Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7136283 | Multi-computer system A multi-computer system includes a chassis and a plurality of computers within the chassis operable independent of one another. Each computer has a plurality of subassemblies. The subassemblies of different computers are physically grouped together within the chassi... | 11/14/2006 |
| 7136286 | Industrial computer with aluminum case having fins as radiating device An industrial computer without a fan is provided. The industrial computer comprises an aluminum case including a plurality of top fins projected toward a vertical direction and a plurality of side fins projected toward a horizontal direction; a motherboard including... | 11/14/2006 |
| 7134486 | Control of electrolysis gases in electroosmotic pump systems Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as wel... | 11/14/2006 |
| 7131486 | Electroosmotic microchannel cooling system Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as wel... | 11/07/2006 |
| 7131487 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat a... | 11/07/2006 |
| 7133283 | Frame-level thermal interface component for transfer of heat from an electronic component of a computer system A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from ... | 11/07/2006 |
| 7130196 | Apparatus and method for transferring heat from control devices A control device configured for mounting within an enclosure having a thermally conductive surface is disclosed. The control device includes a housing, a heat-generating device disposed within the housing, and a thermal conductor. The thermal conductor has a first p... | 10/31/2006 |
| 7126820 | Modular platform system and apparatus A modular platform is provided. The modular platform includes a modular platform shelf configured to receive modular platform boards, and a dual plenum coupled to the modular platform shelf, the modular platform configured to couple to a plenum portion of a dual ple... | 10/24/2006 |
| 7126299 | Enhanced system and method for controlling discharge of electric energy from machines Certain exemplary embodiments can comprise a method comprising: receiving electrical energy from a braking system of a vehicle at a working coil, the vehicle comprising a first wheel drive comprising a first electric motor; and via the working coil, transferring the... | 10/24/2006 |
| 7126821 | Ventilated casing for an electronic device The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inl... | 10/24/2006 |
| 7123480 | Package structure for a semiconductor device A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection p... | 10/17/2006 |
| 7120018 | Mother board with a ventilation-enhancing member A mother board includes a CPU, a suction fan mounted on the CPU for dissipating heat resulting from operation of the CPU, a north bridge chip disposed downstream to the suction fan, a power-consumption component disposed at one side of the CPU, and a ventilation-enh... | 10/10/2006 |
| 7120015 | Electronic apparatus An electronic apparatus is placed on an installation surface during use, and ensures comfortable use for users. The electronic apparatus includes a housing and a fan. The housing accommodates an electronic component, and includes a bottom face to be placed on the in... | 10/10/2006 |
| 7120026 | Heat-dissipating device with heat conductive tubes A heat-dissipating device with heat conductive tubes comprises a heat-dissipating unit having plurality of fins; each fin having a plurality of through holes; each through hole having a corresponding via hole near the through hole; a plurality of annular walls being... | 10/10/2006 |
| 7116777 | Termination frame with modules and method The present invention relates to a telecommunications connection module including a housing and connection locations mounted to a front face of the housing. The connection locations are removably mounted to the front face allowing access to an interior side of the c... | 10/03/2006 |
| 7116555 | Acoustic and thermal energy management system An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer t... | 10/03/2006 |
| 7116553 | Circuit board enclosure The invention provides an expandable modular enclosure system for enclosing circuit boards connected by a stackable bus. The enclosure system includes one or more carriers and spacers, a base unit, and a top unit. The spacers and carriers are alternately stacked bet... | 10/03/2006 |
| 7113401 | System for airflow management in electronic enclosures A system for airflow management in an electronic enclosure includes a backplane assembly having at least one backplane connector, at least one daughter card, and components disposed on the daughter card oriented to facilitate front-to-back airflow, wherein inlet coo... | 09/26/2006 |
| 7113405 | Integrated power modules with a cooling passageway and methods for forming the same An integrated power module includes a longitudinally extending mounting member defining a cooling passageway on a first side thereof. A heat sink is positioned in the cooling passageway. A printed circuit board is positioned proximate a second side of the mounting m... | 09/26/2006 |
| 7112877 | High density package with wrap around interconnect A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the f... | 09/26/2006 |
| 7113400 | Housing structure of electronic control unit and mounting structure of the same A housing for enclosing an electronic control unit is constructed of a resinous cover and a metallic case having heat conductivity higher than that of the resinous cover. An air intake module is mounted on an engine inside an engine compartment. The air intake modul... | 09/26/2006 |
