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| Number | Title | Issue Date |
| 7061747 | Stacked capacitor A stacked capacitor includes a dielectric member, a plurality of internal electrodes, and a plurality of extraction electrodes. The dielectric member is a stacked member formed of stacked dielectric layers and having at least one side surface. The internal electrode... | 06/13/2006 |
| 7061746 | Semiconductor component with integrated capacitance structure having a plurality of metallization planes A semiconductor component includes an insulating layer, which is configured on a semiconductor substrate and in which a capacitor structure is formed. The capacitor structure has at least two parallel metallization planes, whereby at least one of the planes is confi... | 06/13/2006 |
| 7057874 | Ferroelectric capacitor A ferroelectric capacitor including a lower electrode, a ferroelectric layer and an upper electrode. A part of at least any one of the lower and upper electrodes is formed of a material selected from the group consisting of TiOx, ... | 06/06/2006 |
| 7057114 | Circuit board with added impedance A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand... | 06/06/2006 |
| 7054137 | Refractory metal nickel electrodes for capacitors A capacitor with conductive layers arranged in parallel relationship. The conductive layers have nickel alloyed with a refractory metal in an amount sufficient to raise the melting temperature of said conductive layer at least 1° C. above the melting temperature of... | 05/30/2006 |
| 7054136 | Controlled ESR low inductance multilayer ceramic capacitor A multilayer ceramic capacitor assembly capable of exhibiting low high-frequency inductance and a controlled equivalent series resistance (ESR) while maintaining a useful capacitance value includes respective pluralities of first and second electrode elements interl... | 05/30/2006 |
| 7054135 | Multilayered structure, multilayered structure array and method of manufacturing the same A multilayered structure array has narrow pitches by making thinner coatings for insulating internal electrode layers from side electrodes and the productivity of the multilayered structure array is improved. The multilayered structure includes: a first internal ele... | 05/30/2006 |
| 7054134 | Stacked capacitor A stacked capacitor includes a dielectric member, a plurality of internal electrodes, and a plurality of extraction electrodes. The dielectric member is a stacked member formed of a plurality of sheet-like stacked dielectric layers and has at least one side surface.... | 05/30/2006 |
| 7053481 | High capacitance package substrate A high capacitance substrate. The substrate includes a core tolerant to sintering thereon of a high k material to provide increased capacitance. The core may be non-ceramic. The material sintered thereon may have a dielectric constant in excess of about 4. The subst... | 05/30/2006 |
| 7053432 | Enhanced surface area capacitor fabrication methods A capacitor fabrication method may include forming a first capacitor electrode over a substrate and atomic layer depositing an insulative barrier layer to oxygen diffusion over the first electrode. A capacitor dielectric layer may be formed over the first electrode ... | 05/30/2006 |
| 7053011 | Laser-based termination of passive electronic components Terminating the ends of passive electronic components entails applying a laser-ablative coating to each of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-ablative coating from m... | 05/30/2006 |
| 7052985 | Contact structure for an integrated semiconductor device A process forms an integrated device having: a first conductive region; a second conductive region; an insulating layer arranged between the first and the second conductive region; at least one through opening extending in the insulating layer between the first and ... | 05/30/2006 |
| 7050291 | Integrated ultracapacitor as energy source An ultracapacitor formed on a semiconductor substrate includes a plurality conductive layers with intervening dielectric layers. These layers form a plurality of capacitors which may be connected in parallel to store a charge for powering an electronic circuit or fo... | 05/23/2006 |
| 7050289 | Multilayer capacitor A multilayer capacitor includes: a dielectric element; a pair of first internal conductors with same polarity disposed in the dielectric element to be adjacent to each other while being separated from each other by the dielectric layer; first leadout portions led ou... | 05/23/2006 |
| 7050288 | Laminated ceramic capacitor Internal electrodes A1 to D1 and A2 to D2 are laid in layers at spaces in the direction of thickness of a ceramic body 1. Lead electrodes a1 to d1 and a2 to d2 are led out to a side face to form lead por... | 05/23/2006 |
| 7046500 | Laminated ceramic capacitor A laminated ceramic capacitor includes a ceramic block formed by laminating a plurality of ceramic sheets, a plurality of external electrodes formed on outer surfaces of the ceramic block facing each other, and set as a positive terminal and a negative terminal, res... | 05/16/2006 |
| 7046501 | Capacitor-embedded substrate A capacitor-embedded substrate for reliably compensating for fluctuation of a power source voltage is provided. A decoupling capacitor is formed between an input side electrode layer and an output side electrode layer via interlayer insulating layers, the decoupling... | 05/16/2006 |
| 7042707 | Multilayer ceramic capacitor A multilayer ceramic capacitor having internal electrode layers and dielectric layers, wherein a thickness of said dielectric layer is 2.0 μm or less, and an average particle number per one dielectric layer obtained by dividing the thickness of said dielectric laye... | 05/09/2006 |
| 7042705 | Sidewall structure and method of fabrication for reducing oxygen diffusion to contact plugs during CW hole reactive ion etch processing The present invention provides a sidewall oxygen diffusion barrier and a method for fabricating the sidewall oxygen diffusion barrier that reduces the diffusion of oxygen into contact plugs during a CW hole reactive ion etch of a ferroelectric capacitor of an FeRAM ... | 05/09/2006 |
