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| Number | Title | Issue Date |
| 7336486 | Synthetic jet-based heat dissipation device A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating... | 02/26/2008 |
| 7336485 | Heat sink detection In one embodiment, a printed circuit board assembly comprises a heat sink having an electrically conductive mounting support and a printed circuit board including detection circuitry to detect an electrical connection between the electrically conductive mounting sup... | 02/26/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7334662 | Equipment enclosure acoustical door with low impedance distributed air flow An acoustic door for an equipment enclosure, such as a rack mount cabinet, also provides a low impedance air flow uniformly delivered across the cabinet opening. A pair of metal panels, with acoustic foam along the rear surfaces, extend angularly outward and toward ... | 02/26/2008 |
| 7331635 | Seat part for a vehicle seat The invention relates to a seat part for a vehicle seat, in particular a motor vehicle seat, having a seat pan (1) made of sheet metal, a seat cushion applied to the seat pan (1) and a cable assembly (17) running in the seat cushion. In o... | 02/19/2008 |
| 7333332 | Heatsink thermal module with noise improvement The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multipl... | 02/19/2008 |
| 7333341 | Heat dissipation device A heat dissipation device includes a heat sink, a retention module and a clip securing the heat sink to the retention module. The retention module includes a bottom wall and a plurality of sidewalls surrounding the bottom wall. The heat sink includes a plurality of ... | 02/19/2008 |
| 7332889 | Battery charger A battery charger. The battery charger includes a housing having an outer surface, a battery being supportable on the outer surface, a charging circuit supported by the housing and electrically connectable to a power source and the battery, and a protective structur... | 02/19/2008 |
| 7327568 | Heat sink assembly with rotatable fins A heat sink assembly having rotatable fins includes a housing, a first heat dissipating device, a rod, an elastic member and a lever. The housing includes a first sidewall having a first hole, a first sliding hole and a stop portion, and a second sidewall having a s... | 02/05/2008 |
| 7325772 | Aircraft heat sink and electronics enclosure An aircraft component including a first section adapted to be attached at an exterior surface of an aircraft to close an access opening through the exterior surface; and a second section extending outward from the first section and forming heat transfer surfaces to ... | 02/05/2008 |
| 7327571 | Thermal load balancing systems and methods Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat si... | 02/05/2008 |
| 7327576 | Heat dissipation device A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 2... | 02/05/2008 |
| 7325410 | IT equipment cooling A system for cooling gas heated by passing the gas over heat-producing equipment to cool the equipment comprises a heat exchanger including a first heat transfer mechanism configured to transfer heat from the heated gas to a first coolant, and a first condensing mod... | 02/05/2008 |
| 7324336 | Flow through cooling assemblies for conduction-cooled circuit modules A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable ... | 01/29/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7319589 | Cooling system for an electronic display A cooling system for an electronic display may include a heat collector plate with internal gas and liquid phase lines. The cooling plate may be thermally isolated together with electronic components of the display within an enclosure of the display, while external ... | 01/15/2008 |
| 7318630 | Modular laboratory cabinet A modular laboratory cabinet assembly consists of a pair of identical housing end units arranged in an inverted spaced apart relations to each other, and at least a pair of identical base housing modules arranged in an inverted side by side relations to each other a... | 01/15/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7319596 | Electronic apparatus A second duct is designed to oppose its air outlet to a portion of an air inlet of a first duct in an electronic apparatus. The wall member closes the air inlet of the first duct at a position outside the air outlet of the second duct. An opening is defined in the w... | 01/15/2008 |
| 7315448 | Air-cooled heat generating device airflow control system A system for controlling airflow around an air-cooled heat generating device includes a cooling fluid line and heat exchangers positioned along the cooling fluid line to cool airflow around components in the heat generating device. The heat exchangers are positioned... | 01/01/2008 |
