cabinet includes an internal chamber defined by a side wall arrangement having at least a front wall. The cabinet includes a support structure for computer devices, whe... | 06/05/2007 |
| 7227751 | Ventilated housing for electronic components A structure for vertically housing an electronic component is disclosed as including a bottom support member and a top support member. The top support member is substantially parallel to the bottom support member. An open space is formed between the top support memb... | 06/05/2007 |
| 7227756 | Power supply keying arrangement for use with an electrical apparatus A power supply keying method for use with an electrical apparatus includes defining a plurality of power supply classes; associating with the plurality of power supply classes a plurality of power supplies, each of the plurality of power supplies including a power s... | 06/05/2007 |
| 7224583 | Shielding box without any dedicated cooling duct A shielding box includes a first wiring board and a second wiring board maintaining a distance relative to the first wiring board and facing thereto. A ventilating hole is formed in the second wiring board and having side surfaces facing each other. A pair of flat c... | 05/29/2007 |
| 7224947 | Telecommunications chassis, module, and bridging repeater circuitry A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it... | 05/29/2007 |
| 7222660 | Cabinet with an environmentally-sealed air-to-air heat exchanger A cabinet which utilizes an air-to-air heat exchanger to remove heat generated from within the cabinet prevents water and dust from entering the air-to-air heat exchanger by forcing cooler external air up along a first side wall, through the air-to-air heat exchange... | 05/29/2007 |
| 7219721 | Heat sink having high efficiency cooling capacity and semiconductor device comprising it A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of th... | 05/22/2007 |
| 7221868 | Camera and photographing lens barrel In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the... | 05/22/2007 |
| 7218516 | Inlet airflow guiding structure for computers An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflo... | 05/15/2007 |
| 7219361 | Tray of optical disk player A tray of an optical disk player including a disk mounting portion on which an optical disk is stably mounted; a front wall formed on the front to surround the disk mounting portion; a rear wall formed on the rear of the tray to surround the disk mounting portion, t... | 05/15/2007 |
| 7215547 | Integrated cooling system for electronic devices The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The ... | 05/08/2007 |
| 7215541 | Multi-stage low noise integrated object and system cooling solution A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a syst... | 05/08/2007 |
| 7215548 | Heat dissipating device having a fin also functioning as a fan duct A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14... | 05/08/2007 |
| 7212407 | Electrical power converter method and system employing multiple output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 05/01/2007 |
| 7209354 | Ball grid array package with heat sink device The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink assembly. The first heat sink assembly has a first heat dissipating s... | 04/24/2007 |
| 7209351 | Telecom equipment chassis using modular air cooling system This application discloses an apparatus comprising a chassis comprising a box having a perforated top, a perforated bottom and four sidewalls, wherein at least two on the sidewalls have air vents therein near the bottom, a modular fan assembly removably coupled to t... | 04/24/2007 |
| 7209348 | Heat dissipating structure for an electronic device and heat dissipating device A heat dissipating member has an inner wall, outer wall, and partition walls. The inner wall directly or indirectly receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the o... | 04/24/2007 |
| 7206202 | Electronic apparatus with heat-dissipating structure An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation ... | 04/17/2007 |
| 7203063 | Small form factor liquid loop cooling system An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the comp... | 04/10/2007 |
| 7201651 | Louver heat vent for chassis of computer A louver heat vent for a chassis of a computer, which is mounted in an opening of the chassis, has two shafts and multiple slats. The shafts each have a channel, into which fasteners of the slats can be inserted. The slats are stacked to conceal and shield the inter... | 04/10/2007 |
| 7196907 | Elasto-plastic sockets for Land or Ball Grid Array packages and subsystem assembly An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package toler... | 03/27/2007 |
| 7193846 | CPU fan assembly An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other compon... | 03/20/2007 |
| 7193847 | Blade server system A blade server system is described. The blade server system includes a main chassis, a rear module chassis and a mid-plane. The main chassis is formed with slots into which a plurality of sever blades are slidablely inserted from the front end of the main chassis. T... | 03/20/2007 |
| 7193848 | Portable industrial computer A portable industrial computer includes a host having an aperture located on a bottom side leading to the interior of the host and a movable heat dissipation panel pivotally coupled on the aperture in a movable manner to open or close the aperture. The movable heat ... | 03/20/2007 |
| 7190579 | Data processing system with air purifying device An air purifying data processing system includes a chassis, a planar, a microprocessor and an air purifier. The air purifier produces purified air that is exhausted exterior to the chassis to improve the air quality in the vicinity of the chassis. The air purifier p... | 03/13/2007 |
| 7190587 | Fanless high-efficiency cooling device using ion wind Disclosed herein is a fanless high-efficiency cooling device that is applicable to electronic products having heat sources, such as plasma display panel (PDP) televisions, liquid crystal display (LCD) televisions, and liquid crystal display (LCD) monitors. The fanle... | 03/13/2007 |
| 7190580 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated... | 03/13/2007 |
| 7187548 | Power converter having improved fluid cooling A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting... | 03/06/2007 |
| 7187544 | Power output device of a computer power supply A power output device of the present invention comprises a power supply having an input end for conducting electric current and an output device for supplying power to a computer. The output device has the following elements. A main cable and a sub-cable are connect... | 03/06/2007 |
| 7187568 | Power converter having improved terminal structure A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat fr... | 03/06/2007 |
| 7185697 | Electroosmotic microchannel cooling system Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as wel... | 03/06/2007 |
| 7184267 | Longitudinally cooled electronic assembly An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension, each tier supporting two lateral stacks of printed circuit board cards. Each tier has an associated distribution plenum contiguous to a top longitudinal end of the tier and an as... | 02/27/2007 |
| 7184273 | Electronic device with protective housing having enhanced rigidity An electronic device includes a printed circuit board, a housing in which the printed circuit board is accommodated, a cover covering an end opening of the housing, and a connector disposed on the printed circuit board which has an end exposed through an aperture of... | 02/27/2007 |
| 7180737 | Heat exchanger system for circuit card assemblies An apparatus for housing and cooling circuit card assemblies employed in communication and other systems is disclosed including a chassis having opposed end walls which are formed with a series of spaced inlet card guides and correspondingly spaced outlet card guide... | 02/20/2007 |
| 7180741 | Spray cool system with a dry access chamber A spray cool system with a dry access chamber for providing convenient access to specific spray system components in a dry chamber separate from the wet chamber. The spray cool system with a dry access chamber includes a chassis having a dry chamber and a wet chambe... | 02/20/2007 |
| 7178583 | Fan module for a heat dissipating device A heat dissipating device includes a fin unit disposed on a supporting seat, and an anchoring frame disposed on the fin unit and engaging detachably the supporting seat for anchoring the fin unit between the supporting seat and the anchoring frame. A fan module incl... | 02/20/2007 |
| 7180751 | Input/output transition board system An input/output transition board system for collecting and distributing input/output signals between a backplane board and an I/O board while allowing for additional electronic devices. The input/output transition board system includes a transition board having at l... | 02/20/2007 |
