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"Rail travel at high speeds is not possible because passengers, unable to breathe, would die of asphyxia."
Dionysius Lardner, Professor of Natural Philosophy and Astronomy at University College, London ; 1830
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| Number | Title | Issue Date |
| 7221570 | Heat dissipating device for an integrated circuit chip An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by t... | 05/22/2007 |
| 7222043 | Electronic device environmental effect prediction An apparatus in one example comprises one or more control components that regulate one or more thermal test components to adjust one or more emulated operational characteristics for one or more electronic devices. The thermal test components are coupled with one or ... | 05/22/2007 |
| 7217086 | Cooling fluid pump A cooling fluid pump includes a casing having a cylindrical pump chamber inside and an outer surface, the pump chamber having an inner surface, an impeller mounted rotatably inside the pump chamber and having a number of pump vanes, the impeller further having an ax... | 05/15/2007 |
| 7218517 | Cooling apparatus for vertically stacked printed circuit boards An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB with... | 05/15/2007 |
| 7219247 | Methods and apparatus for replacing cooling systems in operating computers An apparatus and method for replacing a CPU cooling system, for example, a fan, while a computer continues to operate has a mechanism for maintenance personnel to signal that cooling fan replacement is about to begin. In response to the signal, a control mechanism c... | 05/15/2007 |
| 7217650 | Metallic nanowire interconnections for integrated circuit fabrication A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic... | 05/15/2007 |
| 7218515 | Cooling fan with external circuit board A cooling fan comprising a housing, an electric motor, a blade assembly, and a first motor control circuit board. The housing is operable to connect to a computer chassis that supports an electronic component. An electric motor is fixably mounted within a volume for... | 05/15/2007 |
| 7218516 | Inlet airflow guiding structure for computers An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflo... | 05/15/2007 |
| 7215022 | Multi-die module A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die... | 05/08/2007 |
| 7215546 | Pump, electronic apparatus, and cooling system The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The cooling pump according to the invention includes: a rotor having a disk-sh... | 05/08/2007 |
| 7215552 | Airflow redistribution device In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region ... | 05/08/2007 |
| 7215553 | Computer housing with removable light pipe A computer housing, removable light pipe device, and method for assembling a computer are disclosed. The computer housing has a drive door assembly and a light pipe. The light pipe is removably coupleable with the drive door assembly. ... | 05/08/2007 |
| 7214131 | Airflow distribution control system for usage in a raised-floor data center An airflow distribution control system for usage in a raised-floor data center comprises an under-floor partition with a controllable flow resistance and a sensor. The partition is capable of selective positioning in a plenum beneath the raised-floor. The sensor is ... | 05/08/2007 |
| 7215550 | Heat sink fastener A heat sink fastener includes a main body, a piercing body and an operating member. The main body includes a pressing part adapted for pressing a heat sink toward a heat-generating component, an engaging part and a latching leg, the engaging part and the latching le... | 05/08/2007 |
| 7212404 | Integrated heat sink device An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated h... | 05/01/2007 |
| 7212403 | Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection An apparatus and method of cooling a plurality of electronic components in a housing using one or more fans cooperating with baffles or ducts for directing a stream of air sequentially to the components or heat exchangers for the components. Direction of the air str... | 05/01/2007 |
| 7212412 | Shelf with removable backplane A shelf is provided defining a tubular closed passage with a frontend opening and a backend opening. A frontend partition is adapted for supporting a first component inserted in the frontend. A removable backend partition is adapted for supporting a second component... | 05/01/2007 |
| 7210519 | Heat pipe A heat pipe includes a metal tube, a layer of nano-particles and a working fluid. The metal tube has an inner surface defining at least two pores. Each of the pores has a diameter in the range from about 2 to about 50 nanometers. The layer of nano-particles is forme... | 05/01/2007 |
| 7212399 | Processor module packaging for a portable electronic device display A processor module is packaged with a display for a portable electronic device. The display is designed to create a space within a display housing to allow a processor module to be included in the display housing. The processor module can be designed to be integral ... | 05/01/2007 |
| 7209356 | Heat dissipation device A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink... | 04/24/2007 |