| 7315447 | Electronic apparatus and hard disk drive housing apparatus A system for mounting a hard disk drive inside an electronic apparatus in such a way that the hard disk drive is isolated from vibration and noise and heat generated by the hard disk dive is radiated to a cover of the electronic apparatus to prevent overheating. A f... | 01/01/2008 |
| 7315452 | Optical disk device An optical disk device of the present invention has a main PC board carrying a semiconductor element and attached at the rear of a drawer to efficiently dissipate a heat generated from the semiconductor element. The drawer is formed of a material having good thermal... | 01/01/2008 |
| 7315450 | Heat-generating component cooling structure A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of ... | 01/01/2008 |
| 7312690 | Temperature sensor A temperature sensor includes a probe section for insertion into a hot zone. The probe section includes a thermistor, a first lengthy pin terminating at the thermistor, and a second lengthy pin also terminating at the thermistor. A housing section is on one end of t... | 12/25/2007 |
| 7310227 | Electronic apparatus According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-d... | 12/18/2007 |
| 7310228 | Air shroud for dissipating heat from an electronic component A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second op... | 12/18/2007 |
| 7310225 | Heat radiation structure for secondary battery module, and switching board and secondary battery module having the same A heat dissipation structure connected to switching elements that control charge and discharge of a secondary battery module, the heat dissipation structure includes a pair of side frames to which charge-purpose switching elements and discharge-purpose switching ele... | 12/18/2007 |
| 7307840 | Cross-flow redundant air cooling method for high reliability electronics An electronic assembly cooling system including a module case assembly that has a module case wall. The system includes a first and second air driver and an electronic assembly located in-front of the module case wall. The system conducts thermal energy from the ele... | 12/11/2007 |
| 7307839 | Air ventilation cooling systems for a portable power device A system that, in a natural convection embodiment, comprises a structure having an output cord and a stand coupled thereto for mounting a power module in a substantially vertical orientation. The stand has a base with a first vertical piece extending therefrom to a ... | 12/11/2007 |
| 7304848 | Apparatus for performance testing of heat dissipating modules An apparatus (10) for performance testing of heat dissipating modules (19) includes an enclosure (11) configured for receiving the heat dissipating module therein, a vertically movable platform (13) for supporting the enclosure thereon, a... | 12/04/2007 |
| 7304845 | Heat sink assembly A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardl... | 12/04/2007 |
| 7300485 | Cooling fan for electronic devices An apparatus includes a rigid housing having a plurality of sides removably engaged with the electronic device and a plurality of passageways for effectively channeling air through first and second directions. The apparatus further includes at least one rotary fan m... | 11/27/2007 |
| 7301764 | Electronic device with audio capability A speaker module is disposed on the top casing and includes at least one first vent. A printed circuit board is disposed between the top casing and the bottom casing and includes at least one second vent corresponding to the first vent. ... | 11/27/2007 |
| 7300203 | Non-contacting sensor multichip module with integral heat-sinks A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and ... | 11/27/2007 |
| 7301765 | Extendable and receivable heat-dissipating base set for notebooks An extendable and receivable heat-dissipating base set for notebooks, having heat-dissipating fans provided on both the bottom base and the receivable base thereof is provided. The extending and receiving characteristics of the receiving base allow heat to dissipate... | 11/27/2007 |
| 7301766 | Transmission device capable of cooling a handheld electronic device A transmission device of a handheld electronic device including a housing having an inlet and an outlet, a fan installed within the housing for generating airflow from the inlet to the outlet and a guide tube installed on the housing having a first opening and a sec... | 11/27/2007 |
| 7296430 | Cooling air flow control valve for burn-in system A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment... | 11/20/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7295434 | Electronically controlled electric fan cooled by pressurized ambient air An electronically controlled electric fan (10) cooled by pressurized ambient air, includes: a motor (11) furnished with a cover (12), a mechanical assembly rotating a wheel (15) and a casing (13),... | 11/13/2007 |
| 7291783 | Mounting components to a hardware casing Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at le... | 11/06/2007 |