| 7113402 | Systems, apparatus and method for reducing dust on components in a computer system An apparatus and method for reducing dust on components in a computer system is disclosed. Embodiments include a system that generally includes an enclosure, a component mounted with the enclosure, and a fan adapted to induce an airflow towards the component to prov... | 09/26/2006 |
| 7111984 | X-ray computed tomography apparatus with heat emission system An X-ray computed tomography apparatus wherein an X-ray is generated by a generator and an X-ray data resulting from the X-ray is detected by a detector. The apparatus includes a supporter, a driver, a body, and a converter. The supporter is configured to support th... | 09/26/2006 |
| 7107197 | Wiring harness data systems A wiring harness design is analyzed and module data is created automatically and stored for a plurality of harness modules representing wire and component element requirements for those modules, the modules being capable of assembly in selected combinations to creat... | 09/12/2006 |
| 7106016 | Inductive heating system and method for controlling discharge of electric energy from machines Certain exemplary embodiments can comprise a method comprising: receiving electrical energy from a braking system of a vehicle at a working coil, the vehicle comprising a first wheel drive comprising a first electric motor; and via the working coil, transferring the... | 09/12/2006 |
| 7106050 | Apparatus for shielding a device under test from electromagnetic waves A shielding apparatus was developed to eliminate electromagnetic waves interference (EMI) to an integrated circuit (IC) die while it is under test. The shielding apparatus comprises a conductive plate having a first and second surfaces and a central opening where th... | 09/12/2006 |
| 7106586 | Computer heat dissipating system A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a cir... | 09/12/2006 |
| 7102888 | Electronically integrated vehicle structure An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plu... | 09/05/2006 |
| 7100676 | Fan duct A fan duct includes an immovable cylinder and a movable cylinder. The movable cylinder is capable of sliding in an axial direction of the immovable cylinder. One of the immovable cylinder and the movable cylinder defines at least one groove in an axial direction the... | 09/05/2006 |
| 7100604 | Latching system and method for pressure chambers A latching mechanism for a pressure chamber for hypobaric use is disclosed. The mechanism includes one or more pin modules positioned on a periphery of a door of the pressure chamber, the door being adapted to open into the chamber and abut a frame of the pressure c... | 09/05/2006 |
| 7102887 | Housing for hot pluggable network taps A housing for hot-pluggable network tap modules. The housing allows a user to maintain all network taps in any given system in one housing and location. This increases the ease of maintaining multiple network taps and allows the network tap modules to be powered by ... | 09/05/2006 |
| 7099153 | Heat dissipating structure for an electronic device A heat dissipating structure for an electronic device includes a heat source and a heat dissipating member. The heat dissipating member has an inner wall, an outer wall, and a plurality of partition walls. The inner wall receives heat transfer from the heat source. ... | 08/29/2006 |
| 7096928 | Flexible loop thermosyphon A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit ... | 08/29/2006 |
| 7095611 | Housing for a passively cooled computer A housing (1) for a passively cooled computer (2), which is to be accommodated in the housing, the housing (1) including: a housing cover (3) and a housing floor (4), whereby at least the housing ... | 08/22/2006 |
| 7095612 | Cooled electrical terminal assembly and device incorporating same A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid ... | 08/22/2006 |
| 7091603 | Semiconductor device In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the principal front surface side of the semiconductor chips, wherein subst... | 08/15/2006 |
| 7092252 | Air-directing unit An air-directing unit for use in redirecting air flow in a memory module environment of a computer. The air-directing unit comprises a body portion configured to redirect air flow therearound such that the air flow is redirected in the memory module environment. The... | 08/15/2006 |
| 7090127 | Connector identification module for mobile platform A connector for use with a mobile platform, such as an aircraft, which forms a part of the aircraft installation, and which can therefore not be readily removed from the aircraft once installed. In one preferred form the connector includes a standardized connector b... | 08/15/2006 |
| 7092253 | Back plane and mid-plane assemblies and related systems and methods Back plane and mid-plane assemblies and related systems and methods are described. In one embodiment, a system comprises an enclosure and a plane assembly mounted within the enclosure and configured to connect with multiple pluggable devices. The plane assembly comp... | 08/15/2006 |
| 7092255 | Thermal management system and method for electronic equipment mounted on coldplates According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow ... | 08/15/2006 |