| 7209349 | Heat dissipation device A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temper... | 04/24/2007 |
| 7209353 | Hermetically sealed access point for a wireless network The present invention is based on the theory of forced air convection. In a hermetically sealed access point/computer, by placing a blowing fan perpendicular to the hot elements of the computer and thereby circulating the air around the housing of the computer the p... | 04/24/2007 |
| 7209348 | Heat dissipating structure for an electronic device and heat dissipating device A heat dissipating member has an inner wall, outer wall, and partition walls. The inner wall directly or indirectly receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the o... | 04/24/2007 |
| 7209351 | Telecom equipment chassis using modular air cooling system This application discloses an apparatus comprising a chassis comprising a box having a perforated top, a perforated bottom and four sidewalls, wherein at least two on the sidewalls have air vents therein near the bottom, a modular fan assembly removably coupled to t... | 04/24/2007 |
| 7209347 | Blade server system A blade server system including a housing, a middle plane board, a server blade and a display panel is provided. The server blade is electrically connected to the middle plane board, while the display panel is electrically connected to the middle plane board and is ... | 04/24/2007 |
| 7207228 | Tracer airflow measurement system (TRAMS) A method and apparatus for measuring fluid flow in a duct is disclosed. The invention uses a novel high velocity tracer injector system, an optional insertable folding mixing fan for homogenizing the tracer within the duct bulk fluid flow, and a perforated hose samp... | 04/24/2007 |
| 7209352 | Heat dissipation device incorporating fan duct A heat dissipation device includes two heat sinks (30) mounted on two electronic components (16) which is mounted within a server (10), two fans (40) mounted on a mounting plate (14) of the server facing the heat sinks for blowing ... | 04/24/2007 |
| 7205474 | Computer case structure A computer case structure includes an anchor rack to hold and position a power supply. The anchor rack has force distributing walls extended from the periphery. When the computer case is positioned in a tilted manner, the weight of the power supply is evenly distrib... | 04/17/2007 |
| 7204750 | Airflow guide structure and manufacture thereof An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein.... | 04/17/2007 |
| 7206202 | Electronic apparatus with heat-dissipating structure An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation ... | 04/17/2007 |
| 7206207 | Heat dissipation device assembly A heat dissipation device assembly includes a heat dissipation device (10) and a retaining device (20). The heat dissipation device includes a heat sink and a heat receiver (11) provided below the heat sink. The heat receiver includes an upper s... | 04/17/2007 |
| 7206946 | Disk drive system for starting destaging of unwritten cache memory data to disk drive upon detection of DC voltage level falling below predetermined value A disk array system including at least one channel control portion, at least one disk control portion, a cache memory, a cache switch, a shared memory, a power unit, and a casing for storing the channel control portion, the disk control portion, the cache memory, th... | 04/17/2007 |
| 7206201 | Memory storage device docking adapter having a laterally mounted fan A docking adapter capable of cooling a memory storage device such as a hard disk drive includes a carrier and a rack. The carrier has a face with a vent, a backplane, a first lateral side and second lateral side extending perpendicularly from the face to the backpla... | 04/17/2007 |
| 7203856 | Mobile computer with desktop type processor A mobile computer with a desktop type processor. The mobile computer further includes a battery, a current sensor, and a clock generator. The battery supplies a current to the desktop type processor. The current sensor is coupled to the battery, and detects a value ... | 04/10/2007 |
| 7201651 | Louver heat vent for chassis of computer A louver heat vent for a chassis of a computer, which is mounted in an opening of the chassis, has two shafts and multiple slats. The shafts each have a channel, into which fasteners of the slats can be inserted. The slats are stacked to conceal and shield the inter... | 04/10/2007 |
| 7201012 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
| 7203062 | Electronic apparatus with air cooling unit An electronic apparatus comprises a display that is used both in a horizontal direction and a vertical direction, and a housing connected to the display. The housing includes a heating element therein and includes an exhaust port formed thereon. The electronic appar... | 04/10/2007 |
| 7203064 | Heat exchanger with cooling channels having varying geometry A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels ma... | 04/10/2007 |
| 7203063 | Small form factor liquid loop cooling system An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the comp... | 04/10/2007 |
| 7198094 | Finned device for removing heat from an electronic component A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriente... | 04/03/2007 |
