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| Number | Title | Issue Date |
| 8174826 | Liquid cooling system for stackable modules in energy-efficient computing systems A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid co... | 05/08/2012 |
| 8174828 | Narrow gap spray cooling in a globally cooled enclosure Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality o... | 05/08/2012 |
| 8169779 | Power electronics substrate for direct substrate cooling Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical ... | 05/01/2012 |
| 8125777 | Methods and apparatus for electrical components Methods and apparatus for electrical components according to various aspects of the present invention may be implemented in conjunction with an electrical system comprising a heat generating component and a cooling system. The cooling system may comprise a cooling c... | 02/28/2012 |
| 8064198 | Cooling device for semiconductor element module and magnetic part A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the coo... | 11/22/2011 |
| 7978468 | Power converter The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semi... | 07/12/2011 |
| 7940524 | Remote cooling of a phased array antenna A self-contained cooling system for a phased array antenna includes a cooling structure, a heat exchanger, and a pump for circulating a fluid coolant around a coolant loop. The cooling system receives power from a remote power source. The cooling structure includes ... | 05/10/2011 |
| 7936560 | Cooling device and electronic equipment including cooling device A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a di... | 05/03/2011 |
| 7936563 | On-chip interconnect-stack cooling using sacrificial interconnect segments The present invention relates to an integrated-circuit device and to a method for fabricating an integrated-circuit device with an integrated fluidic-cooling channel. The method comprises forming recesses in a dielectric layer sequence at desired lateral positions o... | 05/03/2011 |
| 7889499 | Integrated replaceable energy storage and coolant module There is disclosed a self-contained electronic apparatus containing at least some power-dissipating components which may require cooling. The self-contained electronic apparatus may also include a removable and replaceable energy storage module. The removable and re... | 02/15/2011 |
| 7835151 | Flow distribution module and a stack of flow distribution modules A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet spe... | 11/16/2010 |
| 7826217 | Cooling device and electronic apparatus using the same It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for c... | 11/02/2010 |
| 7764494 | Liquid cooled module A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top s... | 07/27/2010 |
| 7453695 | Cooling structure of electric device A cooling structure of electric devices in a vehicle is structured to hold an inverter (300) downward of a cooling passage (356), and to hold a condenser (200) upward of the cooling passage (356). The heating value generated by the invert... | 11/18/2008 |
| 7450378 | Power module having self-contained cooling system A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway ... | 11/11/2008 |
| 7433190 | Liquid cooled electronic chassis having a plurality of phase change material reservoirs A system and method of thermal management of electrical and electronic systems and components that adequately maintains the temperatures of the system electronics and electrical devices within reliable limits during various postulated system malfunctions. The system... | 10/07/2008 |
| 7433188 | Electronic package with direct cooling of active electronic components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic compone... | 10/07/2008 |
| 7417858 | Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across segments of the plurality of pipes. Electrical currents are induced acr... | 08/26/2008 |
| 7408775 | Electrical module and support therefor with integrated cooling A rack system is disclosed that includes a plurality of electrical modules (48), a frame (10) supporting the plurality of electrical modules (48) that includes a plurality of frame members (16, 18, 20, 22, 26, 38, 39, 40) and a plurality ... | 08/05/2008 |
| 7403384 | Thermal docking station for electronics For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interf... | 07/22/2008 |
| 7375967 | Portable electronic device and heat-dissipation method and battery charger thereof A heat-dissipation method comprises providing a heat-transfer module and a heat-dissipation module, wherein the heat-transfer module is disposed in a portable electronic device, and the heat-dissipation module is disposed in a battery charger. The heat-dissipation m... | 05/20/2008 |
| 7372697 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the h... | 05/13/2008 |
| 7373268 | Method and system for dynamically controlling cooling resources in a data center The present invention includes a method and system for dynamically controlling cooling resources in a data center based on the workload of the data center. Accordingly, based on the workload constraints (power consumed, latency, etc.) of the data center, each of a p... | 05/13/2008 |
| 7367099 | Method for assembling two parts having accurate dimensions and use for brazing of a linac RFQ accelerator A method of assembling two parts of which the dimensions of one of the parts or the final assembly are to be adhered to with precision. In the part whose dimensions are to be adhered to with the highest level of precision, a groove is machined to have a depth greate... | 05/06/2008 |
| 7365980 | Micropin heat exchanger An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a pixel like pattern over the substrate. ... | 04/29/2008 |
| 7365974 | Method for electronics equipment cooling having improved EMI control and reduced weight An air cooling apparatus for an aircraft includes a cabinet that is configured to house a plurality of modules in a plurality of module accepting regions, respectively, wherein the cabinet has a backplane region. The apparatus further includes a plurality of air flo... | 04/29/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7365986 | Semiconductor cooling device and stack of semiconductor cooling devices To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a se... | 04/29/2008 |
| 7362574 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surfac... | 04/22/2008 |
| 7359197 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 04/15/2008 |
| 7355857 | Heat sink gasket A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the recept... | 04/08/2008 |
| 7355852 | Modular liquid cooling of electronic assemblies An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to th... | 04/08/2008 |
| 7352572 | Fire block module The fire block module includes a number of rectangular plate strips, arranged vertically and parallel to each other to form a grid layer. The grid layer is arranged horizontally in respect of the vertical direction of flame propagation occurring in the event of a fi... | 04/01/2008 |
| 7349213 | Coolant control unit, and cooled electronics system and method employing the same A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and secon... | 03/25/2008 |
| 7349225 | Multifunctional composite sandwich element with embedded electronics A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core region, embedded electrical conductors within the central... | 03/25/2008 |
| 7341175 | Bonding of light emitting diodes having shaped substrates Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do... | 03/11/2008 |
| 7339789 | Modular, scalable thermal solution One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first int... | 03/04/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7336487 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated ... | 02/26/2008 |
| 7333334 | Liquid cooling system and electronic equipment using the same For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which... | 02/19/2008 |
