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| Number | Title | Issue Date |
| 6845551 | Method of making a power electronics capacitor There is disclosed herein a high voltage and high temperature power electronics capacitor which comprises one or more insulator layers of mica paper, and one or more metal conductor layers, all dispersed in a pressurized environment of a nonreactive and high voltage... | 01/25/2005 |
| 6842327 | High-voltage CMOS-compatible capacitors A high-voltage stacked capacitor includes a first capacitor and a second capacitor. Each capacitor includes a first plate comprising a first semiconductive body and a second plate comprising a floating electrode. The first and second semiconductor bodies are electri... | 01/11/2005 |
| 6839221 | Multilayer ceramic capacitor and process for preparing the same The mean grain size (D2) of the main crystal phase 11 in the external cover dielectric layers 3 is made larger than the mean grain size (D1) of the main crystal phase 11 in the dielectric ceramic layers 7, and the amount of ... | 01/04/2005 |
| 6836400 | Structures based on ceramic tantalum nitride A method for fabrication of ceramic tantalum nitride and improved structures based thereon is disclosed. According to the disclosed method, an ionized metal plasma (“IMP”) tool is used to create a plasma containing tantalum ions where the plasma is sustained by ... | 12/28/2004 |
| 6836398 | System and method of forming a passive layer by a CMP process The present invention provides systems and methods that facilitate formation of semiconductor devices via planarization processes. The present invention utilizes dishing effects that typically occur during a chemical mechanical planarization (CMP) process. A reducin... | 12/28/2004 |
| 6833986 | Integrated passive components and package with posts A method and apparatus for an electronic component package of a passive component using wafer level processing is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic ... | 12/21/2004 |
| 6831824 | Surface mountable vertical multi-layer capacitor A fully surface mountable vertical multi-layer capacitor having low insertion loss at high frequency and low inductance, and providing sufficiently high capacitance for use in broadband and other applications. The capacitor includes a first section and a second sect... | 12/14/2004 |
| 6829135 | Layered product, capacitor, electronic component and method and apparatus manufacturing the same Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) pen... | 12/07/2004 |
| 6829134 | Laminated ceramic electronic component and method for manufacturing the same A highly reliable monolithic ceramic capacitor which has no structural defect, e.g. peeling, and which is not susceptible to water from the outside and a method for manufacturing the same are provided. A lead portion of an internal electrode is configured to have a ... | 12/07/2004 |
| 6819540 | Dielectric structure Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers. ... | 11/16/2004 |
| 6816354 | Single layer capacitor milled part A single layer capacitive device and a method of making the same are provided. Such method allows for perfect registration between the capacitive plates thus eliminating any significant amount of fringe capacitance and assuring a uniform fringe border around the dev... | 11/09/2004 |
| 6815085 | Printed circuit board capacitor structure and method A capacitive element for a circuit board or chip carrier is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cure... | 11/09/2004 |
| 6809918 | Method for improved processing and etchback of a container capacitor A capacitor having improved size for enhanced capacitance and a method of forming the same are disclosed. In one embodiment, the capacitor is a stacked container capacitor used in a dynamic random access memory circuit. The capacitor provides a capacitor that has hi... | 10/26/2004 |
| 6798641 | Low cost, high density diffusion diode-capacitor A multiple-layer diffusion junction capacitor structure includes multiple layers of inter-digitated P-type dopant and N-type dopant formed in a semiconductor substrate. An opening in a hard mask is formed taking care to control the angle of the sidewall using a dry,... | 09/28/2004 |
| 6795295 | Multi-layer capacitor and method for producing the same A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and t... | 09/21/2004 |
| 6795294 | Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit A laminated capacitor has an end surface pitch Pe, which defines an interval between adjacent first and second external terminal electrodes disposed on end surfaces having shorter sides in a body of a laminated capacitor, which is equal to or less than about 0.9 tim... | 09/21/2004 |
| 6791818 | Electronic device An electrode of an electronic device includes plural nickel layers adjacent to each other, and an outer nickel layer contains less phosphorus than an inner nickel layer. The electrode has an increased solder joining strength without having a flexural strength decrea... | 09/14/2004 |
| 6788521 | Capacitor and method for fabricating the same A capacitor which includes a lower electrode 12 formed on a substrate 10; an insulation film 16 having an opening 24 on the lower electrode 12; a capacitor dielectric film 30 formed on the lower electrode 12 in the op... | 09/07/2004 |
| 6781816 | Electronic component An electronic component includes: a dielectric element formed by layering dielectric layers; two types of internal conductors, which have a plurality of extended portions, respectively, that are extended toward a plurality of side surfaces of the dielectric element,... | 08/24/2004 |
| 6762924 | Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same The invention is a storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode having a barrier layer interposed between a conductive plug and an oxidation resistant layer. A thick insulative layer protects the sidewall... | 07/13/2004 |
| 6757152 | Cascade capacitor Multi-layer and cascade capacitors for use in high frequency applications and other environments are disclosed. The subject capacitor may have multiple capacitor components or aspects thereof in an integrated package. Such components may include, for example, thin f... | 06/29/2004 |