| 7038900 | EMI filter terminal assembly with wire bond pads for human implant applications An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical devi... | 05/02/2006 |
| 7035083 | Interdigitated capacitor and method for fabrication thereof A capacitor for use within a microelectronic product employs a first capacitor plate layer that includes a first series of horizontally separated and interconnected tines. A capacitor dielectric layer separates the first capacitor plate layer from a second capacitor... | 04/25/2006 |
| 7035082 | Structure of multi-electrode capacitor and method for manufacturing process of the same A structure and method for manufacturing multi-electrode capacitor within a PCB is used to form a multi-electrode capacitor with a plurality of metal laminates coupled each other and employing the characteristics of the edge-coupled effect therein. the present inven... | 04/25/2006 |
| 7035081 | Semiconductor device The invention eliminates a need to increase a size of a semiconductor device and reduces occurrence of noise. A semiconductor device of the invention includes: a base (5) having front layers (9, 11) provided on respective sides of a core layer (7 | 04/25/2006 |
| 7035079 | Multilayered chip capacitor and multilayer chip capacitor array The present invention provides an MLCC and an MLCC array. The MLCC has desirably low ESL properties by forming the first and second internal electrodes to be spaced apart from each other on the same dielectric layer while overlapping with other first and second inte... | 04/25/2006 |
| 7034391 | Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding packag... | 04/25/2006 |
| 7029962 | Methods for forming a high performance capacitor Embodiments of methods of forming capacitors are generally described herein. Other embodiments may be described and claimed. ... | 04/18/2006 |
| 7027287 | Storage capacitor with high memory capacity and low surface area A storage capacitor includes at least one first electrode adjacent to at least one second electrode, whereby a lateral capacity is formed between these electrodes. The electrodes include stacks of metal parts and connecting contact elements. The second electrodes ca... | 04/11/2006 |
| 7023688 | Laminated ceramic capacitor, mounted structure of laminated ceramic capacitor, and capacitor module In this laminated ceramic capacitor, a heat radiation conductor is provided on a top face of a rectangular parallelepiped laminated chip where a plurality of first conductor layers and a plurality of second conductor layers are arranged alternatively through each ce... | 04/04/2006 |
| 7023687 | High energy density capacitors Capacitors having an inert porous shaped body onto which a first electrically conductive layer, a second layer of barium titanate and a further electrically conductive layer have been applied. ... | 04/04/2006 |
| 7021945 | High speed, high density interconnection device An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material an... | 04/04/2006 |
| 7019957 | Multilayer capacitor Internal dielectric layers isolated between them by a ceramic layer are arranged in a dielectric body, other internal conductor layers also isolated between them by a ceramic layer are arranged in the dielectric body by being isolated from the above internal conduct... | 03/28/2006 |
| 7016175 | Window via capacitor A window via capacitor includes a stacked configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. Alternatively, bottom window and transition layers, a plurality of first and second layers, followed b... | 03/21/2006 |
| 7012501 | Electrical multi-layer component An electrical component includes a base body that contains dielectric layers. The dielectric layers are superimposed and contain ceramic. The component also includes outer contacts on an exterior of the base body, and a resistor in an interior of the base body locat... | 03/14/2006 |
| 7005695 | Integrated circuitry including a capacitor with an amorphous and a crystalline high K capacitor dielectric region The invention comprises integrated circuitry and to methods of forming capacitors. In one implementation, integrated circuitry includes a capacitor having a first capacitor electrode, a second capacitor electrode and a high K capacitor dielectric region received the... | 02/28/2006 |
| 7005381 | Method for flat electrodes The present invention is a method for reducing nanoscale surface roughness. The method involves exposing the surface to an environment that preferentially promotes evaporation of material from the region of nanoscale roughness. The methods involve either heating the... | 02/28/2006 |
| 6999297 | Breakdown-resistant thin film capacitor with interdigitated structure The invention relates to a thin film capacitor with a carrier substrate, at least two interdigitated electrodes, and a dielectric. A staggered arrangement of at least one interdigitated electrode below the dielectric with respect to an interdigitated electrode above... | 02/14/2006 |
| 6999300 | Multilayer capacitor A multilayer capacitor includes: a dielectric element; a plurality of first internal electrodes and a plurality of second internal electrodes alternately arranged in the dielectric element while being separated from each other by dielectric layers; a first outer col... | 02/14/2006 |
| 6999299 | Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board A capacitor structure includes a first electrode provided on an insulating basic member, a dielectric member provided on the electrode, a second electrode provided on the dielectric member, and a plurality of electrode terminals aligned in a grid on the electrode. R... | 02/14/2006 |
| 6998696 | Integrated thin film capacitor/inductor/interconnect system and method A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. ... | 02/14/2006 |
| 6995967 | Stacked capacitor A stacked capacitor includes a dielectric member, a plurality of internal electrodes, a plurality of extraction electrodes, and a plurality of external electrodes. The dielectric member is a stacked member formed of stacked dielectric layers and having a side surfac... | 02/07/2006 |
