Did You Know...
...that in the early 1940s GE engineer James Wright was charged with a task of utmost importance to the war effort: develop a cheap substitute for rubber that could be used to produce tires, gas masks and a whole host of military gear. Wright tackled the task diligently -- and wound up inventing Silly Putty.
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| Number | Title | Issue Date |
| 5294831 | Circuit pack layout with improved dissipation of heat produced by high power electronic components Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels... | 03/15/1994 |
| 5291368 | Printed circuit board frame module assembly A rigid rectangular frame module (44,66,52,80) mounts a printed circuit board (40) and provides a number of edge connector nodes (46) mounted in a multi-connector node carrier (110) forming one structural element of the frame. Service cables, including po... | 03/01/1994 |
| 5287248 | Metal matrix composite heat transfer device and method A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improve thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the bo... | 02/15/1994 |
| 5285350 | Heat sink plate for multiple semi-conductors A heat sink comprising a thin plate made of a heat conducting material, which plate includes a series of small tapered chimneys extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board, thermally connecting with ... | 02/08/1994 |
| 5283716 | Electrical component support structure A component support assembly releasably retains, electrically insulates and improves thermal transfer of a plurality of vertically stacked electrical components associated with the operation of a printed circuit card. Each of a plurality of integrally-mol... | 02/01/1994 |
| 5276584 | Electronic unit Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. Th... | 01/04/1994 |
| 5276585 | Heat sink mounting apparatus A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of the device package in the pockets to secure the heat sink be... | 01/04/1994 |
| 5262922 | Heat radiation structure for semiconductor device A heat radiation structure is provided for a semiconductor device, by which a mounting height of the semiconductor device can be lowered to increase an accommodation density in a shelf, and the mounting/dismounting is easily carried out. In a heat-radiati... | 11/16/1993 |
| 5258888 | Thermal packaging for natural convection cooled electronics A natural convection cooled electronic device utilizing a box-like plastic enclosure surrounding the circuitry of the electronic device. The apparatus further includes aluminum heat sinks fastened in good thermal contact with heat dissipating components o... | 11/02/1993 |
| 5255137 | Cooling system for recording/reproducing apparatus, with airflow restricted from read/write media section An apparatus for recording informations in an information recording medium such as an optical card or the like and reproducing the recorded informations therefrom includes as essential components a housing, an instrument section arranged in the housing fo... | 10/19/1993 |
| 5251095 | Low temperature conduction module for a cryogenically-cooled processor A hermetic electronic assembly incorporating cryogenically-cooled and air-cooled elements in an integrated assembly. A hermetic cryogenically-cooled enclosure is disposed in close physical proximity to one or more air-cooled circuit cards to minimize phys... | 10/05/1993 |
| 5247425 | Semiconductor device A container type semiconductor device containing many semiconductor elements is provided. The device allows heat to be dissipated from both sides of each semiconductor element by placing metal contact plates against the emitter electrodes of each semicond... | 09/21/1993 |
| 5247426 | Semiconductor heat removal apparatus with non-uniform conductance An apparatus for removing heat from a semiconductor is disclosed. The apparatus is a non-uniform thermal conductance structure which includes high thermal conductance regions and low thermal conductance regions. The apparatus is coupled to the semiconduct... | 09/21/1993 |
| 5245527 | Modular ac drive controller An ac drive controller including a phase assembly for each phase of a polyphase supply to a motor, each phase assembly including an invertor module and a corresponding filter module. The electrical interconnections between each filter module and each inve... | 09/14/1993 |
| 5243461 | Bicycle signalling assembly A bicycle signalling assembly comprises a seat body having two cylinders constructed in such a manner that a circuit board can be fastened securely to cylinders without using a hand tool.... | 09/07/1993 |
| 5243493 | Fanless convection cooling design for personal computers An enclosure is described for housing a personal computer. The natural convection system of the present invention for dissipating heat generated by the electronic components of a personal computer consists of a housing defining a cavity containing the ele... | 09/07/1993 |
| 5241452 | Package with heat sink Disclosed is a heat-sink equipped package in which a heat sink has a plurality of flat plates arranged in a row, and both end plates have a rectangular shape, while those plates located between the end plates are each an inverted trapezoid having the bott... | 08/31/1993 |
| 5230564 | Temperature monitoring system for air-cooled electric components A monitoring system for printed circuit boards which are air-cooled utilizes temperature sensors which have thermal diodes embedded directly into the integrated circuits. The thermal diodes are part of the fully-functioning integrated circuit which utiliz... | 07/27/1993 |
| 5229914 | Cooling device that creates longitudinal vortices A cooling device that achieves longitudinal vortex formation, thereby reducing downstream wake, without significantly increased pressure. The device also conducts heat from the electronic component to be cooled, and includes at least one heat-conductive p... | 07/20/1993 |
| 5220484 | Underground transformer cabin consisting of two units, one inside the other An underground transformer cabin consisting of two prefabricated vibrated reinforced concrete units, one inside the other. A larger external unit is enclosed by a covering plate, and a smaller, internal unit is raised off a bottom of the larger external u... | 06/15/1993 |