| 6753218 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electricall... | 06/22/2004 |
| 6754064 | Mounting structure for two-terminal capacitor and three-terminal capacitor A mounting structure for a two-terminal capacitor or a three-terminal capacitor includes a hot conductor pattern, to which first external terminals of two-terminal capacitors are electrically connected, and grounding conductor patterns, to which second external term... | 06/22/2004 |
| 6751082 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electricall... | 06/15/2004 |
| 6739027 | Method for producing printed circuit board with embedded decoupling capacitance A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil... | 05/25/2004 |
| 6738251 | Conductive pattern incorporated in a multilayered substrate, multilayered substrate incorporating a conductive pattern, and a method of fabricating a multilayered substrate The present invention provides a conductive pattern that has low electric resistivity, is superior in adhesion to a substrate and does not cause substrate cracking during plating, a multilayered substrate incorporating such a conductive pattern, and a fabricating me... | 05/18/2004 |
| 6735073 | Electronic devices based on density wave dielectrics A capacitor includes first and second electrodes and a quasi 1D dielectric material disposed between the electrodes. The dielectric material has a charge or spin density wave state. ... | 05/11/2004 |
| 6735072 | On-chip decoupling capacitors designed for a 0.11 micron and beyond dual gate oxide CMOS technology A decoupling capacitor suitable for use with 0.11 micron or less, for example 0.09 micron, CMOS technology is provided herein. The decoupling capacitor includes a decoupling structure that minimizes leakage current associated with the decoupling capacitor. ... | 05/11/2004 |
| 6731496 | Electrostatic chuck An electrostatic chuck which allows sufficiently rapid temperature rising/dropping thereof, in case that the diameter of a ceramic substrate is 190 mm or more or especially in case that the diameter of the ceramic substrate is quite large, exceeding 300 mm. The elec... | 05/04/2004 |
| 6731495 | Thin film capacitor using conductive polymers The invention relates to a thin film capacitor containing (a) a substrate, (b) a first polymeric film containing an electrically conductive polymer located on the substrate, (c) a pentoxide layer selected from the group consisting of tantalum pentoxide, or niobium p... | 05/04/2004 |
| 6731493 | Low impedance inter-digital capacitor and method of using An inter-digital capacitor may be used in a power socket for a microelectronic device. In one embodiment an integrated, low-resistance power and ground terminal configuration is disclosed. The capacitor plates are alternatively coupled to the power and ground termin... | 05/04/2004 |
| 6728094 | Titanium oxide powder, methods of manufacturing the same and barium titanate powder, dielectric ceramic, and multilayer ceramic capacitor A titanium oxide powder holding a barium compound on the surface of the particles thereof is used for manufacturing a highly crystalline fine barium titanate powder by solid-phase reaction. When the titanium oxide powder and a barium-containing powder material are m... | 04/27/2004 |
| 6724610 | Capacitor element for a power capacitor and also a power capacitor comprising such a capacitor element A capacitor element for a power capacitor having a two foils (3, 5) of metal forming a pair of electrodes, and also films (2a, 2b, 4a, 4b) of dielectric material forming the dielectric medium of the capa... | 04/20/2004 |
| 6721167 | Multilayer ceramic capacitor and method for the manufacture thereof A multilayer ceramic capacitor includes sintered laminated bodies having a plurality of dielectric layers alternately stacked with a multiplicity of internal electrodes, and a pair of external electrodes electrically coupled to the internal electrodes. The dielectri... | 04/13/2004 |
| 6721164 | Electronic composite material component The invention describes an electronic component, in particular a multiplayer component, with a dielectric and at least one electrode. The dielectric is a composite made of a dielectric ceramic material and an organic polymer. To manufacture the electronic component,... | 04/13/2004 |
| 6710998 | Multi-layer capacitor and method for manufacturing same A multi-layer capacitor includes a plurality of dielectric layers, a pair of external electrodes and a multiplicity of internal electrode layers, each internal electrode layer being interposed between every two neighboring dielectric layers. Said two neighboring int... | 03/23/2004 |
| 6710425 | Structure to increase density of MIM capacitors between adjacent metal layers in an integrated circuit A high density MIM capacitor structure and method of manufacturing the same is disclosed for integrated circuits having multiple metal layer interconnections. The capacitor structure is formed between selected first and second metallic interconnections which are sep... | 03/23/2004 |
| 6710255 | Printed circuit board having buried intersignal capacitance and method of making A first signal path is connected to a first plane via a plated hole. A first metal flood is connected to the plated hole to form a first plate. A second signal path is on a second plane. A second metal flood connected to the second signal path to form a second plate... | 03/23/2004 |
| 6704188 | Ultra thin TCS (SiCL4) cell nitride for dram capacitor with DCS (SiH2Cl2) interface seeding layer A method for forming silicon nitride films on semiconductor devices is provided. In one embodiment of the method, a silicon-containing substrate is first exposed to a mixture of dichlorosilane (DCS) and a nitrogen-containing gas to desposit a thin silicon... | 03/09/2004 |
| 6700772 | Integrated passive device and method for producing such a device An IPD has a varistor of electrodes and a ZnO dielectric. A capacitor includes electrodes and a dielectric that has oxides of bismuth, magnesium, and niobium having a pyrochlore structure of type A2 B2 O7. The materials ar... | 03/02/2004 |
