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| Number | Title | Issue Date |
| 4759403 | Hydraulic manifold for water cooling of multi-chip electric modules A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow f... | 07/26/1988 |
| 4750086 | Apparatus for cooling integrated circuit chips with forced coolant jet The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible micro... | 06/07/1988 |
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion a... | 04/26/1988 |
| 4739446 | Header for a wafer scale assembly A header for a wafer scale assembly includes a plurality of pins having end portions connectable to the wafer scale assembly. The end portions lie in a single plane that it substantially parallel to the plane of the wafer scale assembly.... | 04/19/1988 |
| 4739443 | Thermally conductive module A thermally conductive module is adapted for mounting a plurality of electronic components. A ceramic substrate has a first layer of foil glass bonded thereto and adapted for mounting a plurality of electronic components thereon. A second layer of foil is... | 04/19/1988 |
| 4727454 | Semiconductor power module A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module... | 02/23/1988 |
| 4718163 | Process for producing cooling device for printed circuit card The invention relates to a cooling device for a printed circuit card and to its production process. It is constituted by a parallelepipedic copper frame, to one face of which is fixed the card. The frame is open on two opposite lateral faces orthogonal to... | 01/12/1988 |
| 4694323 | Apparatus for vapor-cooling a semiconductor A semiconductor stack is composed of a GTO thyristor, cooling members and wiring conductors which are stacked and tightened together. The semiconductor stack is disposed horizontally in a cooling vessel, and the vessel is filled with a Freon liquid. A con... | 09/15/1987 |
| 4686606 | Device for cooling integrated circuit chip A cooling structure for cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate formed with minute grooves on one of its surfaces is disposed between each integrated circuit chip and an associated ... | 08/11/1987 |
| 4683489 | Common housing for two semi-conductor bodies A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, w... | 07/28/1987 |
| 4680673 | Encapsulated housing for dissipating heat produced by electrical circuits A housing or box for dissipation of the heat produced by electrical circuits. The housing includes a metallic armature which has an upper portion with a hermetic recess in which are disposed the electrical circuits, and a lower portion for cooling with a ... | 07/14/1987 |
| 4652970 | High density LSI package for logic circuits A multichip package is comprised of a substrate having a grid of input and output pins disposed on an under surface. Power supply and grounding wire layers are embedded in the substrate. An upper surface of the substrate has a plurality of thin wire layer... | 03/24/1987 |
| 4646202 | Cabinet for electronic apparatus A cabinet (1) for stowage of electronic printed circuit boards (2,3,4) for example, is adapted for permanent installation in a vehicle structure by allowing the boards to be readily removable. The cabinet can thus be readily cooled by both air and fluid j... | 02/24/1987 |
| 4644385 | Cooling module for integrated circuit chips This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated c... | 02/17/1987 |
| 4631636 | High density packaging technique for electronic systems A high density packaging arrangement for electronics systems wherein a plurality of circuit board assemblies are provided with electronic components on one side and cooling tubes on the other side. The assemblies are arranged such that the cooling tubes m... | 12/23/1986 |
| 4622621 | Chip carrier for high frequency power components cooled by water circulation A chip carrier is provided for power components operating at high frequency, comprising a main heat conducting body with a cavity in which said component is housed, and forced flow fluid ducts. The chip carrier is inserted in a window cut out in a printed... | 11/11/1986 |
| 4559580 | Semiconductor package with internal heat exchanger An internally cooled semiconductor package including a wafer-like semiconductor body with at least two electrical elements, one at a relatively flat surface of the body. A wall of high electrical and heat conductive material abuts the flat surface of the ... | 12/17/1985 |
| 4542784 | Retention and cooling of plug-in electronic modules in a high shock and vibration environment Method and apparatus are disclosed for selectively clamping the edges of electronic modules into mechanical and thermal contact with a fluid coolant circuit. A stack of plural substantially parallel and generally planar fluid conduit-containing structures... | 09/24/1985 |
| 4538675 | Retention and cooling of plug-in electronic modules in a high shock and vibration environment Method and apparatus are disclosed for selectively clamping the edges of electronic modules into mechanical and thermal contact with a fluid coolant circuit. A stack of plural substantially parallel and generally planar fluid conduit-containing structures... | 09/03/1985 |
| 4531146 | Apparatus for cooling high-density integrated circuit packages An apparatus for cooling a high-density integrated circuit package including a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the heat generated by operation thereof... | 07/23/1985 |
| 4478495 | Light gate assemblies, elements and manufacturing methods Elongate light gate structures are composed of a plurality of individual chips of electrooptically active light gate material displaying field induced birefringence. The individual chips are provided in rectangular configuration. Each chip has a plurality... | 10/23/1984 |