| 5216578 | Structure for holding packages on backboard of electronics apparatus A package holding structure comprises a pair of linear guide members (11), secured on the package (2) along the respective edges thereof opposite to each other, and a pair of support members (10) for receiving the respective guide members (11), secured at... | 06/01/1993 |
| 5214570 | Compact memory module A memory module includes a mother board with an edge connector mounted adjacent one of its edges. Memory chips are mounted on the same side of the mother board as the edge connector. A daughter board, having memory chips mounted on its surface facing the ... | 05/25/1993 |
| 5214572 | One-piece electronic cage An electronic cage for housing electronic components (circuit boards and power supplies) therein, wherein the cage includes a box-like component receiving area defined by a plurality of upstanding side walls and a floor member. Part of the floor member pr... | 05/25/1993 |
| 5212625 | Semiconductor module having projecting cooling fin groups A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating cond... | 05/18/1993 |
| 5208729 | Multi-chip module A high density package for a plurality of integrated circuit chips is described, the package including a number of planar subunits. A subunit includes first and second planar metal plates and a spacer metal plate sandwiched therebetween. Each spacer metal... | 05/04/1993 |
| 5202816 | High density circuit board chassis cooling system The present invention features a system for cooling a plurality of circuit boards in a high density chassis. The system includes a circuit board enclosure assembly having a number of slots for supporting a plurality of circuit boards. A filter is disposed... | 04/13/1993 |
| 5196989 | Rigid circuit board structure using impingement cooling A circuit board construction including a circuit board with circuit modules installed on at least one face of the board, and at least one baffle plate connected rigidly to the board. The baffle plate is of approximately the same dimensions as the circuit ... | 03/23/1993 |
| 5170320 | Avionic tray and detachable metering plate An avionic tray assembly for supporting electronic instruments on a shelf and controlling the volume of cooling air between the instrument and a plenum chamber is described. The tray bottom includes a pocket formed by a straight side wall extending downwa... | 12/08/1992 |
| 5168919 | Air cooled heat exchanger for multi-chip assemblies An air-cooled self-contained evaporator and condenser apparatus with no external power source, the apparatus including a cold plate having a first surface with recesses formed therein in a matrix or array corresponding to the matrix or array of chips on a... | 12/08/1992 |
| 5166862 | Panel for mounting electronics There is provided a panel for mounting electronic components to circuit breakers. The panel includes formations for cooling electronic components, a method for sealing the electronic adjustment switches against tampering, and a method for preventing inval... | 11/24/1992 |
| 5166775 | Air manifold for cooling electronic devices An air manifold mounted adjacent to a circuit board for directing air jets onto electronic devices mounted on the circuit board. The air manifold has an air inlet and a plurality of outlet nozzles positioned along the channel for directing air onto the el... | 11/24/1992 |
| 5162974 | Heat sink assembly for cooling electronic components A heat sink system for cooling electronic components and especially integrated circuits on a printed circuit board is disclosed. A heat sink having a heat pipe and a plurality of fins spaced and positioned perpendicular to the longitudinal axis of the hea... | 11/10/1992 |
| 5159534 | Electronic/electromechanical packaging arrangement for facility management system A network control unit for monitoring and controlling all of the operational components of a facility management system, the unit including a modular base frame having a wiring board assembly mounted on the back, a number of termination board assemblies m... | 10/27/1992 |
| 5150748 | Advanced survivable radiator A heat pipe radiator coating of a fibrous material provides protection for the radiator, such as a heat pipe, pumped loop, etc., while allowing good emissivity and heat rejection. Fibers are constructed from fiberglass, glass, quartz, saphire, diamond, ca... | 09/29/1992 |
| 5150278 | Finned housing An electrical component housing has a wall with an outwardly facing wall shaped to define rows of cooling fins with row channels between. Gaps are provided in the fin rows to define angle channels at 30° to 60° to the row channels.... | 09/22/1992 |
| 5148349 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same A structure of an electronic part which may be mounted on and soldered to the surface of a printed circuit board, and a method of mounting such an electronic part. While the electronic part mounted on the circuit board is operation, heat generated by the ... | 09/15/1992 |
| 5145001 | High heat flux compact heat exchanger having a permeable heat transfer element The present invention is directed to a compact heat exchanger having a permeable heat transfer element and an impervious heat transfer element. Fluid passes through the permeable element through passages which are substantially normal to the interface bet... | 09/08/1992 |
| 5136329 | Image forming apparatus capable of utilizing excess heat The present invention is directed to increase the radiating effect for the heat generated by an electric circuit portion disposed in an image forming apparatus, and radiates the heat by passing a recording sheet fed from a recording sheet containing porti... | 08/04/1992 |
| 5134547 | Electric apparatus housing an electromagnetic wave noise generating source An electric apparatus reducing the radiation of electromagnetic wave noise according to this invention includes an inner case in which an electromagnetic wave generating source is housed an a first opening for replacing the electromagnetic wave generating... | 07/28/1992 |
| 5132875 | Removable protective heat sink for electronic components A protective heat sink for an electronic component dissipates heat generated thereby. A first heat conductive member is mounted to the top side of the electronic component. A protective cap having an aperture formed therein is mounted on the printed circu... | 07/21/1992 |