| 4463409 | Attitude independent evaporative cooling system An attitude independent, evaporative cooling system used in airborne systems for cooling electronic components. The coolant is water contained within ducts in heat transfer relationship with the electronic components. The ducts are sealed to water passage... | 07/31/1984 |
| 4449576 | Heat-producing elements with heat pipes The PC-boards are contained in sealed enclosures, and serially effective heat pipe systems conduct thermal energy from the respective sources of development (e.g., power transmitters) to the top and from there to a heat pump system. Stacking such units an... | 05/22/1984 |
| 4438692 | Printing apparatus with cooling of hammer printing coils A printing apparatus including a plurality of drive coils for driving printing hammers arranged longitudinally in side-by-side relation at one side of a core of the U-shape. A first cooling fluid passageway is defined inside the core of the U-shape to all... | 03/27/1984 |
| 4431980 | Electrical apparatus winding A plurality of winding units each composed of a wire element are serially arranged in the axial direction of the winding between an inner insulating sleeve and an outer insulating sleeve, and vertical cooling paths are formed on opposite sides of each win... | 02/14/1984 |
| 4408255 | Absorptive electromagnetic shielding for high speed computer applications An electromagnetic shield comprising two portions in which the first portion consists of a magnetically permeable mat with a conductive sheet bonded to one side and an insulating sheet bonded to the opposite side. In a typical application, this first port... | 10/04/1983 |
| 4399484 | Integral electric module and assembly jet cooling system An improved printed circuit board housing assembly is described wherein localized high intensity cooling of heat dissipating electronic components mounted on the circuit boards may be accomplished by direct impingement of streams of fluid coolant onto ind... | 08/16/1983 |
| 4381032 | Apparatus for cooling high-density integrated circuit packages An apparatus for cooling a high-density integrated circuit package including a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the heat generated by operation thereof... | 04/26/1983 |
| 4368503 | Hollow multilayer printed wiring board A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates (1), (2), (3) and (4), superposed upon each other with a predeterm... | 01/11/1983 |
| 4360141 | Holder for welding seam back-up tape A welding seam back-up structure for mounting on the backside of the adjacently positioned edge margins of work members or workpieces that are to be joined by a weld seam, in which an elongate back-up tape of fiberglass or other suitable material is retai... | 11/23/1982 |
| 4331830 | Housing for electrical components A heat dissipating container for electrical components immersed in a liquid dielectric in one chamber and for electrical components surrounded by an air dielectric in another chamber. A flexible bladder serves as a common wall with the liquid dielectric c... | 05/25/1982 |
| 4327399 | Heat pipe cooling arrangement for integrated circuit chips A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Int... | 04/27/1982 |
| 4302793 | Electronic cooling Electronic components are mounted upon a chassis which slides vertically inside a tank. The components are normally cooled by circulating transformer oil around them. When inspection, maintenance or repair work is required, the bottom of the chassis is se... | 11/24/1981 |
| 4257552 | Method and apparatus for controlling the flow of a temperature regulating fluid A closed loop control apparatus utilizes a cooling effect sensor to measure the cooling capacity of a fluid in a supply conduit connected to one or more thermal loads. The sensor includes an electrical heater that is regulated to heat a sampled portion of... | 03/24/1981 |
| 4245273 | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices A package for mounting, interconnecting, and cooling a large number of integrated circuit semiconductor devices having a sintered multilayer ceramic substrate provided with an internal metallurgy network made up of voltage planes, X and Y signal planes, a... | 01/13/1981 |
| 4186422 | Modular electronic system with cooling means and stackable electronic circuit unit therefor A modular electronic system having cooling means has a plurality of stacked electronic circuit units. Each stackable circuit unit has a rectangular frame having a pair of end members which support a plurality of spaced-apart, cooling channels. A cooling p... | 01/29/1980 |
| 4135225 | Pivotal structural enclosure Single or multiple bay systems incorporating electrical or electronic modules mounted in cages attached to pivoted gates. The latter are characterized by, and as having associated therewith. (a) multiple gates respectively located in multiple interior spaces, ... | 01/16/1979 |
| 4037270 | Circuit packaging and cooling A circuit board is provided with a plurality of groups of connectors, so disposed and arranged in respect to each other that each group is capable of receiving a chip carrier. A fluid conduit, carrying a coolant, extends through each group so that when th... | 07/19/1977 |
| 3992653 | Zero insertion force card guide An electronic module which provides for the insertion of printed circuit cards into the card receptacles of a heat exchanger with essentially zero insertion force. The printed circuit cards are of the type wherein individual electrical components are moun... | 11/16/1976 |
| 3986080 | Oil-immersed type flyback transformer device An oil-immersed type flyback transformer device wherein the container for the flyback transformer is made of plastic, whereby the ratio between the temperature coefficient of expansion of the capacity of the container with respect to the original capacity... | 10/12/1976 |
